Abstract: A laser beam output apparatus includes a pulsed laser output section, an optical path determining section, a wavelength changing section, and a multiplexer. The pulsed laser output section outputs a laser beam having a predetermined wavelength as first pulses. The optical path determining section receives the first pulses and determines one among a plurality of optical paths for each of the first pulses for output. The wavelength changing section receives light beams traveling, respectively, through the plurality of optical paths and changes the light beams to have their respective different wavelengths for output. The multiplexer multiplexes outputs from the wavelength changing section.

Abstract: A method of testing a device comprises receiving signals from a device under test (DUT) and computing an eye diagram using the signals received from the DUT. The method also comprises comparing an eye height and an eye width of the eye diagram to a predetermined values of a threshold eye height and a threshold eye width. Further, responsive to a determination of the eye height and the eye width exceeding the predetermined values of the threshold eye height and the threshold eye width, flagging the DUT as passing.

Abstract: The test apparatus tests a wafer under test on which devices under test each including magnetoresistive memory or a magnetic sensor are formed. In a test process, the wafer under test is mounted on a stage. A test probe card is configured such that it can make probe contact with the wafer under test in the test process. A wafer connection HiFix is arranged between the test probe card and a test head. A magnetic field application apparatus is provided to the wafer connection HiFix. In the test process, the magnetic field application apparatus applies a magnetic field BEX to the wafer under test.

Abstract: An electronic component testing apparatus is used for testing a device under test (DUT). The electronic component testing apparatus includes: a socket unit that is electrically connected to the DUT; a first wiring board; and a tester that comprises a test head in which the first wiring board is mounted. The socket unit includes a first socket and a second socket. The second socket includes a base and a test antenna unit. The tester tests the DUT by transmitting and receiving radio waves between a device antenna unit of the DUT and the test antenna unit while the DUT is electrically connected to the first socket and the first socket is electrically connected to the test head through the second socket.

Abstract: An electronic component handling apparatus includes: a pressing device that presses a device under test (DUT) or a carrier containing the DUT against a socket while a test tray having an insert containing the DUT or the carrier is in a vertical state. The pressing device includes: a pusher that contacts the DUT or the carrier; and an abutting part that abuts the insert.

Abstract: A test apparatus includes: an electrical connection unit configured to be electrically connected to a light emitting device panel having a plurality of cells each including a light emitting device and arranged in a row direction and a column direction; a light source unit configured to collectively irradiate the plurality of cells with light; a reading unit configured to read, for each row of the light emitting device panel, a photoelectric signal obtained by photoelectrically converting the light in each of two or more of the cells arranged in the column direction by the light emitting device; a measuring unit configured to measure a photoelectric signal read from each of the plurality of cells; and a determination unit configured to determine a quality of each of the plurality of cells on a basis of a measurement result of the measuring unit.

Abstract: A test apparatus includes: an electrical connection unit electrically connected to a terminal of each of a plurality of light emitting devices to be tested; a light source unit for collectively irradiating the plurality of light emitting devices with light; an electrical measurement unit for measuring a photoelectric signal obtained by photoelectrically converting the light irradiated from the light source unit by each light emitting device; a light emission control unit for causing at least one light emitting device to be subjected to light emission processing to emit light; a light measuring unit for measuring light emitted by the at least one light emitting device to be subjected to the light emission processing; and a determination unit determining a quality of each light emitting device on the basis of a measurement result of the electrical measurement unit and a measurement result of the light measuring unit.

Abstract: A test apparatus inspects an antenna element or a device including the antenna element as a DUT by OTA. A front-end unit includes a plurality of electric field detection elements provided to face a plurality of points on a radiation surface of the antenna element of the DUT. The plurality of electric field detection elements can simultaneously detect the electric fields formed at the corresponding points by the DUT, respectively. A tester body receives a plurality of detection signals from the front-end unit and evaluates the DUT.

Abstract: There is provided a calibration device including: a calibration signal supply unit configured to supply, as a calibration input signal, a multitone signal having tones at a plurality of frequency bands to a converter configured to multiply an input signal by each of a plurality of signal patterns and limit a band to obtain each of a plurality of bandpass signals, and reconstruct an output signal in accordance with the input signal from the plurality of bandpass signals; a calibration bandpass signal acquisition unit configured to acquire a plurality of calibration bandpass signals obtained by the converter in response to the multitone signal; and a calibration processing unit configured to calibrate a parameter for the reconstruction in the converter based on the plurality of calibration bandpass signals.

Abstract: The invention relates to a probe card (PC) for use with an automatic test equipment (ATE), wherein the probe card (PC) comprises a probe head (PH) on a first side thereof, and wherein the probe card (PC) is adapted to be attached to an interface (IF) and wherein the probe card (PC) comprises a plurality of contact pads on a second side in a region opposing at least a region of the interface (IF), arranged to contact a plurality of contacts of the interface (IF), and wherein the probe card (PC) comprises one or more coaxial connectors (CCPT) arranged to mate with one or more corresponding coaxial connectors (CCPT) of the interface (IF). The invention relates further to pogo tower (PT) for connecting a wafer probe interface (WPI) of an automatic test equipment with the probe card (PC).

