Abstract: A substrate housing container (1) includes (i) a container body (10) having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which substrates (W) are stacked, the mount element 12 facing the opening (11), and (ii) a cover (20) to cover the opening (11), wherein the cover (20) includes a lid portion (21) to cover the opening (11) and at least two holding members (22) disposed on the lid portion (21), the holding members (22) being configured to swing in a central direction of the lid portion (21) and to press outer sides of the substrates (W) accommodated in the container body (10) with the substrates (W) stacked, the container body (10) has guide grooves (13) to make tips (22a) of the holding members (22) move from an outer side of the mount element (12) to an inner sides of the mount element (12) to guide the tips (22a) of the holding members (22) to positions at which the holding members (22) press the outer sides of the substrates (W), and the guid

Abstract: Described herein are wafer accommodation containers. A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20).

Abstract: A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.

Abstract: Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.

Abstract: A ring spacer interposed between plate-shaped objects above and below in a container for storing and transporting the plate-shaped objects when a plurality of plate-shaped objects is stored in an up-and-down direction includes a ring-shaped abutment portion and a control portion. An upper face and a lower face in the abutment portion have an approximately flat shape and the upper face in the abutment portion abuts against a lower face of a peripheral edge portion of the plate-shaped object. The lower face in the abutment portion abuts against an upper face of the peripheral edge portion of the plate-shaped object. The control portion includes a control portion upper face positioned to protrude further upward than the support face of the abutment portion and a control portion lower face positioned at an appropriate location in a thickness direction of the abutment portion.

Abstract: A rigid polyurethane foam which has ultrafine cells, has a low thermal conductivity of 0.0190 W/(m·K) or lower, exhibits excellent heat insulating properties and flame retardancy, and has very little impact on global warming, without using a special apparatus such as a gas loading device. Provided is a rigid polyurethane foam which is obtained by mixing and reacting raw materials including a polyol, a polyisocyanate, a blowing agent, and a catalyst. The rigid polyurethane foam contains the polyol containing a polyester polyol having an aromatic component concentration of 17-35 wt. %, and a non-amine-based polyether polyol and/or an aromatic amine-based polyether polyol; the polyisocyanate in which MDI/TDI are mixed at a ratio of 4/6 to 9/1; and the blowing agent containing a halogenated olefin.

Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

Abstract: A rigid polyurethane foam which has ultrafine cells, has a low thermal conductivity of 0.0190 W/(m·K) or lower, exhibits excellent heat insulating properties and flame retardancy, and has very little impact on global warming, without using a special apparatus such as a gas loading device. Provided is a rigid polyurethane foam which is obtained by mixing and reacting raw materials including a polyol, a polyisocyanate, a blowing agent, and a catalyst. The rigid polyurethane foam contains the polyol containing a polyester polyol having an aromatic component concentration of 17-35 wt. %, and a non-amine-based polyether polyol and/or an aromatic amine-based polyether polyol; the polyisocyanate in which MDI/TDI are mixed at a ratio of 4/6 to 9/1; and the blowing agent containing a halogenated olefin.

Abstract: A tray for storing a wafer with a tape frame in a storage container includes a ring-shaped frame, a dicing tape and a semiconductor wafer. The dicing tape is stuck on the rear surface of the ring-shaped frame, and the semiconductor wafer is supported on the dicing tape. The tray has a substantially circular shape and is positioned on the upper side and the lower side of the wafer with tape frame. The front surface of the tray has a flat portion for mounting the wafer, and at least a portion of the outer peripheral portion of the front surface of the tray includes a convex portion. A projecting portion is formed on the rear surface so that the projection portion is positioned outside the outer periphery of the semiconductor wafer of the wafer with the tape frame when the tray is positioned on the wafer with tape frame.

Abstract: A dark color, resin sheet-like body having light reflective properties in a near-infrared region, the body comprising a surface layer (A) receiving solar radiation and a reflection layer (B). Surface layer (A) exhibits a dark color with a solar radiation absorption ratio of 90% or more in a wavelength region of 380 to 720 nm, a ratio of less than 30% in a near-infrared region of 720 to 1500 nm, and ratio of 50% or more in a near-infrared region of 720 to 1500 nm. Reflection layer (B) has a solar radiation reflection ratio of 85% or more in a wavelength region of 380 to 1500 nm. A ratio in a near-infrared region of 720 to 1500 nm of a sheet-like body formed by laminating surface layer (A) and reflection layer (B) is 70% or more.

Abstract: A soft resinous sheet article having both flexibility and heat-stable, is prepared from a composition containing a matrix and a filler (C) comprising at least one of a metal carbonate and a metal hydroxide, having an average particle diameter of 0.5 to 30 ?m and showing a decomposition temperature of 250° C. or higher, the matrix containing an acrylic copolymer (A) containing at least one carboxyl group as a functional group and having a molecular weight of 800 to 20000 and an acid value (AV) of 20 to 150; and a compound (B) containing two or more glycidyl groups in its molecule and having a weight per epoxide of 80 to 400. This article is used to for example thermal interface materials, thermal conductive sheet, thermally conductive polymer, heat conductive sheet, heat dissipative sheet and heat transfer material.

