Abstract: A MEMS microphone includes a substrate, a lower membrane supported on the substrate, an upper membrane suspended above the lower membrane, a first electrode supported on the lower membrane, and a second electrode supported on the upper membrane. The lower membrane and the upper membrane enclose a cavity in which the first electrode and the second electrode are located. The lower membrane and the upper membrane are each formed of silicon carbonitride (SiCN). The first electrode and the second electrode are each formed of polysilicon.

Abstract: A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plug is formed on at least one of the first and second member. A vacuum having a pressure different from a pressure outside the MEMS sensor is formed between the first and second members.

Abstract: A microphone system includes first diaphragm element, second diaphragm element spaced apart from the first diaphragm element and connected to the first diaphragm element via a spacer. Disposed between the diaphragm elements is a plate capacitor element.

Abstract: A MEMS device package assembly for encapsulating one or more internal components includes a first MEMS device package. The first package includes a cover and a substrate attached to the cover by any suitable methods of attachment. A corrugated structure is formed on at least one of an inner or outer wall of the cover. The assembly further includes a second MEMS device package having a cover, a substrate, and a corrugated structured formed on at least one of an inner or outer wall of the cover. The first and second MEMS device packages may be coupled to the same substrate or different substrate. In another embodiment, the first MEMS device package may be mounted on the second MEMS device package. In yet another embodiment, the first MEMS device package may be contained in the second MEMS device package.

Abstract: A MEMS microphone system comprises a transducer die having a pierce-less diaphragm and a motion sensor suspended from the diaphragm. The system further comprises a housing and the diaphragm divided a volume inside the housing into a front volume and a back volume. The motion sensor suspended from the diaphragm is located in the back volume having a gas pressure that is substantially equal or lower than an ambient pressure.

Abstract: A Microelectromechanical system (MEMS) microphone comprises a base unit and a driving system disposed on the base unit. The driving system comprises a first diaphragm, a second diaphragm spaced apart from the first diaphragm, and a comb finger counter electrode assembly comprising a moving electrode member, the counter electrode assembly is mechanically coupled to the first and second diaphragms. The driving system further comprises a side wall mechanically coupled the first diaphragm to the second diaphragm defining a sealed electrode region and the sealed electrode region having an encapsulated gas pressure and the comb finger counter electrode assembly is disposed within the sealed electrode region.

Abstract: A biasing circuit for a capacitive sensor includes a capacitive sensor element configured to produce a sensor voltage at a sense node, and a preamplifier connected to the sense node and configured to amplify the sensor voltage. The biasing circuit has an auxiliary amplifier connected between an output of the preamplifier and the sense node and configured to set a DC component of an input voltage for the preamplifier to a ratiometric DC bias voltage.

Abstract: A MEMS sensor device package comprises a sensor assembly comprising a sensor device and a sensor circuit communicating coupled to the sensor device, The MEMS sensor device package further comprises an assembly package housing having a top member and a bottom member attached to the top member for encapsulating the sensor assembly. A passageway fluidly coupled the sensor device to attributes outside the package housing the passageway is embedded into the package housing, wherein the top member comprising a top wall and side walls, the side walls are attached to the bottom member, and the passageway is embedded into at least one of the side walls.

Abstract: A bi-directional charge pump cell includes a p-type substrate having a main surface. A first n-well is formed in the p-type substrate that includes n+ doped regions formed in the first n? well at the main surface. A first p-well is formed in the first n? well that includes p+ doped regions formed in the first p-well at the main surface. A second n-well is formed in the first p-well that includes n+ doped regions and PMOS transistors formed at the main surface. A second p-well is formed in the first n-well that includes p+ doped regions at the main surface. A third p-well is defined in the second p-well that includes p+ doped regions and NMOS transistors at the main surface.

Abstract: A microphone biasing circuit comprises a microphone connected between a first node and a first DC bias voltage, the microphone configured to provide a sensed voltage at the first node in response to sound; a first diode and a second diode, the first diode and the second diode connected antiparallel with one another between the first node and a second node, the second node having a second DC bias voltage; an amplifier having an input connected to the first node and an output connected to a third node, the amplifier configured to provide an output voltage to the third node based on the sensed voltage at the first node; and a feedback path connected from the third node to the second node. The feedback path comprises at least one element configured to couple alternating components of the output voltage at the third node to the second node.

Abstract: A microphone biasing circuit comprises a first amplifier having an output connected to a first node and an input connected to a second node; and a first feedback path connected from the first node to the second node. The first feedback path comprises a microphone having a first terminal connected to the first node and a second terminal connected to a third node, the microphone being configured to provide a sensed voltage at the first node in response to sound, the third node having a first DC bias voltage; and a first capacitor connected between the third node and the second node.

