Abstract: A method is disclosed by which precision alignment of optical fiber to wave-guide or other optical elements can be carried out with an adjustable microstructure in active alignment mode fiber attachment. A microstructure containing three elongated U-grooves can be combined effectively to produce a movable and adjustable V-groove structure, which can be used to achieve sub-micron scale alignment control with zero rotational torque. This device not only makes fiber alignment easy and fast but also maintains the fiber attachment position after alignment and epoxy bonding. Multiple fiber array alignment can be carried out with only a global alignment of two end fibers.

Abstract: A heat sink comprises a core member comprising at least one first surface adapted to contact at least a portion of the heat source. An one outer peripheral surface is located on the core member. At least one cooling fin device comprising an inner peripheral surface and at least one cooling fin is adjacent the core member. In one embodiment, the inner peripheral surface of the cooling fin device is adjacent the outer peripheral surface of the core member. At least a portion of the outer peripheral surface is tapered, wherein the circumference of the outer peripheral surface in the proximity of the first surface is greater than the circumference of the outer peripheral surface not in the proximity of the first surface.

Abstract: For measuring a capacitance with high accuracy, a capacitance measuring apparatus includes a voltage source with a current limiting function for applying different voltage values to the capacitance, and an integrator capable of continuous integrating operation for repeatedly integrating a current flowing through the capacitance at given periodic intervals. There is also disclosed a capacitance measuring method that is carried out by the capacitance measuring apparatus.

Abstract: The present invention provides a method and system for molding light emitting diode (LED) lamps. A mold frame is provided around each LED chip in an array. A first mold insert is placed in the mold frame and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip. The first mold insert is removed. A second mold insert is placed in the mold frame and lens material is injected into the first mold insert to form a lens molding around the light converting molding for each LED chip.

Abstract: The present invention concerns a device for positioning an object, consisting of a holder with a holding cup into which the object can be inserted in radial direction, wherein a rotation device is provided, which acts together with the object when the object is inserted in the holding cup and which allows for a rotational adjustment of the object around its longitudinal axis and relative to the holding cup. On the object, there is a drive component in the form of at least one radial ledge and/or at least one radial indentation into which the rotation device reaches when performing a rotational adjustment of the object.

Abstract: A memory controller comprises a programmable interface coupled to address circuitry. The programmable interface receives a configuration signal into the memory controller indicating a selected address configuration. The address circuitry processes system addresses based on the selected address configuration to generate memory addresses. The configuration signal may also indicate a selected memory configuration, and the address circuitry processes the system addresses based on the selected memory configuration to generate memory device selections.

Abstract: A novel method and apparatus is presented for reducing the slew rate of transition edges of a digital signal on a node of an integrated circuit by adjusting the source resistance of the pre-drive devices to generate a slew-controlled pre-drive signal for driving the output drive devices.

Abstract: A method and apparatus for simultaneously conducting multiple chemical reactions combine a test sample with a chemical reactant in a plurality of closed reaction chambers to produce reaction products. The method comprises assembling a plate having the test sample in a plurality of spatially arranged wells with a microarray of similarly spatially arranged surface bound chemical reactants to form the sealed apparatus having the plurality of closed reaction chambers. The apparatus is sealed such that it is gas, liquid and/or fluid tight. The seal may be accomplished with a flexible array substrate or a flexible gasket, and one or more of mechanical clamps, external fluid pressure, radiation, heat, vacuum and an adhesive. The sealed apparatus can be subjected to various reaction conditions, such as intense mechanical agitation and a controlled temperature environment. A kit comprises one or more of the elements of the apparatus.

Abstract: An encoder that includes a sensing device that senses encoding marks on a sensing surface that also includes one or more reference marks. The sensing device generates first and second encoder signals when the encoding marks pass the sensing device. The encoding signals define the direction of motion and degree of movement of the sensing surface. A register stores the position of the encoding surface relative to the sensing device. A controller receives the first and second encoder signals and increments or decrements the digital register based on the received first and second encoder signals. The encoder also includes a reference mark detector that generates a first reference mark signal when the first reference mark passes the reference mark detector. The controller resets the digital value to a first reference value when the encoder receives the first reference mark signal.

Abstract: A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element.

Abstract: An amplifier and bypass switch circuit includes a circuit input, a circuit output, an amplifier and a switching circuit. The amplifier has an amplifier control input, and a first amplifier output. The amplifier control input is connected to the circuit input. The amplifier output is connected to the circuit output. The switching circuit includes a control input, a switch input, a switch output and a phase matching network. The switch output is connected to the circuit output. The switch input is connected to the circuit input. The phase matching network preserves phase information when the amplifier and bypass switch circuit switches between an amplifier mode and a bypass mode.

