Abstract: According to the invention, a method of manufacturing an esterified substance including a process in which a copolymer is obtained by copolymerizing a 1-alkene having 5 to 80 carbon atoms and maleic anhydride, and a process in which an esterification reaction of the copolymer and an alcohol having 5 to 25 carbon atoms is caused in a presence of trifluoromethanesulfonic acid in order to obtain a reaction mixture containing an esterified substance including at least one repetition unit selected from formulae (c) to (f) is provided, and, in the formulae (c) to (f), R represents an aliphatic hydrocarbon group having 3 to 78 carbon atoms, R2 represents a hydrocarbon group having 5 to 25 carbon atoms, m represents the copolymerization molar ratio X/Y of the 1-alkene (X) to the maleic anhydride (Y) and is 1/2 to 10/1, and n is an integer of more than or equal to 1.

Abstract: Disclosed is a thermofusible and thermosetting phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This phenol resin powder preferably has an average particle diameter of not more than 10 ?m, a variation coefficient of the particle size distribution of not more than 0.65, a particle sphericity of not less than 0.5 and a free phenol content of not more than 1000 ppm. Also disclosed are a dispersion liquid of such a phenol resin powder, and a method for producing a phenol resin powder having such characteristics.

Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Disclosed is a non-thermofusible phenol resin powder having an average particle diameter of not more than 20 ?m and a single particle ratio of not less than 0.7. This non-thermofusible phenol resin powder preferably has a chlorine content of not more than 500 ppm. This non-thermofusible phenol resin powder is useful as an organic filler for sealing materials for semiconductors and adhesives for semiconductors. The non-thermofusible phenol resin powder is also useful as a precursor of functional carbon materials such as a molecular sieve carbon and a carbon electrode material.

Abstract: Provided is a process for producing a high-purity pyridine compound from a crude pyridine compound that contains a diazine compound as an impurity, the method including a reaction step of reacting the crude pyridine compound with an aluminum hydride compound, and a distillation step of distilling the product obtained from the reaction step. The aluminum hydride compound preferably contains one or more compounds selected from lithium aluminum hydride and sodium aluminum hydride.

Abstract: A gas barrier film in which a gas barrier layer deposited by catalyst CVD in contact with each of both main surfaces of a plastic film is an SiCNFH layer satisfying conditions of 0.01<I(SiH)/I(SiN)<0.05, 0.00<I(CH)/I(SiN)<0.07, 0.04<I(NH)/I(SiN)<0.08, and 0.05<I(CF)/I(SiN)<0.3; an SiOCNH layer satisfying conditions of 0.1<I(SiH)/I(NH)<0.9, 0.0<I(CH)/I(NH)<0.3, 8<I(SiN)/I(NH)<20, and 2<I(SiO2)/I(NH)<8; or an SiCNH layer satisfying conditions of 0.01<I(SiH)/I(SiN)<0.05, 0.00<I(CH)/I(SiN)<0.07 and 0.04<I(NH)/I(SiN)<0.08. Here, the “I” represents peak intensity of Fourier transform infrared spectroscopy related to an atomic bond shown in the parentheses after the “I”.

Abstract: A method of sealing a semiconductor element which involves applying an epoxy resin composition including an epoxy resin and a phenolic resin obtained by reacting phenol, a biphenyl compound represented by the general formula (3) and benzaldehyde to a semiconductor element and curing the composition to seal the semiconductor element: wherein X in the formula (3) is a halogen, an OH group or an OCH3 group. The molar ratio of the total of the biphenyl compound and benzaldehyde relative to the phenol is from 0.27 to 0.40, and the molar ratio of benzaldehyde/biphenyl compound is from 5/95 to 40/60.

Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

Abstract: A process for producing 2,2?-bis (trifluoromethyl)-4,4?-diaminobiphenyl which is useful as a raw material for polyimide resin, etc. In benzidine rearrangement of 3,3?-bis(trifluoromethyl) hydrazobenzene in the presence of an inorganic acid such as sulfuric acid aqueous solution or concentrated hydrochloric acid, use of a water-immiscible organic solvent such as toluene as reaction solvent can increase the yield of the product. 3,3?-bis(trifluoromethyl) hydrazobenzene can be synthesized by reduction of m-nitrobenzotrifluoride.

Abstract: A film forming apparatus is provided that can prevent source gases from reacting together before reaching the substrate being processed in the apparatus, minimize the influence of the radiation heat from the substrate, and make the gas behavior in the reaction chamber better for crystal film formation. The apparatus forms a film on a surface of a heated substrate 5 by causing a first source gas and a second source gas to react together. The apparatus has a processing chamber 1, in which the substrate 5 is placed. The processing chamber 1 is divided into a heating chamber 1a and a reaction chamber 1b by at least the substrate 5 so that the substrate surface can be exposed to the source gases in the reaction chamber 1b. The apparatus further has an exhaust duct 7, through which the exhaust gas can be discharged. The exhaust duct 7 faces the exposed substrate surface and connects with the reaction chamber 1b.

