Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to forming a flexible active matrix display along a length of flexible substrate. Another embodiment of the invention relates to forming multiple flexible displays along a continuous flexible substrate. Another embodiment of the invention relates to forming a flexible display along a flexible reflective substrate. Another embodiment of the invention relates to using FSA generally with a flexible web process material. Another embodiment of the invention relates to using FSA and a deterministic method such as “pick and place” to place objects onto a rigid substrate or onto a web process material. Another embodiment of the invention relates to using web processing to deposit and/or pattern display material through an in-line process.

Abstract: An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated circuitry to perform a function pertaining to the electronic assembly. The electronic assembly further comprises a substrate having a receptor site to mate with the functional block using a fluidic self-assembly process.

Abstract: Methods and apparatuses for assembling a structure onto a substrate. A method according to one aspect of the invention includes dispensing a slurry onto a substrate wherein the slurry includes a first plurality of elements, each of which is designed to mate with a receptor region on said substrate and each of which comprises a functional element, and wherein the slurry also includes a second plurality of elements which are not designed to mate with receptor regions on the substrate. Typically, these second plurality of elements help movement of the first plurality of elements. A method according to another aspect of the invention includes dispensing in a flow having a first direction a slurry onto a substrate, wherein the slurry includes a fluid and a plurality of elements, each of which is designed to mate with a receptor region on the substrate and each of which includes a functional element, and vibrating substrate in a second direction which is substantially perpendicular to the first direction.

Abstract: Methods and apparatuses for an electronic assembly. The electronic assembly has a first object created and separated from a host substrate. The first object has a first electrical circuitry therein. A carrier substrate is coupled to the first object wherein the first object is being recessed below a surface of the carrier substrate. The carrier substrate further includes a first carrier connection pad and a second carrier connection pad that interconnect with the first object using metal connectors. A receiving substrate, which is substantially planar, including a second electrical circuitry, a first receiving connection pad, and a second receiving connection pad that interconnect with the second electrical circuitry using the metal connectors. The carrier substrate is coupled to the receiving substrate using the connection pads mentioned.

Abstract: An integrated circuit for switching a pixel of the display. In one embodiment, an integrated circuit for switching a pixel is disclosed including first and second transistors is coupled between an analog input and the pixel. The first and second transistors provide a first and second digital select signals that are used to address the pixel.

Abstract: Method and apparatus for electrical devices. An electronic assembly comprises at least one object having a first electrical circuitry therein. The object is created and separated from a host substrate. The assembly further comprises a receiving substrate having at least one recess. A bottom conducting layer is deposited over the receiving substrate and the recess. The object is then coupled to the receiving substrate such that the object is deposited on the bottom conducting layer and recessed within the first recess and below a surface of the receiving substrate. An insulation layer having a plurality of vias is disposed over the receiving substrate to insulate the bottom conducting layer and the object. A top conducting is deposited over the insulation layer and is making electrical interconnections to the bottom conducting layer and the object through the vias.

Abstract: Methods for forming elements having a predetermined shape and for assembling the elements. In one example of a method, each of the elements includes a functional component which is disposed on a first face of a first substrate. A layer representing a first portion of the first substrate at a second face of the first substrate is removed, leaving a second portion of the first substrate on the first substrate. The second portion is etched through a first patterned mask on a surface of the second portion. The plurality of elements is then released from the first substrate. The plurality of elements may then be combined with a fluid to form a slurry. In another example of a method, the first face is etched vertically in regions adjacent to the edges of the plurality of elements, and regions below the first face are etched laterally, and then the plurality of elements are released from the substrate.

