Abstract: A wireless communication system provides an antenna apparatus for the wireless communication system. The antenna apparatus includes a base, a plurality of Yagi-Uda antenna modules disposed in a specific arrangement, a plurality of floating metal modules correspondingly installed in upper portions of the Yagi-Uda antenna modules and selectively connected to a corresponding Yagi-Uda module among the plurality of Yagi-Uda antenna modules, a switching element for selectively switching the floating metal module and the Yagi-Uda antenna module, and a controller for controlling the Yagi-Uda antenna module to comprise a directivity in a desired direction by selectively switching the switching element.

Abstract: A method for automatically scaling estimates of digital power consumed by a portion of an integrated circuit (IC) device by the operating frequency of the portion of the IC are described herein. The method may include obtaining an energy value which may correspond to an amount of energy used by the portion of the IC. A cumulative energy value may be generated by repeatedly, at a frequency proportional to the operating frequency of the portion of the IC, obtaining energy values and adding each obtained energy value to a sum of energy values for the portion of the IC. The cumulative energy value may be sampled at a time sample interval to generate an estimate of the portion of the IC's digital power consumption that is automatically scaled with the operating frequency of the portion of the IC.

Abstract: In a fabrication method of a silicon carbide semiconductor element including a drift layer playing a role of retaining a high withstand voltage on a front side of a semiconductor substrate of silicon carbide and including an ohmic electrode on a backside, dicing is added to form at least one dicing line in an element active region on a surface of the semiconductor substrate on a side opposite of the drift layer before forming the ohmic electrode on the backside of the semiconductor substrate. Thus, a silicon carbide semiconductor element and fabrication method thereof is provided such that even if the semiconductor substrate is made thinner to reduce the on-resistance, the strength of the substrate can be maintained and cracking of the wafer during wafer processing can be reduced.

Abstract: The present invention provides a semiconductor wafer, a semiconductor chip and a semiconductor package. The semiconductor wafer includes a first pad, a first inter-layer dielectric and a second pad. The first pad is disposed on a top surface of a semiconductor substrate and has a solid portion and a plurality of through holes. The first inter-layer dielectric covers the first pad. The second pad is disposed on the first inter-layer dielectric and has a solid portion and a plurality of through holes, wherein the through holes of the first pad correspond to the solid portion of the second pad.

Abstract: Optical fiber connectors for MT/MPO type ferrule assemblies are disclosed, having an overall connector length less than about 32 mm, for example, an overall length of about 18.5 mm for non-reinforced optical fiber cables, and an overall length of about 23.5 mm for reinforced optical fiber cables. In one embodiment, a connector comprises a ferrule assembly, and a housing coupled to the ferrule assembly and configured to couple to an adapter corresponding to the ferrule assembly. The connector further includes a lock coupled to the housing and configured to rotate so as to lock and unlock the housing from said adapter. An interface member coupled to the housing may include a stop configured to limit rotation of the lock. The interface member may include a reinforcement portion for reinforcing optical fiber cables.

Abstract: A gesture classification apparatus and method is disclosed. The apparatus may include a feature extractor configured to extract a plurality of features using a electromyogram (EMG) data group obtained from an EMG signal sensor including a plurality of channels, an artificial neural network including an input layer to which the EMG data group corresponding to the plurality of features is input and an output layer configured to output a preset gesture corresponding to the plurality of features, and a gesture recognizer configured to recognize a gesture performed by a user and corresponding to the extracted features.

Abstract: An electrical connector includes a metallic shell structure having a port, an insulation housing disposed in the metallic shell structure, a shielding plate disposed inside the insulation housing, and two rows of conductive terminal sets disposed on the insulation housing with each on two opposing sides of the shielding plate. A conductive contact portion is formed around the port by the metallic shell structure. Therefore, as the electrical connector is assembled with an external device, the conductive contact portion can be in contact with the external device. Hence, a grounding effect is achieved, and an electromagnetic compatibility is improved.

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.

Abstract: A system and method for providing video compression that includes encoding using an encoding engine a YUV stream wherein Y, U and V color values are encoded in parallel and patching together the Y, U and V color streams to form a compressed YUV output stream. The encoding engine further includes encoding each color value of the YUV stream in parallel using parallel encoding engines and a control engine for controlling operation all of the encoding engines in parallel. The YUV stream has an average bits per pixel value that varies from a first value to a second value that is double the first value. The encoding engine includes encoding the YUV stream in generally the same amount of time regardless of the average bits per pixel value.

Abstract: The problem addressed by the present invention is to provide a marker for detecting hepatocellular carcinoma, wherein the hepatocellular carcinoma marker comprises a glycoprotein that first becomes present in the liver with the occurrence of cancer, without depending on changes in the state of the liver.

Abstract: Provided are a flame-retardance-imparting material and a flame-retardant resin formed article that utilize plant waste. Resolution means: The present invention is a flame-retardance-imparting material obtained by contacting a plant material selected from plants and plant-derived materials with an aqueous solvent and then removing the aqueous solvent; and a flame-retardant resin formed article including a resin composition containing a flame-retardance-imparting material obtained by contacting a plant material selected from plants and plant-derived materials with an aqueous solvent and then removing the aqueous solvent, and a resin.

