Abstract: A torsion bar clamp device and method for mounting a heat sink to an electronic component comprising a torsion bar having a longitudinally extending bar and at least one integral lever adapted to engage a heat sink and mounting legs which couple forces imparted by the torsion bar to the heat sink and electronic component such that the heat sink and electronic component are compressively coupled. The invention may be manufactured of injection molded plastic and may be adapted to allow the mounting legs to engage bosses on a socket in which an electronic component is mounted.

Abstract: A spring clamp device providing a compressive stress to a stack of components includes a spring member and a bracket having attachment structure for engaging mating structure near the bottom of the stack. The bracket is first engaged with the mating structure such that it straddles the stack. The spring member is then latched to the bracket under tension in an assembled configuration, thereby applying an upward reaction on the mating structure with the attachment structure of the bracket and applying a downward reaction force to the top of the stack with the spring member. The oppositely directed forces apply a compressive stress to the stack, which improves thermal contact between the components.

Abstract: A thermal management system having an enclosure comprising a pair of enclosure regions disposed on opposite surfaces of a flexible thermally conductive sheet. The enclosure regions are coupled together through an aperture provided in the sheet. A liquid transporting material is disposed within the enclosure and passes between the enclosure regions through the aperture. A liquid is disposed on the liquid transporting material. One end portion of the thermally conductive sheet is adapted for thermal coupling to a heat source and the opposite end portion is adapted for thermal coupling to a heat sink. Heat emanating from the heat source passes though the thermally conductive sheet to the liquid to convert the liquid to a vapor. The vapor passes within, and through, the enclosure regions for transportation to the end of the liquid transporting material disposed adjacent the heat sink coupling end of the thermally conductive material.

Abstract: A heat sink assembly made up of a heat sink, an electrical component adapted for mounting to a region of a printed circuit board mounted and, a clip. The clip includes a planar horizontal section, a pair of vertically extending legs disposed along folds formed at opposing ends of the horizontal section and, an engaging section disposed along an edge of the horizontal section and positioned intermediate the opposing ends of the horizontal section. The engaging section is adapted engage the heat sink and force the heat sink against the printed circuit board mounted electrical component as the legs of the clip engage the printed circuit board through holes formed in the printed circuit board on opposing sides of the component mounting region of the printed circuit board. A pair of gussets, is disposed at the folds formed at the opposing ends of the horizontal section. The gussets are provided to "lock in" the bend between the legs and the horizontal section at 90 degrees.

Abstract: A connector for attaching a heat sink or other device to a circuit board comprising an attachment portion for connecting to the device, the attachment portion having a pair of legs, each with a projection on its end, the legs being spring-biased so that once the projections pass through the hole, the projections expand and engage the surface of the board or edges of the holes opposite the device.

Abstract: A device for attaching a heat sink to an electronic package comprises a pin having a compressible point, the point being adapted to pass through aligned holes in a heat sink and a printed circuit board so that the point compresses as it passes into two holes and flexes back to an expanded position after it exits the printed circuit board hole opposite the heat sink thereby holding the heat sink to the board with the electronic package therebetween.

Abstract: A heat sink in adapted to be attached to a pin grid array comprising a pair of grooves extending along opposite sides into which grooves the tops of attachment clips are disposed. The heat sink has a pair of indentations on opposite sides of each clip holds each clip in place in the groove, the heat sink with the clips attached being positioned between two compression sections of a pair of attachment pliers and when a pin grid array is positioned adjacent to the heat sink, compression of the plier handles connects the clips to the pin grid array. Removal is accomplished by a pair of pliers having projecting points which fit beneath the clips so that compression of the plier handles forces the clip away from the pin grid array disconnecting it.

Abstract: A heat sink comprising a thin plate made of a heat conducting material, which plate includes a series of small tapered chimneys extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board, thermally connecting with the semiconductors on the board, the chimneys being spaced inbetween the semiconductors and facilitating natural or forced airflow from the area between the plate and the printed circuit board to the area outside by means of the low pressure drop created by their tapering, the heat sink taking very little vertical space in the electronics package including the printed circuit board while providing effective heat dissipation and shielding from electro-magnetic radiation and/or radio frequency interference for the semiconductors on the board.

Abstract: A clip for attaching a semiconductor to a heat sink comprises an arcuate section having a lip which contacts a projection on a heat sink so that the remainder of the arcuate section is disposed over the projection, the arcuate section also having a central stiffening rib. The clip further comprises a plate extending from the end of the arcuate section opposite its lip, the plate having sidewalls which form a semiconductor opening. When the clip is in place on the heat sink, the clip is flexed, and the plate is forced against a semiconductor, holding it in place against the heat sink.

Abstract: A resilient spring clip for attaching a semiconductor to a heat sink comprising a first surface having a first edge with a first leg projecting from a central portion of the first edge, and a second edge, parallel to the first edge and spaced apart therefrom with second and third legs projecting from the second edge, the legs being offset from each other and having heels on their ends opposite the first surface so that by flexing the legs inwardly, the heels can fit completely through slots on a heat sink, the clip being held in place when the legs unflex so that the heels engage the heat sink and cannot pass through the slots.