Patents Assigned to A + Corp.
-
Publication number: 20240170583Abstract: A wide-band gap semiconductor device and a method of manufacturing the same are provided. The wide-band gap semiconductor device of the disclosure includes a substrate, an epitaxial layer, an array of merged PN junction Schottky (MPS) diode, and an edge termination area surrounding the array of MPS diode. The epitaxial layer includes a first plane, a second plane, and trenches between the first plane and the second plane. The array of MPS diode is formed in the first plane of the epitaxial layer. The edge termination area includes a floating ring region having floating rings formed in the second plane of the epitaxial layer, and a transition region between the floating ring region and the array of MPS diode. The transition region includes a PIN diode formed in the plurality of trenches and on the epitaxial layer between the trenches.Type: ApplicationFiled: February 1, 2024Publication date: May 23, 2024Applicant: LEAP Semiconductor Corp.Inventors: Wei-Fan Chen, Kuo-Chi Tsai
-
Publication number: 20240169240Abstract: A fault-tolerant quantum computer using topological codes such as surface codes can have an architecture that reduces the amount of idle volume generated. The architecture can include qubit modules that generate surface code patches for different qubits and a network of interconnections between different qubit modules. The interconnections can include “port” connections that selectably enable coupling of boundaries of surface code patches generated in different qubit modules and/or “quickswap” connections that selectably enable transferring the state of a surface code patch from one qubit module to another. Port and/or quickswap connections can be made between a subset of qubit modules. For instance port connections can connect a given qubit module to other qubit modules within a fixed range. Quickswap connections can provide a log-tree network of direct connections between qubit modules.Type: ApplicationFiled: February 10, 2023Publication date: May 23, 2024Applicant: Psiquantum, Corp.Inventor: Daniel Litinski
-
Publication number: 20240168416Abstract: A rotation device includes a rotator that includes a recessed portion formed on an outer circumferential surface and that rotates in a predetermined rotation direction, a removing unit that comes into contact with a portion of the outer circumferential surface in a range from an upstream end to a downstream end of the recessed portion in the rotation direction due to rotation of the rotator and that removes a foreign substance that adheres to the outer circumferential surface, an application unit that applies an inward load to the removing unit inward in a radial direction of the rotator, and an inclined surface that is located at the removing unit or the upstream end and that comes into contact with the other of the removing unit or the upstream end to move the removing unit entering the recessed portion due to the inward load outward in the radial direction of the rotator along with rotation of the rotator.Type: ApplicationFiled: May 19, 2023Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Hideki KUGE, Yoshiki Shimodaira, Masato Yamashita, Takayuki Ukawa, Yutaka Kiuchi
-
Publication number: 20240170033Abstract: An electronic device includes a first circuit module and a second circuit module, wherein the first circuit module includes a write pointer generation circuit and a write data generation circuit for generating a write pointer and a write data; and the second circuit module includes a storage unit, a read pointer generation circuit and a comparator. The storage unit is used for storing the write data, the read pointer generation circuit is used for generating a read pointer, the comparator compares the write pointer and the read pointer to determine whether to read the write data from the storage unit, the write pointer and the write data are sent to the second circuit module through multiple wires, and a signal propagation time of the multiple wires is greater than one cycle of a clock signal used by the first circuit module.Type: ApplicationFiled: November 1, 2023Publication date: May 23, 2024Applicant: Realtek Semiconductor Corp.Inventor: Jeong-Fa Sheu
-
Publication number: 20240168427Abstract: A transport device includes multiple rotation members that rotate, a cycle member that has a loop shape, and that is wound around the multiple rotation members to cycle together with rotation of the rotation members, at least one holding member that is attached to the cycle member, that cycles together with the cycle member, and that holds a leading end portion of a recording medium while being spaced apart from each other in a width direction when the leading end portion arrives at a holding position, and a deformation member that deforms the leading end portion in a thickness direction throughout the width direction by time when the leading end portion arrives at the holding position.Type: ApplicationFiled: May 19, 2023Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Hideki KUGE, Yoshiki Shimodaira, Masato Yamashita, Takayuki Ukawa, Kazuhiko Arai, Yutaka Kiuchi, Yasutaka Gotoh
-
Publication number: 20240168731Abstract: A fault-tolerant quantum computer using topological codes such as surface codes can have an architecture that reduces the amount of idle volume generated. The architecture can include qubit modules that generate surface code patches for different qubits and a network of interconnections between different qubit modules. The interconnections can include “port” connections that selectably enable coupling of boundaries of surface code patches generated in different qubit modules and/or “quickswap” connections that selectably enable transferring the state of a surface code patch from one qubit module to another. Port and/or quickswap connections can be made between a subset of qubit modules. For instance port connections can connect a given qubit module to other qubit modules within a fixed range. Quickswap connections can provide a log-tree network of direct connections between qubit modules.Type: ApplicationFiled: February 10, 2023Publication date: May 23, 2024Applicant: Psiquantum, Corp.Inventor: Daniel Litinski