Abstract: A MEMS microphone includes a base structure and a piezoelectric resonator body having a first end and a second end. The first end is fixedly supported by the base structure and the second end is free such that the piezoelectric resonator is cantilevered from the base structure. The MEMS microphone further includes a first electrode operably connected to the piezoelectric resonator body and a second electrode operably connected to the piezoelectric resonator body. A controller includes at least one circuit operably connected to the first and second electrodes and configured to drive the piezoelectric resonator body at a shear resonance frequency of the piezoelectric resonator body and to detect a difference in the shear resonance frequency from a baseline resonance frequency resulting from a sound pressure.

Abstract: In one embodiment a micro-electro-mechanical system (MEMS) microphone package includes a multiple layer substrate, an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion, a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion, a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring, a MEMS die located above the ring trench, a copper pillar ring extending between the metal ring and the MEMS die, and a solder pillar ring positioned on a first surface of the copper pillar ring, the copper pillar ring and solder pillar ring attaching the MEMS die to the metal ring.

Abstract: A microelectromechanical system (MEMS) device package for encapsulating a MEMS device a molded package spacer that connects to a conductive lid and to a substrate. The molded package spacer forms either side walls or a divider of the MEMS device package and is adapted to route electrical connections from the MEMS device to either the substrate or a second MEMS device package via the substrate.

Abstract: A microelectromechanical system (MEMS) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the backplate and the back cavity and including an inner portion and an outer portion, a gap defined by a planar portion of the inner portion and the backplate, a spring arm defined in the outer portion and supported by the at least one post, a first leak path between the back cavity and the gap defined between the inner portion and the spring arm, a second leak path between the back cavity and the gap defined between the spring arm and the back cavity, and a first leak path constriction configured to restrict leakage through at least one of the first leak path and the second leak path.

Abstract: A microelectromechanical system (MEMS) microphone in one embodiment includes a backplate, a back cavity aligned with the backplate, at least one post extending from the backplate toward the back cavity, a membrane positioned between the backplate and the back cavity and including an inner portion and an outer portion, a gap defined by a planar portion of the inner portion and the backplate, a spring arm defined in the outer portion and supported by the at least one post, a first leak path between the back cavity and the gap defined between the inner portion and the spring arm, a second leak path between the back cavity and the gap defined between the spring arm and the back cavity, and a first leak path constriction configured to restrict leakage through at least one of the first leak path and the second leak path.

Abstract: A high-voltage MEMS biasing network. The network has a reset mode wherein a capacitive sensor is charged, and a functional mode wherein the MEMS biasing network provides a high impedance between the capacitive sensor and a bias voltage source. The network includes a biasing circuit, a mirror circuit, and a control circuit. The biasing circuit and the mirror circuit have a charging state and a high impedance state. The control circuit includes a first branch that controls the biasing circuit and a second branch that controls the mirror circuit. The biasing network receives a logic control signal, the first branch puts the biasing circuit into the charging state when the logic control signal is a first logic signal, and puts the biasing circuit into the high impedance state when the logic control signal is a second logic signal.

Abstract: A MEMS device includes a chip carrier having an acoustic port extending from a first surface to a second surface of the chip carrier, a MEMS die disposed on the chip carrier to cover the acoustic port at the first surface of the chip carrier, and an enclosure bonded to the chip carrier and encapsulating the MEMS die.

Abstract: Disclosed is an acoustic device comprising an enclosed housing defining an inner volume and having a front and a back; an acoustic port penetrating the front of the enclosed housing; a first and second sense structure attached to the inside of the housing and defining a gap between the first and second sense structures; a front volume defined by the portion of the inner volume between the first sense structure and the front of the housing; a back volume defined by the portion of the inner volume between the second sense structure and the back of the housing; and at least one vent in the first sense structure operatively connecting the front volume and the gap, wherein the acoustic device has a cutoff frequency above approximately 100 Hz.

Abstract: Provided is a micro-electromechanical-system (MEMS) device including a substrate; at least one semiconductor layer provided on the substrate; a circuit region including at least one chip containing drive/sense circuitry, the circuit region provided on the at least one semiconductor layer; a support structure attached to the substrate; at least one elastic device attached to the support structure; a proof-mass suspended by the at least one elastic device and free to move in at least one of the x-, y-, and z-directions; at least one top electrode provided on the at least one elastic device; and at least one bottom electrode located beneath the at least one elastic device such that an initial capacitance is generated between the at least one top and bottom electrodes, wherein the drive/sense circuitry, proof-mass, supporting structure, and the at least one top and bottom electrodes are fabricated on the at least one semiconductor layer.