Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant. The spacer is disposed between the first device and the second device and configured to define a distance between the first device and the second device.

Abstract: Disclosed are a radio-frequency power supply system, a plasma processor, and a corresponding frequency-tuning matching method applied to a plasma processor having an ultra-low frequency bias radio-frequency power source. The frequency-tuning matching method comprises an impedance segment frequency matching obtaining step including partitioning a low frequency radio-frequency power output period into a plurality of impedance matching segments, and during each impedance matching segment, tuning output frequency of a high frequency radio-frequency source, detecting reflected power of the high frequency radio-frequency power supply, and after experiencing one or more low frequency radio-frequency power output period, obtaining and storing the segment matching frequency for each impedance matching segment.

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

Abstract: Provided is a magnesium alloy in which Cu content is 0 to 1.5% by mass, Ni content is 0 to 0.5% by mass, Ca content is 0.05 to 1.0% by mass, Al content is 0 to 0.5% by mass, Zn content is 0 to 0.3% by mass, Mn content is 0 to 0.3% by mass, Zr content is 0 to 0.3% by mass, the total of the Cu content and the Ni content being 0.005% by mass to 2.0% by mass, and the balance being magnesium and unavoidable impurities.

Abstract: Disclosed herein is a meta-muffler for reducing broadband noise. The meta-muffler includes: a flow pipe through which a fluid flows; an outer barrel disposed outside the flow pipe to be spaced apart from the flow pipe; and multiple metastructures arranged in a flow direction of the fluid and each comprising an opening opened parallel to the flow direction of the fluid, a resonance chamber disposed between the flow pipe and the outer barrel and communicating with the flow pipe through the opening, and a neck adjustment member extending from the outer barrel toward the flow pipe to be spaced apart from the opening in the flow direction of the fluid. The meta-muffler can increase transmission loss of noise flowing through the flow pipe through maximization of energy loss of sound waves entering the resonance chamber of the metastructure and can effectively attenuate noise over a wide band ranging from low frequencies to high frequencies.

Abstract: A member for a metal oxide nanofiber based gas sensor can include a metal nanoparticle catalyst and can be formed to be functionalized by binding the metal nanoparticle catalyst and an alkali or alkaline earth metal through electrospinning and heat treatment processes. The member can detect a trace amount of a gas with high selectivity and ultra-high sensitivity by uniformly binding the alkali or alkaline earth metal and the metal nanoparticle catalyst through electrospinning and high-temperature heat treatment.

Abstract: Disclosed are a liner assembly for vacuum treatment apparatuses and a vacuum treatment apparatus, wherein the liner assembly for vacuum treatment apparatuses comprises: an annular liner including a sidewall protection ring and a support ring which are interconnected, the outer diameter of the support ring being greater than that of the sidewall protection ring, the annular liner enclosing a treating space; and a gas channel provided in the support ring, the gas channel communicating with the treating space. The liner assembly for vacuum treatment apparatuses offer an improved performance.

Abstract: Various semiconductor chips and packages are disclosed. In one aspect, an apparatus is provided that includes a semiconductor chip that has a side, and plural conductive pillars on the side. Each of the conductive pillars includes a pillar portion that has an exposed shoulder facing away from the semiconductor chip. The shoulder provides a wetting surface to attract melted solder. The pillar portion has a first lateral dimension at the shoulder. A solder cap is positioned on the pillar portion. The solder cap has a second lateral dimension smaller than the first lateral dimension.

Abstract: According to one aspect of the invention, there is provided a method for monitoring hemodynamics, comprising the steps of: acquiring information on a posture of a first subject wearing a monitoring device; estimating a motion artifact predicted to be included in a spectroscopic measurement signal from the first subject which is measured by the monitoring device, with reference to the acquired information on the posture of the first subject, and a motion artifact estimation model for defining a correlation between a posture of at least one subject and a motion artifact occurring in a signal measured from the at least one subject; and removing the estimated motion artifact from the measurement signal from the first subject.

Abstract: Disclosed are an identity authentication, number saving and sending, and number binding method, apparatus and device.

Abstract: The present invention relates to a carbon-nanotube/nano-adsorption-material-based electrode and an electrochemical valuable-metal recovery device using the same, and more particularly to an environmentally friendly carbon-nanotube/nano-adsorption-material-based electrode and an electrochemical valuable-metal recovery device using the same, in which valuable metals selectively adsorbed from e-waste wastewater are oxidized using, as an anode, an electrode including carbon nanotubes and a nano adsorption material capable of selectively adsorbing valuable metals and are simultaneously reduced at a cathode, thereby separating and recovering valuable metals.

Abstract: An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

Abstract: A chip for hybrid bonded interconnect bridging for chiplet integration, the chip comprising: a first chiplet; a second chiplet; an interconnecting die coupled to the first chiplet and the second chiplet through a hybrid bond.

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

Abstract: A communication device includes an interrogator configured to output interrogation signals including consecutive unit chirp signals that change from a first frequency to a second frequency, and a backscatter tag configured to receive the interrogation signals and frequency-modulate the interrogation signals to generate and provide tag signals, wherein the interrogator is further configured to receive the tag signals and demodulate the tag signals.

Abstract: A solid heat storage material includes a bonding of vanadium dioxide and a highly thermally conductive substance higher in thermal conductivity than the vanadium dioxide, the highly thermally conductive substance being dispersed in the vanadium dioxide, the vanadium dioxide and the highly thermally conductive substance adhering closely and densely together, the highly thermally conductive substance having a volume fraction of 0.03 or more.

Abstract: A catalyst for decomposing perfluorinated compounds includes an alumina carrier, at least one metal carried on the alumina carrier and selected from the group consisting of Zn, Ni, W, Zr, Ti, Ga, Nb, Co, Mo, V, Cr, Mn, Fe, and Cu, S carried on the alumina carrier, and rare-earth metals carried on the alumina carrier.

Abstract: Stormwater management systems, methods, and apparatuses for containing and filtering runoff are provided. Disclosed embodiments may include a top plate and a bottom plate, the top plate including a first plurality of side panel attachments. Embodiments may include a plurality of support columns between the top plate and the bottom plate. Furthermore, disclosed embodiments may also include one or more arched side panels. Stormwater management crates may be arranged into an array and include side panels of variable heights. The array of stormwater management crates may be further wrapped in sediment impervious material and serve to restrict stormwater flow as part of a stormwater management system.

Abstract: A modular fluidic chip includes a body configured to have at least one flow channel formed in an inside thereof and be connected to another modular fluidic chip to allow the at least one flow channel to communicate with a flow channel provided in the other modular fluidic chip. A fluidic chip capable of performing one function is formed in the form of a module, whereby a fluidic flow system of various structures can be implemented without restriction in shape or size by connecting a plurality of fluidic chips capable of performing different functions as necessary. Through this, various and accurate experimental data can be obtained, and when a specific portion is deformed or damaged, only the fluidic chip corresponding thereto can be replaced, thereby reducing manufacture and maintenance costs.