Heat-sink cover for leadless electronic chip-carrier sockets
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Description
FIG. 1 is a perspective view of a heat sink cover for leadless electronic chip carrier sockets showing my new design;
FIG. 2 is a side elevational view thereof as seen from the left of FIG. 1, the opposite side being a mirror image;
FIG. 3 is a side elevational view thereof as seen from the right of FIG. 1, the opposite side being a mirror image;
FIG. 4 is a top plan view thereof; and
FIG. 5 is a bottom plan view thereof.
Referenced Cited
Patent History
Patent number: D303951
Type: Grant
Filed: Mar 27, 1986
Date of Patent: Oct 10, 1989
Assignee: Aavid Engineering, Inc. (Laconia, NH)
Inventor: Alfred F. McCarthy (Belmont, NH)
Primary Examiner: Susan J. Lucas
Application Number: 6/847,020
Type: Grant
Filed: Mar 27, 1986
Date of Patent: Oct 10, 1989
Assignee: Aavid Engineering, Inc. (Laconia, NH)
Inventor: Alfred F. McCarthy (Belmont, NH)
Primary Examiner: Susan J. Lucas
Application Number: 6/847,020
Classifications
Current U.S. Class:
D13/23
