Abstract: A method for updating a basic input/output system of a server is disclosed. The method can be done by that of activating a customer end server; a BIOS initializing a network interface card; the customer end server linking a management end server; transmitting a product serial number of the customer end server and a version of the BIOS to the management end server for determination; if the management end server determines that the BIOS does need to be updated, the customer end server downloading the latest BIOS; the customer end server directly accessing a flash memory in the customer end server via an access program code in the BIOS, so as to burn the latest BIOS into the flash memory. Hence the customer end server automatically updates the BIOS therein while in a POST (power-on self-test) without entering into an operating system.

Abstract: A combining assembly for a fan fixing base is fixed in a housing and includes a fan module and a frame plate. The fan module includes a fixing base, a heat-dissipating fan disposed in the fixing base, and a plurality of locking elements. The heat-dissipating fan is provided with a plurality of locking holes. The fixing base has a plurality of through-holes. The locking elements are disposed through the through-holes to be connected into the locking holes, thereby fixing the heat-dissipating fan into the fixing base. The frame plate is provided with a plurality of positioning troughs to correspond to the locking elements. The fan module is engaged in the positioning troughs via the locking elements.

Abstract: A hard disk securing structure for an industrial computer is disclosed. The industrial computer includes a case, the hard disk securing structure is served to accommodate a hard disk and includes a securing member and a tray. The securing member is installed in the case and includes a buckling unit; the tray is installed in the case and includes a carrying plate and a pair of lateral plates respectively extended from two ends of the carrying plate, an accommodation space used for accommodating the hard disk is defined by the carrying plate and the pair of lateral plates, a locking unit is extended from one end of the carrying plate which is adjacent to the pair of the lateral plates, and the locking unit is mutually locked with the buckling unit. Accordingly, an advantage of easily installing/detaching the hard disk from the case is achieved.

Abstract: An industrial computer structure includes a case (100), a lug assembly (300), and touch panel (400). The case (100) has an opening (101) and a side plate (110) disposed on one side of the opening (101). The case (100) receives a plurality of trays (140) arranged within the opening (101). The side plate (110) has an external side (111) facing out of the case (100). The lug assembly (300) includes a fixing base (310) connected to the external side (111) of the side plate (110), a frame (320) disposed on the fixing base (310), and a handle (330) connected to the frame (320). The touch panel (400) is disposed in the frame (320) and electrically connected an electrical line (410) in the case (100). The components in the case (100) can be controlled via the touch panel (400) and thus the industrial computer can be easily maintained.

Abstract: The positioning structure includes an enclosure, a tray and a hard drive box. The enclosure has a plurality of rails and a stopping hole. The tray includes a bottom and two side walls vertically extending therefrom. One of the side walls is formed with an elastic pillar, and the elastic arm has a tongue with a protrusion. The hard drive box is received in the tray and has a positioning hole corresponding to the protrusion. When the tray is being slid into the enclosure, the elastic arm engages the protrusion with the positioning hole. When the tray is being slid out of the enclosure, the elastic arm engages with the stopping hole.

Abstract: A fixing assembly for a fan module is combined in a housing and includes at least one fixing base and at least one bottom pad. The fixing base has an accommodating space and a plurality of positioning portions in the accommodating space. The positioning portions are provided in pairs and symmetrical to each other. The locations of the positioning portions are designed for positioning various sizes of heat-dissipating fans. The bottom pad is configured to support the bottom of the fixing base. By this structure, various sizes of fan modules can be positioned in the housing.

Abstract: For providing a chip-type light emitting device, having a plural number of light emitting elements therein, so as to enable to obtain a high optical output with preferable conversion efficiency thereof, and a wiring substrate for that, the chip-type light emitting device, mounting the plural number of the light emitting diodes 30, 30 . . . within an inside of an insulating substrate, has a base substrate 10 and a reflector substrate 20, which is laminated and adhered on an upper surface thereof. In the base substrate 10 is formed a though hole 11, on the reverse surface of which is formed a heat radiating plate 12 made from a thick metal thin film. Also, on an inner periphery and a bottom portion of the through hole are formed a reflection film 13, and further wiring patterns 14, 14 . . . are formed on the substrate.

Abstract: A recess is formed in a land (2) of an LED reflecting plate (1) formed of a metal plate. The recess comprises a flat LED chip mounting portion (7) and a reflecting portion (8) inclined with respect to the LED chip mounting portion (7). The LED reflecting plate (1) is mounted on a printed wiring board (25) such that the land (2) is fitted in a first through hole (18). An LED chip (27) mounted on the LED chip mounting portion (7) is connected to a terminal portion (22) formed on the printed wiring board (25). The printed wiring board (25) is diced along a third through hole (19) to form an LED device (30) as one unit. With this arrangement, heat radiation properties and reflecting efficiency of the LED device (30) can be improved, and the manufacturing cost can be decreased.

Abstract: An electronic device is provided which includes a substrate of insulating resin having at least a pair of interior terminal portions on an upper surface thereof, an electronic element mounted on the terminal portions, having at least a pair of electrode terminals thereof, and a member of insulating resin, bonded on the upper surface of said substrate. The frame includes a cavity to store the electronic element. A cover member of insulating material hermetically seals over the cavity. Electrodes are formed at or in vicinity of positions of the terminals of said electronic element to electrically conduct the interior terminal portions for connection outside the device. Alternatively, roughened surfaces can be formed on metal electrode portions, which are formed on the upper surface of substrate for electrically conducting said interior terminal portions to exterior terminal portions.

Abstract: An electronic component device includes a printed wiring board having a side surface terminal portion formed of a recessed groove, filler, and plating conductor. The recessed groove is formed in a side surface, or a corner adjacent to the side surface, of a board and extending from an upper surface to a lower surface. The filler fills the groove and has a plating catalytic function. The plating conductor covers an exposed surface of the filler. A method of manufacturing the electronic component device is also disclosed.

Abstract: A printed wiring board (1) having a cavity (20) for mounting electronic parts therein and a method for manufacturing thereof, comprising: an upper wiring substrate (1A) having flat surfaces on both sides; a lower plate body (1B) being fixed on a reverse side surface of the upper wiring substrate, and being formed with the cavity (20) in a part thereof, for receiving an electronic part (30) within an inside thereof; conductor layers (3) provided on both side surfaces of the upper wiring substrate for mounting electronic parts thereon, by forming plated through-holes (7) or flat through-holes (7′), in particular with in a region of the cavity on the reverse side surface thereof; and external electrodes (5) formed on side-end surface or on a lower-end surface of the printed wiring board, wherein at least an electronic part, for example, hybrid IC, chip-like parts, functional parts, such as SAW filter, sensor parts, etc.

Abstract: In a method of manufacturing a multilayer printed wiring board including an internal wiring circuit formed on a board, an insulating resin layer formed on the internal wiring circuit, a blind hole formed in the insulating resin layer and communicating with the internal wiring circuit, and a conductive portion formed on an inner wall of the blind hole and connected to the internal wiring circuit, the blind hole is formed by using a short-pulse CO.sub.2 laser.

Abstract: A printed wiring board obtained by filling a non-electroconductive resin paste containing a metal powder in inner wall metallized through holes of double sided copper-clad insulating substrate, followed by curing by two steps, can mount leadless parts in high mounting density without losing a function of electroconnecting wiring layers.