Heat sink with fins fitted and bonded thereto by applying conductive glue

Abstract

Disclosed is a heat sink used for telecommunication equipment, a high power amplifier or a CPU of a computer in order to emit heat having a high temperature to an exterior for properly maintaining operational characteristics of equipment. Instead of fabricating the heat sink through an extruding process by using a mold, in which molten metal is extruded from the mold by applying high pressure to the mold, fins are separately fabricated so as to obtain a maximum surface area per a unit area of the heat sink, thereby allowing the heat sink to emit a great amount of heat. The mold used for fabricating the fins of the heat sink has narrow and elongated slots, so manufacturing costs and a manufacturing period for the mold are increased. The mold is also easily broken and eroded. To solve the above problem, the disclosed heat sink includes a base made from aluminum and a plurality of fins made from laminated aluminum and press-fitted into the base. A conductive glue is applied to lower tips of the fins and the fins are fixedly press-fitted into fitting slots of the base by using a press.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to a heat sink, and more particularly, to a heat sink with fins fitted and bonded thereto by applying a conductive glue.

2. Description of the Related Art

Generally, a conventional heat sink is fabricated through an extruding process by using aluminum as shown in FIG. 1. In the conventional heat sink, a plurality of fins 2 are formed on a base 1. If the length of fins becomes large, a distance between the fins 2 may become more distant due to a structural problem of a mold fabricating the heat sink. For this reason, such fins must be fabricated with considerable thickness, and thus, the number, length and interval of the fins formed in a unit area may be limited. Accordingly, it is necessary to excessively enlarge the size of the heat sink in order to obtain a sufficient surface area for emitting heat. However, such a conventional heat sink may increase a manufacturing cost and cause a difficulty when dealing with the heat sink due to the heavy weight thereof.

SUMMARY OF THE INVENTION

The present invention is directed to a heat sink with fins bonded thereto by applying conductive that substantially obviates one or more problems due to limitations and disadvantages of the related art.

It is an object of the present invention to provide a heat sink with fins bonded thereto by applying a conductive glue.

To achieve this object and other advantages in accordance with the purpose of the invention, as embodied and broadly described herein, there is provided a heat sink comprising a base made from an aluminum plate having a predetermined thickness, a plurality of fins made from laminated aluminum, a plurality of fitting slots having a number and a width identical to a number and a thickness of the fins, respectively, and formed in the base with a predetermined interval in such a manner that the fins are press-fitted into the fitting slots without forming a tolerance therebetween, and a conductive glue consisting of aluminum powder and a curing agent applied to lower tips of the fins such that the lower tips of the fins are formed with shallow conductive glue layers.

According to the present invention, the fins made from laminated aluminum are press-fitted into the fitting slots by means of a press so that the base made from the aluminum plate and the fins made from laminated aluminum are integrally formed with each other without forming a gap, which acts as an insulation layer. Therefore, thermal conductive resistance may be removed from the heat sink, so it is possible to fabricate the heat sink having superior efficiency in a short manufacturing period. The fins press-fitted into the fitting slots can be fabricated with a predetermined length as required by a user, so an optimal surface area of the heat sink suitable for emitting heat can be obtained. Since the heat sink is fabricated under a normal temperature, hardness of aluminum may be constantly maintained so that machinability for the heat sink may not be deteriorated. When fabricating the heat sink, the thermal conductive glue adhering to the base made from the aluminum plate and the fins made from laminated aluminum can be easily removed by means of thinner or alkalic liquid. Accordingly, even if a surface-treatment process by using chromate or an anodizing process is carried out with respect to an aluminum surface of the heat sink, a color of the aluminum surface may not be changed, thereby maintaining a superior external appearance of the heat sink.

The heat sink according to the present invention may be used for a high power amplifier or a CPU of a computer for emitting heat having a high temperature to an exterior.

Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned by practicing the invention. The objectives and other advantages of the invention may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principle of the invention. In the drawings:

FIG. 1 is a view showing a conventional heat sink fabricated through an extruding process by using aluminum.

FIGS. 2A and 2B are views showing a heat sink according to an exemplary embodiment of the present invention, in which fins made from an aluminum plate are press-fitted into an aluminum base by means of a press while applying a conductive glue to lower tips of the fins.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Reference will now be made in detail to the preferred embodiment of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.

Hereinafter, a heat sink according to the present invention will be explained with reference to the accompanying drawings.

As shown in FIGS. 2A and 2B, the heat sink of the present invention includes a base 10 made from an aluminum plate, a plurality of fins 11 made from laminated aluminum, fitting slots 12 formed in the base 10, and a thermal conductive glue 13 consisting of aluminum powder and a curing agent and applied to lower tips of the fins 11 in such a manner that the fins 11 can be fixedly press-fitted into the fitting slots 12. The fitting slots 12 are formed in the base 10 by using an endmill or a cutter in such a manner that the fitting slots 12 have a tolerance about 5/100 to 1/1000 mm with respect to a thickness of the fins 11 and a depth about 2-4 mm. The thermal conductive glue 13 is applied to lower tips of the fins 11 at a thickness about 0.1 mm. The fins 11 having a desired height ‘h’ are press-fitted into the fitting slots 12 by using a press or a hammer so that the base 10 is integrally formed with the fins 11.

The heat sink as mentioned above according to the present invention has the following effects:

First, if the heat sink is applied to electronic appliances, such as repeaters used for telecommunication or high power amplifiers, requiring emission of heat having a high temperature, a surface area of the heat sink for a unit area may be optically increased suitable for emitting heat, so the electronic appliances can be fabricated in a slimmer and compact size with lightweight. Accordingly, the manufacturing cost for the electronic appliance can be reduced.

Second, the heat sink can be simply fabricated under normal temperature, so mass production for the heat sink may be possible. In addition, the hardness of the aluminum base and the aluminum fins may be constantly maintained so that machinability for the heat sink may not be deteriorated. Furthermore, even if a surface-treatment process by using chromate or an anodizing process has been carried out with respect to the heat sink, the heat sink is prevented from being deformed by residual stress, so the heat sink maintains a superior external appearance, thereby reducing manufacturing costs.

The present invention can be applicable for all kinds of heat sinks for reducing the size and weight of the heat sinks while effectively emitting heat.

The forgoing embodiments are merely exemplary and are not to be construed as limiting the present invention. The present teachings can be readily applied to other types of apparatuses. The description of the present invention is intended to be illustrative, and not to limit the scope of the claims. Many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims

1. A heat sink comprising:

a base formed with fitting slots;

a plurality of fins press-fitted into the fitting slots; and

a conductive glue consisting of aluminum powder and a curing agent applied to lower tips of the fins for allowing the fins to be fixedly inserted into the fitting slots.

2. The heat sink as claimed in claim 1, wherein the fins are made from laminated aluminum and the base is made from an aluminum plat.

3. The heat sink as claimed in claim 1, wherein the base and the fins are integrally formed with each other without forming a gap which acts as an insulation layer.

4. The heat sink as claimed in claim 1, wherein the heat sink is used for a high power amplifier or a CPU of a computer for emitting heat having a high temperature to an exterior.