Abstract: A tester system includes a test computer system for coordinating and controlling testing of a plurality of devices under test (DUTs), and a hardware interface board coupled to the test computer system and controlled by the test computer system. The hardware interface board is operable to apply test input signals to the plurality of DUTs and operable to receive test output signals from the plurality of DUTs, the hardware interface board including: a processor operable to access test pattern data for application to a DUT.

Abstract: An embodiment is an automated test equipment (ATE) for testing a device under test (DUT) which is connected to the ATE via a load board. The ATE includes a stimulus module, a measurement module, a loopback, a first switch, a second switch, and a load board interface. The load board interface includes a first radio frequency port and a second radio frequency port. The first and second radio frequency ports are configured to be coupled to the respective ports of the load board. The first switch is configured to couple the first radio frequency port to the stimulus module in a first switching state of the first switch and the second switch is configured to couple the second radio frequency port to the measurement module in a first switching state of the second switch.

Abstract: An electronic component handling apparatus that handles a DUT or a carrier accommodating the DUT, including: a pressing device that: electrically connects the DUT to a socket by pressing the DUT or the carrier toward the socket, and includes: a temperature control device that: controls a temperature of the DUT, and includes: a heater unit that is a heat source, the heater unit including: a flat heater; a first heat transfer material disposed on a first main surface of the flat heater; and a second heat transfer material disposed on a second main surface of the flat heater.

Abstract: A test carrier carried in a state of accommodating a device under test (DUT) includes: a carrier body that holds the DUT, and a lid member that covers the DUT and is attached to the carrier body. The carrier body has a first through-hole for positioning that is provided to face the DUT.

Abstract: An electronic component handling apparatus pressing the DUT against a socket electrically connected to a tester, includes: a first receiver that receives, from the tester, a first signal indicating a detection value of a temperature detection circuit; a calculator that calculates a temperature of the DUT based on the first signal; a calibrator that calibrates the calculated temperature; a second receiver that receives, from the tester, a second signal that causes the calibrator to start a first calibration; and a temperature adjuster that adjusts the temperature of the DUT. The second receiver receives the second signal before the tester turns on the DUT, once the second signal is received, the calibrator calculates a first calibrated temperature by executing the first calibration with respect to the calculated temperature, and the temperature adjuster adjusts the temperature of the DUT based on the first calibrated temperature.

Abstract: A signal source specifying apparatus receives measurement results from a plurality of sensors that receive, from a plurality of signal sources, signals represented by vectors each having a predetermined direction and measure triaxial components orthogonal to each other to specify positions of the signal sources and the vectors. The signal source specifying apparatus includes a relational matrix recording section, and a position/vector deriving section. The relational matrix recording section records a relational matrix representing a relationship between the measurement results summarized per axis by a number of the sensors and the vectors. The position/vector deriving section derives the positions of the signal sources and the vectors that offer a minimum cost function based on the measurement results and the relational matrix. The positions of the signal sources and the vectors are specified based on a result of derivation by the position/vector deriving section.

Abstract: A circuit for calibrating a plurality of automated test equipment channels comprises a central measurement unit configured to provide a current to one of the ATE channels and/or to measure a current from one of the ATE channels. The central measurement unit comprises a central measurement port, which is coupled with the plurality of ATE channels via respective diodes circuited between the central measurement port of the central measurement unit and respective DUT ports of the ATE channels.

Abstract: A signal vector derivation apparatus receives measurement results from a plurality of sensors that receive signals each represented by a vector having a predetermined direction and measure triaxial components orthogonal to each other and derives the direction of the vector. The measurement results from the sensors are each proportional to a sum of the triaxial components of the vector multiplied, respectively, by first coefficients. The signal vector derivation apparatus includes a spectrum deriving section and a direction deriving section. The spectrum deriving section derives a spectrum obtained based on the measurement results from the sensors and a sum of the first coefficients multiplied, respectively, by second coefficients, the spectrum having local maximum values within voxels in which signal sources that output the respective signals exist. The direction deriving section derives the direction of the vector based on the second coefficients used to obtain the spectrum.

Abstract: A testing apparatus includes a driver and a test signal providing section. The driver is connected electrically to a device under test and arranged to provide a test signal to the device under test. The test signal providing section is arranged to provide the test signal to the driver. The driver is closer than the test signal providing section to the device under test. A bandwidth of communication between the driver and the test signal providing section is broader than a bandwidth of communication between the driver and the device under test.

