Abstract: A long life rotor pump combination of the type having a liquid filled rotor that uses the liquid being pumped to establish hydrodynamic bearings within the rotor incorporates a pump which can be expanded to include more than one impeller, providing an optionally higher flow rate. Thermal isolation between the motor housing and the pump housing is assured by restricting heat conductivity through the physical structures and through the liquid. The rotor enclosure is formed with a number of engaging but not joined elements maintained under compression established by forces exerted in securing the encompassing motor housing.

Abstract: The problem of controlling the temperature of the different units in a process tool system which have to be cooled or heated using thermal transfer fluid at selected setpoints and flow rates is resolved by a system having multiple modular units each with some operative and form factor commonality but at least dual functional capability. The modular units each have separate recirculation loops for thermal transfer fluid but cool the fluid using refrigeration cycles or facilities water supplies or heat the fluid using compressed hot gases or electrical energy. By employing operative units which can be internally varied to provide different thermal capacities within form factor constraints, the system enables concurrent temperature control needs of a number of different units to be met with an energy efficient, low footprint, highly adaptable system.

Abstract: A system and method for controlling the temperature of thermal loads which might be controlled by refrigeration at any temperature within a wide range from −40° C. to +120° C. employs a refrigeration loop with pressure and temperature sensitive shunt paths to provide stabilized refrigerant flow so that a thermal expansion valve can operate stably only with liquid refrigerant inputs. For efficiency, thermal energy is interchanged between refrigerant returning from thermal energy exchange with a thermal load such as a cluster tool used in semiconductor fabrication and counterflow pressurized liquid refrigerant that is to be expanded for heat exchange. If the input in a suction line to the compressor is too high in temperature, a portion of pressurized refrigerant for the thermal expansion valve that is being subcooled prior to feeding to the valve is diverted into counterflow relationship with the subcooling exchange.