Abstract: A submount substrate is used for the dual purposes of enabling simultaneous burn-in processing for a relatively large number of arrays of optical transmitters and enabling conventional dicing techniques to be used to form mounting-ready assemblies. In the preferred embodiment, the submount substrate is a silicon wafer that is specifically designed to provide connectivity between VCSEL arrays and burn-in equipment during the testing stage, but is also designed to be segmented and used in the final packaging stage. Because the submount is a silicon wafer, conventional integrated circuit fabrication techniques may be used to form conductive patterns that define array-receiving areas and that allow external circuitry to communicate with the various VCSEL arrays.

Abstract: A substrate for matrix assisted laser desorption ionization mass spectrometry. The substrate has a layer of a nitride composition on the surface of the substrate. The nitride composition is a major amount by weight from the group of titanium nitride, zirconium nitride and hafnium nitride.

Abstract: A mass spectrometer system analyzes a sample with the aid an associated computer system or processor which utilizes a relatively small compound deconvolution data library. The deconvolution library has a specific predefined order. The specific order of the compounds in the library is established based on predetermined knowledge of the sample being tested by the mass spectrometer. A deconvolution technique utilized by the computer system automates a deconvolution technique that would be utilized by an experienced process chemist for a similar sample and associated fragmentation or cracking pattern. The deconvolution technique steps through the deconvolution library's order of compounds and compares each compound's stored spectral data with the sample's spectrum. If it is determined that a compound's spectrum is found in the sample's spectrum, then at least one complete peak associated with the found compound's spectrum is removed from the sample's spectrum.

Abstract: An interface provides an electrical contact between test equipment and application equipment. The interface receives plural individual structures. At least one of the structures comprises at least one electrical path that provides the electrical contact. At least one of the structures is electrically isolated with respect to the interface and/or other structures and has a ground condition substantially independent of the ground condition of the interface and/or other structures.

Abstract: In one embodiment, a heat sink apparatus that provides electrical isolation for an integrally shielded, electronic circuit. The heat sink apparatus comprises a substrate having a first hole extending between a first and second sides of the substrate, a conductive layer attached to the second side, an electrically and thermally conductive heat sink having a protrusion, wherein the heat sink is attached to the first side of the substrate, and an electrically conductive plate having a second hole extending through the plate. The protrusion extends through the first hole and has a surface located at substantially the same level as that of the conductive layer. An electronic component is attachable to the protrusion surface. The plate is electrically coupled to the conductive layer and to the protrusion surface such that open space between the protrusion and the conductive layer is covered by electrically conducting area of the plate.

Abstract: The present invention relates to the integration of micro-optical elements (16) on a semiconductor substrate (2), particularly elements such as glass-material optical components such as lenses (16), beam splitters, mirrors and polarising elements. A micro-optical device (100), comprises a silicon substrate (2), and at least one glass-material micro-optical element (16) mounted on said substrate (2). The device (100) also includes a glass-material stand (30), for example a glass frit, interposed between the micro-optical element (16) and substrate (2). The stand (30) is fuse-bonded to both the substrate (2) and the micro-optical element (16). The substrate (2) has within a groove (13) a recess bounded by one or more walls, and the stand (30) is dimensioned to fit within the recess and be positioned by one or more walls of the recess.

Abstract: An application specific integrated circuit (ASIC) architecture for memory access. A first functional block provides a first address, a first column address strobe signal, and a first read/write signal associated with a first memory access. A second functional block provides a second address, a second column address strobe signal, and a second read/write signal associated with a second memory access. The ASIC architecture includes an embedded memory interface that is coupled to the first functional block and the second functional block. The embedded memory interface provides the first functional block and the second functional block access to an embedded memory either at the same time (referred to herein as concurrent access or simultaneous access) or at different times (referred to herein as consecutive or non-concurrent access). When predetermined conditions are met, the embedded memory interface provides the first functional block and the second functional block concurrent access to the embedded memory.

Abstract: A phase noise measurement module (PNMM), system and method for measuring phase noise improve accuracy of phase noise measurements of a signal under test (SUT) using a spectrum analyzer. The PNMM includes an RF to hF frequency converter and a selectable frequency divider. The system includes the PNMM connected to the spectrum analyzer and employs an LO signal from a tunable LO in the spectrum analyzer. The method includes directly converting an input SUT to an IF signal having either a second or a third IF frequency that is applied to a corresponding frequency conversion stage of the spectrum analyzer before the phase noise is measured. The present invention bypasses a first conversion stage, and typically a second conversion stage as well, of the spectrum analyzer and directly converts the SUT to either the second or third IF frequency, thereby reducing phase noise added to the SUT.

Abstract: A system and method for radio frequency (RF) sealing a door of an RF enclosure is disclosed. The door employs a two-axis gimbal system to provide two degrees of freedom as the drawer door makes contact with the RF enclosure. The two-axis gimbal system allows the forces applied to the sealing gasket to be uniform along the length of the seal. This enables uniform seal compression, and therefore, uniform RF isolation. The door is held rigid while the door gasket is not affecting a seal against the frame of the RF enclosure. As the door becomes engaged with the frame, multiple contact points of the drawer door are deactivated thereby allowing the drawer door to pivot near the seal centroid on a two-axis gimbal system. The two-axis gimbal system allows the RF seal to be applied uniformly across the length of the seal.

