Abstract: Disclosed is a heat sink used for telecommunication equipment, a high power amplifier or a CPU of a computer in order to emit heat having a high temperature to an exterior for properly maintaining operational characteristics of equipment. Instead of fabricating the heat sink through an extruding process by using a mold, in which molten metal is extruded from the mold by applying high pressure to the mold, fins are separately fabricated so as to obtain a maximum surface area per a unit area of the heat sink, thereby allowing the heat sink to emit a great amount of heat. The mold used for fabricating the fins of the heat sink has narrow and elongated slots, so manufacturing costs and a manufacturing period for the mold are increased. The mold is also easily broken and eroded. To solve the above problem, the disclosed heat sink includes a base made from aluminum and a plurality of fins made from laminated aluminum and press-fitted into the base.