Patents Assigned to ACACIA COMMUNICATIONS INC.
  • Patent number: 11398840
    Abstract: A method, system, and apparatus for interleaving data including creating a buffer, writing input data, and reading output data out of the buffer.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: July 26, 2022
    Assignee: Acacia Communications, Inc.
    Inventor: Pierre Humblet
  • Patent number: 11394490
    Abstract: A method, system, and ASIC chip for comparing a bit error rate (BER) to a forward error correction (FEC) threshold to determine a Q margin for a codeblock; wherein the BER corresponds to the number of errors in a given amount of data; where a codeblock of a FEC corresponds to the given amount of data; wherein the FEC threshold corresponds to the maximum amount of errors per codeblock that the FEC is able to remove per given amount of data; wherein the Q margin corresponds to a difference between the BER and the FEC threshold.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 19, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Yue Pan, Jonas Geyer
  • Patent number: 11387626
    Abstract: A tunable laser that includes an array of parallel optical amplifiers is described. The laser may also include an intracavity N×M coupler that couples power between a cavity mirror and the array of parallel optical amplifiers. Phase adjusters in optical paths between the N×M coupler and the optical amplifiers can be used to adjust an amount of power output from M?1 ports of the N×M coupler. A tunable wavelength filter is incorporated in the laser cavity to select a lasing wavelength.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: July 12, 2022
    Assignee: Acacia Communications, Inc.
    Inventor: Christopher Doerr
  • Patent number: 11360278
    Abstract: A photonic integrated circuit may be coupled to an optical fiber and packaged. The optical fiber may be supported by a fiber holder during a solder reflow process performed to mount the packaged photonic integrated circuit to a circuit board or other substrate. The optical fiber may be decoupled from the fiber holder, and the fiber holder removed, after completion of the solder reflow process.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: June 14, 2022
    Assignee: Acacia Communications, Inc.
    Inventor: Christopher Doerr
  • Patent number: 11362735
    Abstract: Disclosed herein are techniques, methods, structures and apparatus that provide a silicon photonics multicarrier optical transceiver wherein both the transmitter and receiver are integrated on a single silicon chip and which generates a plurality of carriers through the effect of an on-chip modulator, amplifies the optical power of the carriers through the effect of an off-chip amplifier, and generates M orthogonal sets of carriers through the effect of an on-chip basis former.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: June 14, 2022
    Assignee: Acacia Communications, Inc.
    Inventor: Christopher Doerr
  • Patent number: 11353666
    Abstract: An integrated wavelength division multiplexer is described. The integrated wavelength division multiplexer may include a first waveguide core defining a first propagation axis and configured to guide light of a first wavelength and light of a second wavelength, and a second waveguide core defining a second propagation axis and configured to guide the light of the second wavelength. A first portion of the second propagation axis for which the first waveguide core and second waveguide core may be overlapping is oriented at a non-zero angle relative to the first propagation axis. The first waveguide core and second waveguide core may be configured relative to each other to adiabatically couple the light of the second wavelength between the first and second waveguide cores.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: June 7, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Long Chen, Christopher Doerr, Li Chen
  • Publication number: 20220116114
    Abstract: A method, system and apparatus for optimizing parameters between two optical coherent transceivers connected via an optical link, including determining performance of a second optical receiver; wherein the second optical transceiver uses a set of parameters; and inputting information into a side channel communication between a first optical transceiver and the second optical transceiver to update the set of parameters for the second transceiver.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Applicant: Acacia Communications, Inc.
    Inventors: Jonas Geyer, Timo Pfau
  • Patent number: 11296795
    Abstract: In a first embodiment, a method and apparatus for encoding a first spectral efficiency into a second spectral efficiency; wherein the second spectral efficiency has a higher order than the first spectral efficiency. In a second embodiment, a method and apparatus for achieving at least two spectral efficiencies using a single type of modulation.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: April 5, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Mehmet Aydinlik, Jonas Geyer, Christian Rasmussen
  • Patent number: 11294061
    Abstract: An apparatus for scanning a scene comprising a light transmitter including a one-dimensional phased array; wherein the light transmitter is fed by a frequency swept scanning laser; and a light receiver including a one-dimensional phased array; the one-dimensional phased array of the light receiver disposed orthogonally to the one-dimensional phased array of the transmitter; wherein light received by the light receiver is enabled to be interfered with light from the frequency swept scanning laser.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: April 5, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Christopher Doerr, Long Chen
  • Patent number: 11287676
    Abstract: In an embodiment, a method and apparatus for increasing bandwidth of an optical modulator by applying a first voltage applied to a beginning of a resistive line and applying a second voltage applied to an end of the resistive line; wherein the first voltage is less than the second voltage.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: March 29, 2022
    Assignee: Acacia Communications, Inc.
    Inventor: Christopher Doerr
  • Publication number: 20220069535
    Abstract: A system including an erbium doped fiber amplifier (EDFA), comprising a length of erbium doped fiber having a first end and a second end, an isolator wavelength division multiplexer (IWDM) comprising an output optically connected at an optical connection with the first end of the erbium doped fiber, wherein the optical connection with the first end of the erbium doped fiber is continuous between the IWDM and the first end of the erbium doped fiber, and an isolator comprising an input optically connected at an optical connection with the second end of the erbium doped fiber.