-
Publication number: 20240168426Abstract: A transport unit includes a transport device including a loop member that turns and that has no ends, the transport device transporting a recording medium with the recording medium attracted to a surface of the loop member; a guide unit that changes a transport direction of the recording medium fed from the transport device and that guides the recording medium in one of multiple transport directions; and a controller that controls the transport device, based on the transport direction that is changed by the guide unit such that attraction force of the transport device is changed.Type: ApplicationFiled: May 31, 2023Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Yoshiki SHIMODAIRA, Hideki KUGE, Takayuki UKAWA, Masato YAMASHITA
-
Publication number: 20240171694Abstract: An image reading apparatus includes: a transport unit that transports a sheet including an image; and a reading unit that includes a mirror plate of which both end portions in a longitudinal direction are held, reflects reflected light, which is obtained by illuminating the sheet transported by the transport unit with light, by a reflecting surface of the mirror plate, and reads the image, in which a vibration-resistant member, which imparts vibration resistance, is disposed on a part of some surfaces of the mirror plate other than the reflecting surface not to protrude from the reflecting surface.Type: ApplicationFiled: May 28, 2023Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventor: Tadashi SUGIZAKI
-
Publication number: 20240168424Abstract: An image forming apparatus includes: multiple intermediate-transfer-member density sensors that are disposed in the axial direction of an intermediate transfer member and that detect corresponding densities of a developer image having been subjected to first transfer onto the intermediate transfer member; and a processor configured to: in response to occurrence of a variation of density on a recording medium, if a relationship between the highest density value and the lowest density value among the density values detected by the respective intermediate-transfer-member density sensors indicates a first density state, output information indicating that the variation of density is caused in a process of or after a second-transfer process in which the developer image having been subjected to first transfer onto the intermediate transfer member is transferred onto the recording medium; and if the relationship indicates a second density state opposite to the first density state, output information indicating that tType: ApplicationFiled: May 22, 2023Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Daisuke NAKAI, Yutaka KIUCHI, Tomohisa SUZUKI
-
Publication number: 20240169178Abstract: A radio frequency identification (RFID) tag including a face stock layer, an antenna inlay beneath the face stock layer and comprising a radio frequency (RF) antenna and an integrated circuit (IC) chip, a spacer layer beneath the antenna inlay, and a metal ground plane. The antenna inlay may include a near-field communication (NFC) or high frequency (HF) antenna, and optionally may include an ultra-high frequency (UHF) antenna. The spacer may be made of a flexible polypropylene, and the metal ground plane may be made of aluminum.Type: ApplicationFiled: November 16, 2023Publication date: May 23, 2024Applicant: HID Global Corp.Inventors: Badredin Mohamed Turki, Charles Vilner
-
Publication number: 20240169239Abstract: A fault-tolerant quantum computer using topological codes such as surface codes can have an architecture that reduces the amount of idle volume generated. The architecture can include qubit modules that generate surface code patches for different qubits and a network of interconnections between different qubit modules. The interconnections can include “port” connections that selectably enable coupling of boundaries of surface code patches generated in different qubit modules and/or “quickswap” connections that selectably enable transferring the state of a surface code patch from one qubit module to another. Port and/or quickswap connections can be made between a subset of qubit modules. For instance port connections can connect a given qubit module to other qubit modules within a fixed range. Quickswap connections can provide a log-tree network of direct connections between qubit modules.Type: ApplicationFiled: February 10, 2023Publication date: May 23, 2024Applicant: Psiquantum, Corp.Inventor: Daniel Litinski
-
Publication number: 20240171269Abstract: A wireless communication method includes: a first device reports first information to a second device, the first information being applied to backscatter communication.Type: ApplicationFiled: January 29, 2024Publication date: May 23, 2024Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventors: Weijie XU, Zhisong ZUO, Chuanfeng HE, Shuai SHAO, Shengjiang CUI, Rongyi HU, Zhi ZHANG
-
Publication number: 20240170332Abstract: A wafer with a test structure includes a wafer with a front side and a back side. A first die, a second die, a third die and a scribe line are disposed on the wafer. The scribe line is positioned between the dice. The first die includes a first dielectric layer and a first metal connection disposed within and on the first dielectric layer. A test structure and a dielectric layer are disposed on the scribe line, wherein the test structure is on the dielectric layer. Two first trenches are respectively disposed between the first dielectric layer and the dielectric layer and disposed at one side of the dielectric layer. Two second trenches penetrate the wafer, and each of the two second trenches respectively connects to a corresponding one of the two first trenches. A grinding tape covers the front side of the wafer and contacts the test structure.Type: ApplicationFiled: January 24, 2024Publication date: May 23, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Wei-Ren Huang, Chen-Hsiao Wang, Kai-Kuang Ho