Abstract: An LED package with trenches traversing a die pad to provide a mechanical interlock mechanism to strengthen bonding between the die pad and an insulator such that de-lamination is less likely to occur between the die pad and the insulator. A chip carrying region is defined by a barrier portion formed by the insulator in the trenches and in gaps between electrodes and the die pad, such that a light converting layer is confined within the barrier portion.

Abstract: An authentication apparatus includes one or more processors configured to temporally implement a neural network, used to extract a feature value from hidden nodes, that is connected to input nodes to which an electrocardiogram (ECG) signal is input so as to share a weight set with the input nodes, and to match the ECG signal and the extracted feature value to a user for registration.

Abstract: A method for welding a heat shield during manufacturing of a vehicle component made from a thermoplastic material. The heat shield includes: a reinforcement layer made from a thermoplastic material which is weldable to the thermoplastic material of the vehicle component; and a heat shielding material that differs from the thermoplastic material of the reinforcement layer and is configured to decrease transfer of heat through the reinforcement layer to the vehicle component. The method includes: heating the heat shield to bring the thermoplastic material of the reinforcement layer in a molten state; placing the heated heat shield in a mold; bringing into the mold the thermoplastic material of the vehicle component in a molten state; welding the thermoplastic material of the reinforcement layer being in a molten state to the thermoplastic material of the vehicle component being in a molten state, by blow molding the vehicle component in the mold.

Abstract: There are provided a localized surface plasmon resonance sensing chip in which a linewidth of an absorption spectrum originating from localized plasmon resonance is narrow and with which a peak wavelength shift of an optical spectrum accompanying a change in refractive index of a surface can be accurately measured, and a localized surface plasmon resonance sensing system using this sensing chip. A sensing chip 10 includes a base 14 having a flat-plate shape, a plurality of protruding portions 16, and a metal layer 18 covering each front surface of the plurality of protruding portions 16. The protruding portions 16 each have a shape like a semi-oblate spheroid which is one of three-dimensional parts obtained by dividing an oblate spheroid in half along an equatorial plane and are arranged such that a divided surface 16a of the semi-oblate spheroid faces a front surface 14a of the base 14.

Abstract: Briefly, methods and apparatus to migrate a software thread from one wavefront executing on one execution unit to another wavefront executing on another execution unit whereby both execution units are associated with a compute unit of a processing device such as, for example, a GPU. The methods and apparatus may execute compiled dynamic thread migration swizzle buffer instructions that when executed allow access to a dynamic thread migration swizzle buffer that allows for the migration of register context information when migrating software threads. The register context information may be located in one or more locations of a register file prior to storing the register context information into the dynamic thread migration swizzle buffer. The method and apparatus may also return the register context information from the dynamic thread migration swizzle buffer to one or more different register file locations of the register file.

Abstract: A method for determining the ambient temperature of an electronic device, the device comprising heat-generating components (102) and a temperature sensor (105) positioned within a common casing (101), the method comprising the steps of: in an environment with a controlled ambient temperature: determining (307) a device-specific coefficient of power dissipation change (a) between a first (Emin) and second (Emax) power modes, wherein in the second power mode (Emax) the device dissipates more power than in the first power mode (Emin); and in an environment for which the ambient temperature is to be determined: measuring (203-205) temperatures (Tmin, Tmax) by the temperature sensor (105) for the first power mode (Emin) and the second power mode (Emax), calculating (206) ambient temperature (Tamb) as a function of the measured temperatures (Tmin, Tmax) and the device-specific coefficient of power dissipation change (a).

Abstract: An embedded component package structure includes a substrate. A first conductive component extends from a first surface of the substrate to a second surface of the substrate, a first conductive layer is disposed on the first surface of the substrate, and a second conductive layer is disposed on the second surface of the substrate and is electrically connected to the first conductive layer by the first conductive component. A die is disposed in a through hole in the substrate. A back surface of the die is exposed from the second surface of the substrate. A first dielectric layer covers an active surface of the die and the first surface of the substrate. A third conductive layer is disposed on the first dielectric layer and is electrically connected to the die by a second conductive component. A first metal layer is disposed directly on the back surface of the die.

Abstract: The MEDIA CONTENT SYNCHRONIZED ADVERTISING PLATFORM APPARATUSES AND SYSTEMS (“AD-SYNCH”) transforms TV program schedule listing information and user channel selection via AD-SYNCH components, into channel-synchronized product placement advertisement.

Abstract: Techniques are disclosed relating to data transformation for distributing workloads between processors or cores within a processor. In various embodiments, a first processing element receives a set of bytecode. The set of bytecode specifies a set of tasks and a first data structure that specifies data to be operated on during performance of the set of tasks. The first data structure is stored non-contiguously in memory of the computer system. In response to determining to offload the set of tasks to a second processing element of the computer system, the first processing element generates a second data structure that specifies the data. The second data structure is stored contiguously in memory of the computer system. The first processing element provides the second data structure to the second processing element for performance of the set of tasks.