Abstract: Guard columns for high-pressure liquid chromatography (HPLC) apparatuses. These guard columns can be removable and/or metallic guard columns. Further, all of the outlet of the guard column can substantially engage the inlet of an HPLC column in the HPLC apparatus. Also, an HPLC apparatus that includes a guard column, a hand-tightened top end fitting at a first end of the HPLC apparatus and a hand-tightened bottom end fitting at a second end of the HPLC apparatus.

Abstract: A printer having a power bus for delivery of power to a print carriage is disclosed. The power from the power bus is picked up by a charge pickup system mounted on the print carriage. The charge pickup system can include a conductor contact and a spring to pressure the conductor to maintain contact with the power bus. The power bus can be implemented on the slide bar or on a separate bus bar. A ground return bus can be used to provide ground lines to the print carriage.

Abstract: An OLED for emitting light at a predetermined peak wavelength, &lgr;. The OLED includes an anode layer, a cathode layer and an electroluminescent layer constructed from an organic light emitting compound that generates light, including light having a wavelength equal to &lgr;, by the recombination of holes and electrons. The electroluminescent layer is electrically connected to the anode layer and the cathode layer and is located between the anode and cathode layers. The OLED includes a first reflector and a second reflector, displaced from one another. The anode layer or cathode layer can serve as one of the reflectors. A spacer layer constructed from a material that is transparent at &lgr; is included between the reflectors and has a thickness that is adjusted such that the optical path length between the first and second reflectors is equal to N &lgr;/2, where N is a positive integer.

Abstract: Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.

Abstract: A summed TOFMS having a filter for identifying detector outputs that are likely the result of noise rather than ions striking the ion detector. The TOFMS stores a plurality of data values at locations specified by a register that counts clock pulses. The filter receives the ion measurements from the ion detector and generates an output measurement value corresponding to each ion measurement. The filter sets the output measurement value to a predetermined baseline value if the filter determines that the ion measurement is noise, otherwise the filter sets the output measurement value to the ion measurement. An adder, responsive to the clock signal, forms the sum of the data value specified by the register value and the output measurement value and stores the sum in the memory at the location corresponding to the register value.

Abstract: Systems and methods of passivating planar index-guided oxide vertical cavity surface emitting lasers (VCSELs) are described. These systems and methods address the unique susceptibility of these devices to damage that otherwise might be caused by moisture intrusion into the etch holes that are used to form the index-guiding confinement regions. In one aspect, a VCSEL includes a vertical stack structure having a substantially planar top surface. The vertical stack structure includes a top mirror, a bottom mirror, and a cavity region disposed between the top mirror and the bottom mirror and including an active light generation region. At least one of the top mirror and the bottom mirror has a layer with a peripheral region that is oxidized into an electrical insulator as a result of exposure to an oxidizing agent. The vertical stack structure defines two or more etched holes each extending from the substantially planar top surface to the oxidized peripheral region.

Abstract: A solder reflow system is disclosed that includes a substrate, a solder pad disposed upon the substrate, an optical component disposed upon the solder pad, and a laser positioned above the substrate with laser output focused sufficiently close to the solder pad to reflow the solder when the laser is powered. Also disclosed is a method for reflowing a solder joint, including: providing an optical component assembly including a substrate, a solder pad disposed upon the substrate, solder disposed upon the solder pad, and an optical component disposed upon the solder pad; providing a laser; positioning the laser above the substrate with laser output focused sufficiently close to the solder pad, instead of directly over the solder pad; and powering the laser, thereby transferring energy through the substrate into the solder pad, and reflowing the solder.

Abstract: This invention relates to a sled-guide-assembly (1), in particular for an optical attenuating device, comprising a straight guidance (2) and a sled (3), which is movable within the guidance (2), wherein

Abstract: A cassette containing cartridges for sampling blood from a patient. The cassette includes a container for storing a plurality of cartridges and at least one cartridge in the container. The cartridge includes a cartridge case and a lancet. The lancet has a tip and is housed in the cartridge case. The lancet can be driven to extend the tip outside the cartridge case for lancing the skin of the patient to yield blood. The container has a compartment that contains at least one cartridge. A cartridge from the compartment can be loaded onto a glucometer that drives the lancet in the cartridge to lance the skin of a patient.