Abstract: The present invention discloses a memory system comprising a plurality of crystals, and at least two conductors. The at least two conductors being orthogonal to each other. Wherein at least one of the plurality of crystals are bounded by the orthogonal intersection of the at least two conductors.
Abstract: A new sputter source is disclosed that allows for high rates of deposition at pressures one or two orders of magnitude lower than has previously been obtained. This results in denser films with reduced ion and electron damage to the substrate.
Type:
Application
Filed:
January 16, 2009
Publication date:
July 30, 2009
Applicant:
4D-S Pty. Ltd.
Inventors:
DANIEL BRORS, Dominik Schmidt, Michael Hawran, Dave Correia, Art Shulenberger
Abstract: Systems and methods are disclosed for processing a semiconductor substrate by depositing a conductive layer on the substrate; patterning a set of insulating structures on the substrate; selectively back-biasing the substrate; depositing a layer of material on the substrate; and removing a part of the conductive layer selectively biased to attract cation bombardment.