Abstract: The invention is to provide an aligner which may produce the printed circuit works having no defects due to the incomplete alignment of the film-mask and the work, wherein the film-mask F having aligning marks 3 and the work K having aligning marks 4 are closely contacted with each other, and then the aligned conditions of the aligning marks 3 and 4 are detected, if the aligned conditions are detected to be out of the range of a predetermined tolerance, the close contact of the film-mask F and the work K is canceled, and the same aligning operation is repeated until the aligned conditions are detected to be within the range of a predetermined tolerance, so that the products of inferior quality may be prevented from being produced due to the incomplete alignment.

Abstract: A method and an apparatus of measuring a state of an IC lead frame are disclosed. The method has the steps of detecting a first projective position of an upper edge of a lead terminal of the IC lead frame on a reference surface and a second projective position of the upper edge, the second projective position of the upper edge having a projective angle different from that of the first projective position of the upper edge, detecting a first projective position of a lower edge of the lead terminal on the reference surface and a second projective position of the lower edge, the second projective position of the lower edge having a projective angle different from that of the first projective position of the lower edge, and computing the state of the lead terminal from the detections of the projective positions.

Abstract: A film mask is abutted to the object at the one side thereof then a fluid is introduced at an other side of the film mask so as to press the film mask to be placed in contact with the object.