    Type: Application
    Filed: February 26, 2021
    Publication date: March 3, 2022
    Applicant: Acacia Communications, Inc.
    Inventor: Colm V. Cryan
  • Patent number: 11265084
    Abstract: A method, system, and apparatus enabled to selectively choose a baud rate for communication of optical data using a modem enabled to operate with an optical signal modulated at plurality of finely tuned baud rates.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: March 1, 2022
    Assignee: Acacia Communications, Inc.
    Inventor: Jonas Geyer
  • Publication number: 20220052763
    Abstract: Aspects of the present disclosure are directed to a photonic integrated circuit (PIC) having a resistivity-engineered substrate to suppress radio-frequency (RF) common-mode signals. In some embodiments, a semiconductor substrate is provided that comprises two portions having different levels of resistivity to provide both suppression of common mode signals, and reduction of RF absorption loss for non-common mode RF signals. In such embodiments, a bottom portion of the semiconductor substrate has a low resistivity to suppress common mode via RF absorption, while a top portion of the semiconductor substrate that is adjacent to conductors in the IC has a high resistivity to reduce RF loss.
    Type: Application
    Filed: August 17, 2020
    Publication date: February 17, 2022
    Applicant: Acacia Communications, Inc.
    Inventors: Long Chen, Leonard Jan-Peter Ketelsen
  • Patent number: 11239919
    Abstract: A method, system and apparatus for optimizing parameters between two optical coherent transceivers connected via an optical link, including determining performance of a second optical receiver; wherein the second optical transceiver uses a set of parameters; and inputting information into a side channel communication between a first optical transceiver and the second optical transceiver to update the set of parameters for the second transceiver.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: February 1, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Jonas Geyer, Timo Pfau
  • Publication number: 20220026747
    Abstract: Methods of fabricating electro-optical modulators and the resulting electro-optical modulators are described herein. In some embodiments, a method comprises defining a waveguide having a core region, implanting dopants into a contact region of the waveguide, and diffusing the dopants laterally toward the core region. In some embodiments, a method comprises implanting n-type and p-type dopants into respective first and second contact regions of the optical waveguide and annealing the optical waveguide to induce lateral diffusion of the n-type and p-type dopants toward a center of the optical waveguide. In some embodiments, an electro-optical modulator comprises a waveguide comprising a contact region and a core region, and the waveguide has a dopant concentration that decreases from the contact region to the core region according to a super-linear curve. Methods and resulting structures described herein provide desirable electrical resistance and low overlap between dopants and optical signals.
    Type: Application
    Filed: July 23, 2020
    Publication date: January 27, 2022
    Applicant: Acacia Communications, Inc.
    Inventor: Long Chen
  • Publication number: 20220020893
    Abstract: In part, in one aspect, the disclosure relates to a system including a photonic integrated circuit (PIC) assembly, comprising a PIC comprising: a first bond pad disposed inward from an edge of the PIC a first distance; and a first wire having a first length, the first wire electrically connected to the first bond pad and extending therefrom, wherein the first distance is greater than 0.4 mm.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 20, 2022
    Applicant: Acacia Communications, Inc.
    Inventor: John Heanue
  • Patent number: 11228373
    Abstract: A system, apparatus, and method for an optical grooming network; wherein a set of switches form an optical grooming interconnection system where each switch is communicatively coupled to each other switch; a set of clients; where each switch of the set of switches is communicatively coupled to a client of the clients; wherein each client receiver is enabled to communicate through the set of switches to any client or modem; and a set of coherent optical modems; wherein each coherent optical modem is communicatively coupled to a switch of the set of switches; wherein each client of the clients is able to communicate through the set of switches to every coherent optical modem of the set of coherent optical modems, and each coherent optical modem in the set of coherent optical modems can communicate to every coherent optical modem of the set of coherent optical modems.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: January 18, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Jon Stahl, James Duda
  • Publication number: 20220011507
    Abstract: In part, in one aspect, the disclosure relates to a method for passivating a waveguide of an optical circuit. The method includes etching a suspended waveguide in the optical circuit; the suspended waveguide having a top surface, a bottom surface, and side surfaces; and covering the top surface and side surfaces of the suspended waveguide with a passivation coating having a thickness that ranges from between about 10 nm to about 20 nm. In one embodiment, the method further includes removing one or more coatings from a portion of the optical circuit. The disclosure also relates to various passivated optical silicon circuit embodiments.
    Type: Application
    Filed: July 12, 2021
    Publication date: January 13, 2022
    Applicant: Acacia Communications, Inc.
    Inventors: Li Chen, Long Chen, Christopher Doerr
  • Patent number: 11221447
    Abstract: Cantilevered waveguides suspended above an air cavity in an underlying substrate are described. The waveguide is formed by patterning a waveguide layer in some embodiments, and the air cavity is formed by etching the substrate beneath the waveguide. The topside of the air cavity may be sealed by filling the openings used to etch the cavity with a sealant, such as optical epoxy. In some embodiments, the waveguide is a facet coupler, positioned at a chip facet.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: January 11, 2022
    Assignee: Acacia Communications, Inc.
    Inventors: Long Chen, Christopher Doerr, Li Chen
  • Patent number: 11190216
    Abstract: A method, apparatus, and system for deinterleaving data.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 30, 2021
    Assignee: Acacia Communications, Inc.
    Inventor: Pierre Humblet