Abstract: There is provided a method of generating nitrogen which includes cryogenically separating compressed air introduced into a high-pressure column 11, storing liquid air 13 in a bottom portion of the high-pressure column 11 and taking nitrogen in gaseous form from an upper portion of the high-pressure column 11, introducing the liquid air 13 stored in the bottom portion of the high-pressure column 11 into a low-pressure column 12, cryogenically separating the liquid air 13 introduced into the low-pressure column 12 and storing oxygen-enriched liquid air 22 in a bottom portion of the low-pressure column 12 and taking nitrogen in gaseous form from an upper portion of the low-pressure column 12 as a product gas. Liquid air 13 taken through an extraction pipe 20 is introduced into a portion of a rectification part 12a of the low-pressure column 12 in which the number of theoretical plates from a column bottom side is set within the range of one to ten.

Abstract: Disclosed is a phenolic resin having flame retardance, fast curing property and low melt viscosity, which is useful for a curing agent for epoxy resin-based semiconductor sealing materials. Also disclosed are a method for producing such a phenolic resin and use of such a phenolic resin. Specifically disclosed is a phenolic resin obtained by reacting a phenol, a bismethylbiphenyl compound and an aromatic aldehyde at such a ratio that the molar ratio of the total of the bismethylbiphenyl compound and the aromatic aldehyde relative to the phenol is 0.10-0.60, and the aromatic aldehyde/the bismethylbiphenyl compound (molar ratio) is from 5/95 to 50/50. Also specifically disclosed is an epoxy resin composition composed of such a phenolic resin and an epoxy resin.

Abstract: A process for producing 2,2?-bis (trifluoromethyl)-4,4?-diaminobiphenyl which is useful as a raw material for polyimide resin, etc. In benzidine rearrangement of 3,3?-bis(trifluoromethyl) hydrazobenzene in the presence of an inorganic acid such as sulfuric acid aqueous solution or concentrated hydrochloric acid, use of a water-immiscible organic solvent such as toluene as reaction solvent can increase the yield of the product. 3,3?-bis(trifluoromethyl) hydrazobenzene can be synthesized by reduction of m-nitrobenzotrifluoride.

Abstract: The present invention relates to an antistatic glass substrate production method which makes a glass substrate less electrifiable by plasma-treating the glass substrate, and an antistatic glass substrate produced by the method. In the present invention, the glass substrate is placed in an atmospheric pressure plasma generating apparatus adapted to generate an atmospheric pressure plasma between electrodes thereof for treatment of an object with the atmospheric pressure plasma, and the glass substrate is imparted with an antistatic property by the atmospheric pressure plasma generated in the apparatus. According to the invention, the glass substrate is treated with the atmospheric pressure plasma thereby to be made less electrifiable. Thus, adhesion of dust to the antistatic glass substrate can be suppressed until the glass substrate is incorporated in a liquid crystal display or a like product.

Abstract: An air separator oxygen gas capable of producing oxygen gas in an energy-saving manner, thereby remarkable downsizing can be realized. The air separator includes an air compressor (1) for taking in air from the outside and compressing it, first adsorption towers (2,3) for concentrating oxygen gas that is contained in the air compressed by the air compressor (1), an oxygen/air compressor (11) for further compressing oxygen-rich compressed air (X) passed through the first adsorption towers (2,3), a main heat exchanger (21) for cooling oxygen-rich compressed air (Y) passed through the oxygen/air compressor (11), and a high-pressure rectification tower (23) and a low-pressure rectification tower (28) for taking out oxygen gas by separating the oxygen-rich compressed air (Y) passed through the main heat exchanger (21) so as to be cooled to a low temperature by utilizing differences in boiling points of elemental gases.

Abstract: A regenerative refrigerating apparatus which can increase the speed of cooling and heating a subject to be cooled. The specific constitution of the regenerating type refrigerating apparatus includes a pressure control means 4 having a compressor 4a, a high pressure selector valve 4b, and a low pressure selector valve 4c, an expanding/compressing unit 1 having a room temperature end 1a and a low temperature end 1b, and a regenerating unit 2 having a room temperature end 2a and a low temperature end 2b, carries out heat transfer to a subject to be cooled, and is comprised of a flow path for working gas connecting the low temperature end 1b of the expanding/compressing unit and the low temperature end 2b of the regenerating unit with each other, and simultaneously extending to the subject to be cooled 7.

Abstract: A nitrogen selective adsorbent comprises a zeolite of a faujasite crystalline structure containing Li+ and at least one of NH+ and H+ as essential cations, and has a nitrogen adsorption characteristic represented by specific correlation between the number of associated Li+ ions per unit lattice of a zeolite crystal and the amount of adsorbed nitrogen per unit lattice of the zeolite crystal. An air separation method employs the aforesaid nitrogen selective adsorbent for separation between nitrogen and oxygen by selective adsorption of nitrogen in air.

Abstract: A nitrogen selective adsorbent comprises a zeolite of a faujasite crystalline structure containing Li+ and at least one of NH+ and H+ as essential cations, and has a nitrogen adsorption characteristic represented by specific correlation between the number of associated Li+ ions per unit lattice of a zeolite crystal and the amount of adsorbed nitrogen per unit lattice of the zeolite crystal. An air separation method employs the aforesaid nitrogen selective adsorbent for separation between nitrogen and oxygen by selective adsorption of nitrogen in air.