Abstract: A signal vector derivation apparatus receives measurement results from a plurality of sensors that receive signals each represented by a vector having a predetermined direction and measure triaxial components orthogonal to each other and derives the direction of the vector. The measurement results from the sensors are each proportional to a sum of the triaxial components of the vector multiplied, respectively, by first coefficients. The signal vector derivation apparatus includes a spectrum deriving section and a direction deriving section. The spectrum deriving section derives a spectrum obtained based on the measurement results from the sensors and a sum of the first coefficients multiplied, respectively, by second coefficients, the spectrum having local maximum values within voxels in which signal sources that output the respective signals exist. The direction deriving section derives the direction of the vector based on the second coefficients used to obtain the spectrum.

Abstract: A testing apparatus includes a driver and a test signal providing section. The driver is connected electrically to a device under test and arranged to provide a test signal to the device under test. The test signal providing section is arranged to provide the test signal to the driver. The driver is closer than the test signal providing section to the device under test. A bandwidth of communication between the driver and the test signal providing section is broader than a bandwidth of communication between the driver and the device under test.

Abstract: Device testing techniques including allocating a log memory, testing a device, and storing test result during testing of the device in the allocated log memory. The allocated log memory can be accessed through an application programming interface (API) during testing of the device, wherein the allocated log memory remains unlocked during testing of the device.

Abstract: A semiconductor wafer handling apparatus that moves a semiconductor wafer including a device under test (DUT) and presses a terminal of the DUT against a contactor of a probe card, the semiconductor wafer handling apparatus includes an optical probe that inputs and outputs an optical signal to and from an optical connection part of the DUT. The terminal is disposed on a first surface of the semiconductor wafer. The optical connection part is disposed on a second surface of the semiconductor wafer.

Abstract: A semiconductor wafer handling apparatus moves a semiconductor wafer including a first surface on which a terminal of one or more device under tests (DUTs) is disposed and presses the terminal against a contactor of a probe card. The semiconductor wafer handling apparatus includes: a holder that holds the semiconductor wafer such that the first surface and a second surface of the semiconductor wafer are at least partially exposed; a first moving device that relatively moves the holder with respect to the probe card; a temperature adjusting device that contacts the second surface of the semiconductor wafer and adjusts a temperature of the DUTs; and a second moving device that relatively moves the temperature adjusting device with respect to the semiconductor wafer held by the holder.

Abstract: A semiconductor device handling apparatus that moves a device under test (DUT) so that a terminal on a first surface of the DUT contacts a contact part of a semiconductor device testing apparatus, the semiconductor device handling apparatus includes a holding part that holds a second surface of the DUT and an optical probe that inputs and outputs an optical signal to and from an optical connection part on the second surface of the DUT.

Abstract: An electromagnetic wave measuring apparatus irradiates an irradiation target having a measuring target with a pre-irradiation electromagnetic wave and, based on a post-irradiation electromagnetic wave obtained, measures the measuring target. The post-irradiation electromagnetic wave has a response component from the measuring target and a background component corresponding to the pre-irradiation electromagnetic wave. The electromagnetic wave measuring apparatus includes a first frequency spectrum acquiring section, a second frequency spectrum acquiring section, and a subtracting section. The first frequency spectrum acquiring section acquires a frequency spectrum of a first signal that includes the background component and the response component of the post-irradiation electromagnetic wave. The second frequency spectrum acquiring section acquires a frequency spectrum of a second signal that includes the background component of the post-irradiation electromagnetic wave.

Abstract: A coaxial cable includes an inner conductor including a central part and a conductive layer surrounding the central part, an insulator surrounding the inner conductor, and an outer conductor surrounding the insulator. The central part includes either a cavity or a portion made of resin material.

Abstract: A test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. In the test process, a magnetic field application apparatus applies a magnetic field BEX to the wafer under test. A test probe card is used in the test process. Multiple magnetization detection units are formed on a diagnostic wafer. In a diagnostic process of the test apparatus, the diagnostic wafer is mounted on the stage instead of the wafer under test. Each magnetization detection unit is capable of measuring a magnetic field BEX generated by the magnetic field application apparatus. In the diagnostic process, the diagnostic probe card is used instead of the test probe card.

Abstract: Embodiments of the present invention can provide an extended NVMe driver that supports exercising virtual functions (and related physical functions) of a DUT without using a VM or hypervisor. In this way, the amount of memory and processing resources used for testing NVMe SSDs can be significantly reduced, and a large number of DUTs (e.g., up to 16 DUTs) can be tested in parallel independently. In other words, each DUT is tested in isolation, as if is the only device being tested, and there are no race conditions or competition for resources between workloads during testing.

Abstract: A measurement unit is disclosed and includes a converter unit and a processing unit is configured to provide a measurement result value, based on a first input signal and a second input signal. The converter unit is configured to provide a first digital, quantized values based on the first input signal or derived from the first input signal and the second input signal. The converter unit is further configured to provide second digital, quantized values based on the second input signal. The measurement unit is configured to change the one or more control signals of the converter unit between determination of different first values or a determination of the different second values, wherein different first values and/or different second values are provided using different converter quantization step sizes.