Abstract: An electro-mechanical relay including a substrate. A pass through circuit may be mounted on a first face of the substrate. An attenuator circuit may be mounted on a second face of the substrate. An armature assembly may be provided that is movable between first and second positions with respect to the substrate. The armature assembly when moved to its first position causes the pass through circuit to be coupled into a circuit. When moved to its second position, the armature assembly causes the attenuator circuit to be coupled into a circuit.

Abstract: A variable gain amplifier stage has first and second input terminals for receiving a differential input signal and first and second emitter follower transistors having their base electrodes coupled to the input terminals and their emitter electrodes coupled to a pair of matched voltage controlled current sources. A differential pair of transistors has their base electrodes coupled to the emitter electrodes of the first and second emitter follower transistors and their emitter electrodes coupled together and to a third voltage controlled current source. The voltage controlled current sources are controlled by the same voltage source so that a decrease in the differential pair tail current increases the bandwidth and decreases the gain of the stage, but a decrease in the current through the emitter follower transistors decreases the bandwidth of the stage so that by carefully controlling the relationship between these currents, a constant bandwidth can be maintained.

Abstract: An apparatus for controlling the position of a screen pointer for an electronic device having a display screen includes an imaging surface against which a portion of the tip of a human digit may be placed. A light source illuminates that portion of the tip of the digit that is placed against the imaging surface, thereby generating reflected images. The apparatus includes a motion transducer. A lens receives the reflected images and directs the reflected images onto the motion transducer. The motion transducer generates digital representations of the reflected images. The motion transducer generates a first set of movement data based on the digital representations of the reflected images. The first set of movement data is indicative of motion of the tip of the digit across the imaging surface. A controller generates a second set of movement data when the tip of the human digit is removed from the imaging surface.

Abstract: The invention relates to a device for transporting sample fluids into a mass spectrometer. The device comprises a well plate comprising a plurality of wells, a fluid transporting assembly, and a mass spectrometer interface. The fluid-transporting assembly is comprised of a plurality of fluid-transporting conduits, each extending from an inlet port to an outlet port, wherein the assembly exhibits sufficient flexibility to allow movable positioning of the outlet ports with respect to the inlet ports. Each inlet port of the fluid-transporting assembly is positioned in fluid communication with a different well of the well plate to form a plurality of flow paths. Each flow path originates at a well and travels, in succession, through the conduit inlet port, the conduit, the conduit outlet port, and the mass spectrometer interface. Fluids emerging from the mass spectrometer interface may be introduced into a mass spectrometer.

Abstract: Known transceivers and transmitters for Dense Wavelength Division Multiplexing (DWDM) systems are typically formed from separately sourced components by a Network Equipment Manufacturer (NEM). Alternatively, transceivers or transmitters are formed as separate modules from separately sourced components by the NEM. Consequently, the NEM has to build the transmitters or transceivers. This construction is difficult, because known optical packages for housing optoelectronic components, such as laser diodes, comprise a fibre “pigtail” through which electromagnetic radiation leaves the optical package. The present invention overcomes this problem by providing a DWDM module apparatus (2) that comprises an optical package (10) for housing optoelectronic components, the optical package (10) comprising a first part of a coupling (12) attached thereto.

Abstract: This invention relates to an optical device module for housing optical transmitters and receivers. Preferably the module is designed to enable optical devices to be easily inserted into and removed from modular equipment racks. The module comprises a case for housing an optical device and a plastic panel having an aperture for receiving an optical connector, in which the plastic panel has been coated with a metal coating and is connected to the case so that the optical device is substantially enclosed.

Abstract: The present invention concerns an electro-optical module assembly, which is capable of being plugged into and removed from a DWDM system. The assembly comprises an electro-optical module (1) with horizontal grooves (6) and vertical slots (7) which when inserted into protrusions (22) disposed on the module mounting means (20), allow for a “drop and slot” type insertion of the module. The present invention also integrates EMI shielding within the electro-optical module assembly.

Abstract: A package for an optical assembly of a type that uses bulk optics in an optical path will require environmental protection from contaminants. It is common to construct a substantially hermetically sealed package to provide environmental protection for the optical assembly but such hermetically sealed packages are expensive to construct and are not completely reliable. Consequently, the present invention provides a package (48) for an optical assembly with the bulk optics encapsulated by a silicone encapsulant (54) and encased within an epoxy layer (50) and supported by a substrate base (52). The package (48) for the optical assembly thus provides the bulk optics with the required environmental protection from contaminants.

Abstract: A method and apparatus for ensuring that two guide pins with a centerline in a module (e.g., a fiber optic module) mate with two holes in a connector. A connector guide positioner is provided to position a connector guide in an aligned orientation with respect to the guide pins. When in the aligned orientation, the centerline of the connector guide is in alignment with the centerline of the two guide pins of the module, thereby ensuring that the two holes of the connector mate with the two guide pins when the connector is inserted into the receptacle.

Abstract: A method for fabricating a resonator, and in particular, a thin film bulk acoustic resonator (FBAR), and a resonator embodying the method are disclosed. An FBAR is fabricated on a substrate by introducing a mass loading top electrode layer. For a substrate having multiple resonators, the top mass loading electrode layer is introduced for only selected resonator to provide resonators having different resonance frequencies on the same substrate.

Abstract: A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.