-
Publication number: 20240171122Abstract: A solar panel installation includes a plurality of bifacial solar panels and a plurality of reflective panels separated from and opposing a back side of the bifacial panels to reflect sunlight onto the back side of the panels. Each of the reflective panels may include a plurality of projections to improve the reflectivity onto the back side of the bifacial solar panels.Type: ApplicationFiled: November 23, 2021Publication date: May 23, 2024Applicant: Gamechange Solar Corp.Inventors: Andrew Barron Worden, Scott Van Pelt, Woo Kim
-
Publication number: 20240168221Abstract: Apparatuses having a plurality of optical duplex and parallel connector adapters, such as MPO connectors and LC adapters, where some adapters connect to network equipment in a network and others to servers or processing units such as GPUs, incorporate internal photonic circuit with a mesh. The light path of each transmitter and receivers is matched in order to provide proper optical connections from transmitting to receiving fibers, wherein complex arbitrary network topologies can be implemented.Type: ApplicationFiled: November 17, 2022Publication date: May 23, 2024Applicant: Panduit Corp.Inventors: Jose M. Castro, Richard J. Pimpinella, Bulent Kose, Yu Huang, Ronald A. Nordin, Robert A. Reid
-
Publication number: 20240170490Abstract: A semiconductor structure includes a semiconductor on insulator (SOI) substrate, a first electrically conductive structure, and a second electrically conductive structure. The SOI substrate includes a base substrate, a buried insulation layer disposed on the base substrate, a semiconductor layer disposed on the buried insulation layer, and a trap rich layer disposed between the buried insulation layer and the base substrate. At least a part of the first electrically conductive structure and at least a part of the second electrically conductive structure are disposed in the trap rich layer. A part of the trap rich layer is disposed between the first electrically conductive structure and the second electrically conductive structure. The first electrically conductive structure, the second electrically conductive structure, and the trap rich layer disposed between the first electrically conductive structure and the second electrically conductive structure are at least a portion of an anti-fuse structure.Type: ApplicationFiled: January 29, 2024Publication date: May 23, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: BO TAO, Li Wang, Ching-Yang Wen, Purakh Raj Verma, Zhibiao Zhou, Dong Yin, Gang Ren, Jian Xie
-
Publication number: 20240168980Abstract: A reception work support system includes: one or plural processors configured to: acquire a reception content in reception work of receiving an inquiry; predict a work result based on the reception content, and extract a keyword used for predicting the work result; and emphasize and output the keyword in the reception content, or output the keyword separately from the reception content.Type: ApplicationFiled: June 1, 2023Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Shuhei Kobayakawa, Daichi Hayashi, Shoko Chiba
-
Publication number: 20240171663Abstract: A foldable electronic device is provided and includes a central base, a torque module, two wing members, two transmission members, two panel bodies, a synchronous module and a flexible screen. The torque module is disposed on the central base, the wing members pivot relative to the central base, the transmission members are pivotally connected to the torque module and the central base, the panel bodies pivot relative to the wing members and linearly slide relative to the transmission members, the synchronous module drives the transmission members to reverse synchronously, and the flexible screen is arranged on the panel bodies and the wing members and includes a bendable area. The flexible screen is flattened when the panel bodies are in an unfolded state, and the bendable area bends when the panel bodies are in a folded state.Type: ApplicationFiled: May 9, 2023Publication date: May 23, 2024Applicant: SYNCMOLD ENTERPRISE CORP.Inventors: Ching-Hui YEN, Chien-Cheng YEH, Chun-Hao HUANG
-
Publication number: 20240171687Abstract: An information processing apparatus includes a processor configured to: acquire a read image resulting from reading a recording medium where a diagnostic image to be used to diagnose an image forming apparatus is formed; acquire, from the read image, an image read portion of the recording medium from which the diagnostic image is read and one specific portion of a non-formation read portion, the non-formation read portion resulting from reading a non-formation portion of the recording medium where the diagnostic image is not formed; and output the image read portion and the one specific portion.Type: ApplicationFiled: January 26, 2024Publication date: May 23, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Yuki TANAKA, Shinya MIYAMORI, Masashi MORIMOTO, Shinsuke SUGI, Kyotaro TOMODA, Tomokazu SUGATA
-
Publication number: 20240171134Abstract: A feedback circuit coupled between an input terminal and an output terminal of an amplifier circuit includes an input terminal, an output terminal, a first set of transistors and a second set of transistors. The first set of transistors is coupled between the input terminal and the output terminal of the feedback circuit, and includes a first terminal, a second terminal, and a control terminal used to receive a first control signal to turn on or off the first set of transistors. The second set of transistors is coupled between the input terminal and the output terminal of the feedback circuit, and includes a first terminal, a second terminal, and a control terminal used to receive a second control signal to turn on or off the second set of transistors.Type: ApplicationFiled: December 20, 2022Publication date: May 23, 2024Applicant: RichWave Technology Corp.Inventors: Hang Chang, Chih-Sheng Chen