Abstract: A wafer protective sheet 1 is made of a synthetic resin sheet with a thickness of 80 to 130 ?m having a large number of projected parts and recessed parts on its front and rear surfaces. The large number of projected parts and the large number of recessed parts are respectively disposed so that each part is positioned at intersections of lattice stripes, and the projected part and the recessed part are disposed alternately each other. The sheet has such a water-like cross section that the recessed parts in the rear surface match the projected parts on the front surface and the projected parts on the rear surface match the recessed parts in the front surface. The wafer protective sheet 1 has a bending resistance of 30 to 80 mm. The wafer protective sheet 1 of the present invention is sufficiently thin. When the wafer protective sheets are interposed between stacked wafers to protect them, the sheets do not adhere to the wafers.

Abstract: A dark color, resin sheet-like body having light reflective properties in a near-infrared region, the body comprising a surface layer (A) receiving solar radiation and a reflection layer (B). Surface layer (A) exhibits a dark color with a solar radiation absorption ratio of 90% or more in a wavelength region of 380 to 720 nm, a ratio of less than 30% in a near-infrared region of 720 to 1500 nm, and ratio of 50% or more in a near-infrared region of 720 to 1500 nm. Reflection layer (B) has a solar radiation reflection ratio of 85% or more in a wavelength region of 380 to 1500 nm. A ratio in a near-infrared region of 720 to 1500 nm of a sheet-like body formed by laminating surface layer (A) and reflection layer (B) is 70% or more.

Abstract: There is provided a heat shielding transparent sheet which transmits visual light but cuts infrared light and is remarkably resistant to climate and thermal deterioration even in an environment of outdoor use, the sheet comprising a synthetic resin with 0.4 to 2.7 g/m2 of Tungsten Oxide particles and having visible light transmittance of 70% or more and sunlight transmittance of 65% or less, respectively.

Abstract: A color sheet having a light-shielding effect comprises at least a reflecting layer and a color layer overcoated on the side of the color sheet where the color sheet is exposed to light from the reflecting layer. The reflecting layer a solar-radiation reflectance of 60% or more in a wavelength range of 780 nm to 1350 nm, and the color layer has a light transmittance of 30% or more in a wavelength range of 780 nm to 1350 nm and a solar-radiation absorbance of 10 to 80% in a wavelength range of 380 nm to 780 nm.

Abstract: The present invention relates to a preparation method for low-density polyurethane foam excelling in the flame retardance and the dimensional stability, wherein rigid polyurethane foam having the average value for the ratio of lengthwise direction diameter/cross direction diameter of cells being 1.0 to 1.4 and the density of 20 to 40 kg/m3 is prepared by combining, as blowing agent, carbon dioxide generated in the reaction between water and polyisocyanate and carbon dioxide under supercritical state, subcritical state or liquid state, and by adding said water and said carbon dioxide under liquid state into said polyol component prior to mixing the polyisocyanate component and the polyol component, and to rigid polyurethane foam obtained by said method.

Abstract: A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side.

Abstract: A color sheet having a light-shielding effect comprises at least a reflecting layer and a color layer overcoated on the side of the color sheet where the color sheet is exposed to light from the reflecting layer. The reflecting layer a solar-radiation reflectance of 60% or more in a wavelength range of 780 nm to 1350 nm, and the color layer has a light transmittance of 30% or more in a wavelength range of 780 nm to 1350 nm and a solar-radiation absorbance of 10 to 80% in a wavelength range of 380 nm to 780 nm.

Abstract: The present invention relates to a preparation method for low-density polyurethane foam excelling in the flame retardance and the dimensional stability, wherein rigid polyurethane foam having the average value for the ratio of lengthwise direction diameter/cross direction diameter of cells being 1.0 to 1.4 and the density of 20 to 40 kg/m3 is prepared by combining, as blowing agent, carbon dioxide generated in the reaction between water and polyisocyanate and carbon dioxide under supercritical state, subcritical state or liquid state, and by adding said water and said carbon dioxide under liquid state into said polyol component prior to mixing the polyisocyanate component and the polyol component, and to rigid polyurethane foam obtained by said method.

Abstract: A flexible printed circuit board of the present invention directly relays connecting portions of a magnetic head placed on a suspension to connecting portions of a base end of a carriage arm in a head suspension assembly of a magnetic disk apparatus. The flexible printed circuit board includes a laminate composed of at least a base layer, a plurality of conductive circuits formed on the base layer, a cover layer covering the conductive circuits, and a conductive polymer layer formed in the insulating material portion in the surface of the laminate. The flexible printed circuit board includes a stainless layer below the base layer or on a lower side of the conductive polymer layer on the base layer side.