Abstract: A temperature control device controls a temperature of a device under test (DUT) including a device flow path in testing the DUT, and includes: a first flow path that has a first connection port to be connected to an inlet of the device flow path; and a fluid supply system that is connected to the first flow path and supplies a first fluid for temperature control to the device flow path.

Abstract: An electronic component handling apparatus that handles a DUT or a carrier accommodating the DUT, including: a pressing device that: electrically connects the DUT to a socket by pressing the DUT or the carrier toward the socket, and includes: a temperature control device that: controls a temperature of the DUT, and includes: a heater unit that is a heat source, the heater unit including: a flat heater; a first heat transfer material disposed on a first main surface of the flat heater; and a second heat transfer material disposed on a second main surface of the flat heater.

Abstract: A temperature adjusting device adjusts a temperature of a device under test (DUT) electrically connected to a socket, and includes: a fluid connector connected to a fluid supply source that supplies a fluid; a heat exchanger thermally connected to at least one of the DUT and a carrier holding the DUT in a state that the at least one of the DUT and the carrier is pressed against the socket; a first flow path passing through an inside of the heat exchanger; and a first swirl flow forming part that swirls a flow of the fluid to form a first swirl flow and supplies the first swirl flow to the first flow path, the first swirl swirling along an inner surface of the first flow path around a first central axis of the first flow path.

Abstract: According to the present invention, a pulsed laser output section outputs a laser beam having a predetermined wavelength as first pulses. An optical path determining section receives the first pulses and determines one or more among two or more optical paths for each of the first pulses for output. A wavelength changing section receives light beams travelling, respectively, through the two or more optical paths and, when the power of the traveling light beams exceeds a threshold value, changes the light beams to have their respective different wavelengths for output. A multiplexer multiplexes outputs from the wavelength changing section. The optical path determining section allows for change in the power ratio between a first power of the light beam traveling through one of two among the two or more optical paths and a second power of the light beam traveling through the other of the two optical paths.

Abstract: Provided is a semiconductor device, including: a compound semiconductor layer; a first insulating film provided on the compound semiconductor layer; a second insulating film, which is formed of a material different from the first insulating film, provided on the first insulating film; and a gate electrode provided above the second insulating film. The first insulating film may include tantalum oxynitride, and the second insulating film may include a material with a larger band gap than tantalum oxynitride. The second insulating film may include aluminum oxynitride.

Abstract: An optical testing apparatus is used in testing an optical measuring instrument. The optical measuring instrument provides an incident light pulse from a light source to an incident object and receives a reflected light pulse as a result of reflection of the incident light pulse at the incident object. The optical testing apparatus includes two or more testing light sources, two or more optical penetration members, and a wave multiplexing section. The two or more testing light sources each output a testing light pulse. The two or more optical penetration members each have an optical penetration region and receive the testing light pulse from each of the two or more testing light sources for penetration through the optical penetration region. The wave multiplexing section multiplexes the testing light pulses penetrating through the two or more optical penetration members for provision to the optical measuring instrument.

Abstract: Embodiments of the present invention provide systems and methods for performing tests on a device under test (DUT) based on training data derived from a set of training DUTs using nearfield measurement data. Nearfield measurement data can be mapped to performance metrics that approximate performance metrics derived from the far-field measurement data. Nearfield measurements can then be performed on a DUT to generate second nearfield measurement data, and performance metrics of the DUT are generated using the second nearfield measurement data and the mapped performance metrics derived from the training DUTs.

Abstract: Devices for testing a DUT having a circuit coupled to an antenna are disclose. The device can include a DUT location, a probe, and a ground area configured to serve as an antenna ground area for the antenna of the DUT. The ground area includes a slot that the antenna feed impedance is not affected or not affected significantly. The probe is adapted to weakly couple to the antenna of the DUT via the opening to probe a signal when the antenna of the DUT is fed by the circuit of the DUT and/or in order to couple a signal to the antenna which is fed to the circuit of the DUT by the antenna.

Abstract: Presented embodiments facilitate efficient and effective flexible implementation of different types of testing procedures in a test system. In one embodiment, a flexible sideband support system comprises a load board, testing electronics coupled to the load board, a controller coupled to the testing electronics. The load board is configured to couple with a plurality of devices under test (DUTs), wherein the load board includes in-band testing ports and sideband testing ports. The testing electronics is configured to test the plurality of DUTs, wherein a portion of testing electronics are organized in sideband resource groups. The controller is configured to direct testing of the DUTs, wherein the controller is coupled to the testing electronics and the controller directs selective allocation of the testing electronics in the sideband resource groups to various testing operations of the DUTs.

Abstract: An electronic component handling apparatus that handles a pressed body including a DUT or a carrier accommodating the DUT, includes: a pressing device that electrically connects the DUT to a socket by pressing the pressed body toward the socket, and includes: a contact plate that contacts the pressed body; and a retainer that holds the contact plate, the contact plate being separated from the retainer while the contact plate contacts the pressed body, and the contact plate being held by the retainer while the contact plate is separated from the pressed body.