Abstract: Device testing techniques including allocating a log memory, testing a device, and storing test result during testing of the device in the allocated log memory. The allocated log memory can be accessed through an application programming interface (API) during testing of the device, wherein the allocated log memory remains unlocked during testing of the device.

Abstract: A semiconductor wafer handling apparatus moves a semiconductor wafer including a first surface on which a terminal of one or more device under tests (DUTs) is disposed and presses the terminal against a contactor of a probe card. The semiconductor wafer handling apparatus includes: a holder that holds the semiconductor wafer such that the first surface and a second surface of the semiconductor wafer are at least partially exposed; a first moving device that relatively moves the holder with respect to the probe card; a temperature adjusting device that contacts the second surface of the semiconductor wafer and adjusts a temperature of the DUTs; and a second moving device that relatively moves the temperature adjusting device with respect to the semiconductor wafer held by the holder.

Abstract: A coaxial cable includes an inner conductor including a central part and a conductive layer surrounding the central part, an insulator surrounding the inner conductor, and an outer conductor surrounding the insulator. The central part includes either a cavity or a portion made of resin material.

Abstract: A semiconductor device handling apparatus that moves a device under test (DUT) so that a terminal on a first surface of the DUT contacts a contact part of a semiconductor device testing apparatus, the semiconductor device handling apparatus includes a holding part that holds a second surface of the DUT and an optical probe that inputs and outputs an optical signal to and from an optical connection part on the second surface of the DUT.

Abstract: A semiconductor wafer handling apparatus that moves a semiconductor wafer including a device under test (DUT) and presses a terminal of the DUT against a contactor of a probe card, the semiconductor wafer handling apparatus includes an optical probe that inputs and outputs an optical signal to and from an optical connection part of the DUT. The terminal is disposed on a first surface of the semiconductor wafer. The optical connection part is disposed on a second surface of the semiconductor wafer.

Abstract: An electromagnetic wave measuring apparatus irradiates an irradiation target having a measuring target with a pre-irradiation electromagnetic wave and, based on a post-irradiation electromagnetic wave obtained, measures the measuring target. The post-irradiation electromagnetic wave has a response component from the measuring target and a background component corresponding to the pre-irradiation electromagnetic wave. The electromagnetic wave measuring apparatus includes a first frequency spectrum acquiring section, a second frequency spectrum acquiring section, and a subtracting section. The first frequency spectrum acquiring section acquires a frequency spectrum of a first signal that includes the background component and the response component of the post-irradiation electromagnetic wave. The second frequency spectrum acquiring section acquires a frequency spectrum of a second signal that includes the background component of the post-irradiation electromagnetic wave.

Abstract: A test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. In the test process, a magnetic field application apparatus applies a magnetic field BEX to the wafer under test. A test probe card is used in the test process. Multiple magnetization detection units are formed on a diagnostic wafer. In a diagnostic process of the test apparatus, the diagnostic wafer is mounted on the stage instead of the wafer under test. Each magnetization detection unit is capable of measuring a magnetic field BEX generated by the magnetic field application apparatus. In the diagnostic process, the diagnostic probe card is used instead of the test probe card.

Abstract: The presented systems and methods enable efficient and effective exchange of test support components. There are a variety of different test support components (e.g., active thermal interposer (ATI) device, exchange kit, etc.) that are configured to support various testing functions. In one embodiment, an automated test equipment (ATE) system comprises: a support component configured to enable support functions associated with testing of a device under test (DUT); a support component head configured to selectively couple with the support component; and an exchange socket configured to hold the support component for a portion of selectively coupling the support component and the support component head.

Abstract: An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.

Abstract: A measurement unit is disclosed and includes a converter unit and a processing unit is configured to provide a measurement result value, based on a first input signal and a second input signal. The converter unit is configured to provide a first digital, quantized values based on the first input signal or derived from the first input signal and the second input signal. The converter unit is further configured to provide second digital, quantized values based on the second input signal. The measurement unit is configured to change the one or more control signals of the converter unit between determination of different first values or a determination of the different second values, wherein different first values and/or different second values are provided using different converter quantization step sizes.

Abstract: Embodiments of the present invention can provide an extended NVMe driver that supports exercising virtual functions (and related physical functions) of a DUT without using a VM or hypervisor. In this way, the amount of memory and processing resources used for testing NVMe SSDs can be significantly reduced, and a large number of DUTs (e.g., up to 16 DUTs) can be tested in parallel independently. In other words, each DUT is tested in isolation, as if is the only device being tested, and there are no race conditions or competition for resources between workloads during testing.