Abstract: An image output apparatus includes a signal source specifying section, and a signal source image adding section. The signal source specifying section is arranged to receive measurement results from a plurality of sensors that receive, from a plurality of signal sources, signals represented by vectors each having a predetermined direction and measure triaxial components orthogonal to each other to specify positions of the signal sources and the directions of the vectors. The signal source image adding section is arranged to add images showing the signal sources to portions of an imaging result from an imaging section arranged to image the signal sources, the portions corresponding to the positions of the signal sources that are specified by the signal source specifying section.

Abstract: Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a multiple-name-space testing system comprises a load board, testing electronics, and a namespace testing tracker. The load board is configured to couple with a plurality of devices under test (DUTs). The testing electronics are configured to test the plurality of DUTs, wherein the testing electronics are coupled to the load board. The controller is configured to direct testing of multiple-name-spaces across the plurality of DUTs at least in part in parallel. The controller can be coupled to the testing electronics. The namespace testing tracker is configured to track testing of the plurality of DUTs, including the testing of the multiple-name-spaces across the plurality of DUTs at least in part in parallel. In one embodiment, the DUTs are NVMe SSD devices.

Abstract: Embodiments of the present invention can selectively enable 16 lane (×16) or 8 lane (×8) device testing using multiplexor circuitry disposed between a CXL1.1 CPU and the DUTs during testing. In this way, parallelism and testing efficiency are significantly improved compared to existing approaches that can only test devices using 8 lanes of the CXL 1.1 CPU.

Abstract: A temperature adjustment system for adjusting a temperature of a DUT electrically connected to a socket includes a first temperature adjustment device that supplies a fluid to an internal space in either the socket or a contact member that contacts the DUT when the DUT is pressed against the socket and a second temperature adjustment device that adjusts a temperature of an atmosphere in a chamber in which the socket and the contact member are disposed. The first temperature adjustment device includes a first supplier that supplies a first fluid and includes one or more connectors connected to one or more supply sources that supply the first fluid and a heat exchanger disposed between the one or more connectors and the internal space. The heat exchanger has a heat exchange part exposed in the chamber and exchanges heat between the first fluid and the atmosphere in the chamber.

Abstract: Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a flexible sideband support system comprises a load board, testing electronics coupled to the load board, a controller coupled to the testing electronics. The load board is configured to couple with a plurality of devices under test (DUTs), wherein the load board includes in-band testing ports and sideband testing ports. The testing electronics is configured to test the plurality of DUTs, wherein a portion of testing electronics are organized in sideband resource groups. The controller is configured to direct testing of the DUTs, wherein the controller is coupled to the testing electronics and the controller directs selective allocation of the testing electronics in the sideband resource groups to various testing operations of the DUTs.

Abstract: Efficient and effective testing systems and methods are presented. In one embodiment, a test system includes: a user interface configured to enable user interaction with the system; a test board configured to communicatively couple with a plurality of devices under test (DUTs), wherein the DUTs are compute express link (CXL) protocol compliant; and a tester configured to direct testing of the plurality of DUTs, wherein the tester manages testing of the plurality of DUTs, including managing flexible and independent parallel testing across the plurality of DUTs. In one exemplary implementation, the tester generates and manages workloads independently for DUTs included in the plurality of DUTs. The DUTs can be memory devices the tester is configured to test different memory spaces in parallel. The different memory spaces can have various implementations (e.g., included in the plurality of DUTs, different memory spaces are within one of the DUTs included in the plurality of DUTs, etc.).

Abstract: An electrical filter structure for forwarding an electrical signal from a first port, e.g. P1, to a second port, e.g. P2, in a frequency selective manner, wherein the filter is a microwave filter, the electrical filter structure comprising: a plurality of pairs of an open stub and a short-circuited stub coupled electrically in parallel to a transmission line comprising a plurality of transmission line portions at a plurality of respective junctions between adjacent transmission line portions, e.g.

Abstract: The automated test equipment is configured to establish communication, e.g. by uploading a program to the DUT using a first interface, such as a debug interface or a generic interface having access to the processing unit for external control. A typical use case of the first interface is debug access to the DUT, which typically requires limited data rates. In the case of the invention the first interface is an ATE access for test execution. The first interface configures the DUT to open a second interface running at much higher data rate, which is higher than the first interface, for additional communication. Additionally, the second interface may have extended capabilities compared to the first interface, such as presenting its own memory to the processing unit of the DUT as a normal system memory.

Abstract: A temperature adjusting system includes a temperature adjuster that adjusts a temperature of a device under test (DUT) and a first acquirer that acquires a first digital signal and outputs a second digital signal. The first digital signal is output from a first temperature detecting circuit in the DUT and indicates an internal temperature of the DUT. The temperature adjusting system includes a controller that controls the temperature adjuster using the second digital signal.