Abstract: Assembly of integrated circuit packages, such as BGA packaged devices, using fluidic self-assembly. Functional components, such as integrated circuits, having a wired side are suspended in a fluid and flowed over a substrate. The substrate has a top first dielectric layer and recessed receptor regions for receiving the functional components. The functional components are deposited in the receptor regions using fluidic self-assembly such that the wired side is facing outward from the receptor region. A conductive layer is then formed on the first dielectric layer to form conductive interconnects to the functional components. A second dielectric layer is then formed on the conductive layer. The second dielectric layer has openings for receiving conductive elements. Conductive elements, such as solder balls, are deposited into the openings in the second dielectric layer and contact the conductive layer.

Abstract: A method of transferring elements to be used in an assembly by placing elements in regions of a template. In one example of a method, each of the elements includes a functional component. A template holding a plurality of elements is then pressed into the receiving substrate by attaching at least one side of the template holding the elements onto the receiving substrate.

Abstract: Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one example of the invention, the substrate is exposed to a surface treatment fluid to create a surface on the substrate which has a selected one of a hydrophilic or a hydrophobic nature, and a slurry is dispensed over the substrate. The slurry includes a fluid and a plurality of elements (each of which includes a functional component). Each of the plurality of elements is designed to be received by a receptor region on the substrate. The dispensing of the slurry with the fluid occurs after the substrate is exposed to the surface treatment fluid, and the fluid is the selected one of a hydrophilic or a hydrophobic nature. In another example of the invention, a plurality of elements is exposed to a surface treatment fluid to create surfaces on the elements having a selected one of a hydrophilic or a hydrophobic nature.

Abstract: Methods for forming openings having predetermined shapes in a substrate and apparatuses with these openings. The methods may be used to form assemblies which include the substrate with its openings and elements which are disposed in the openings. In one example of a method, each of the elements include an electrical component and are assembled into one of the openings by a fluidic self assembly process. In an particular example of a method to create such an opening, the substrate is etched through a first patterned mask and is later etched through a second patterned mask. Typically, the second patterned mask is aligned relative to the opening created by etching through the first patterned mask and has an area of exposure which is smaller than an area of exposure through the first patterned mask.

Abstract: Assembly of integrated circuit packages, such as BGA packaged devices, using fluidic self-assembly. Functional components, such as integrated circuits, having a wired side are suspended in a fluid and flowed over a substrate. The substrate has a top first dielectric layer and recessed receptor regions for receiving the functional components. The functional components are deposited in the receptor regions using fluidic self-assembly such that the wired side is facing outward from the receptor region. A conductive layer is then formed on the first dielectric layer to form conductive interconnects to the functional components. A second dielectric layer is then formed on the conductive layer. The second dielectric layer has openings for receiving conductive elements. Conductive elements, such as solder balls, are deposited into the openings in the second dielectric layer and contact the conductive layer.

Abstract: Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.

Abstract: Methods for forming elements having a predetermined shape and for assembling the elements. In one example of a method, each of the elements includes a functional component which is disposed on a first face of a first substrate. A layer representing a first portion of the first substrate at a second face of the first substrate is removed, leaving a second portion of the first substrate on the first substrate. The second portion is etched through a first patterned mask on a surface of the second portion. The plurality of elements is then released from the first substrate. The plurality of elements may then be combined with a fluid to form a slurry. In another example of a method, the first face is etched vertically in regions adjacent to the edges of the plurality of elements, and regions below the first face are etched laterally, and then the plurality of elements are released from the substrate.

Abstract: Assembly of integrated circuit packages, such as BGA packaged devices, using fluidic self-assembly. Functional components, such as integrated circuits, having a wired side are suspended in a fluid and flowed over a substrate. The substrate has a top first dielectric layer and recessed receptor regions for receiving the functional components. The functional components are deposited in the receptor regions using fluidic self-assembly such that the wired side is facing outward from the receptor region. A conductive layer is then formed on the first dielectric layer to form conductive interconnects to the functional components. A second dielectric layer is then formed on the conductive layer. The second dielectric layer has openings for receiving conductive elements. Conductive elements, such as solder balls, are deposited into the openings in the second dielectric layer and contact the conductive layer.

Abstract: A method for testing a plurality of integrated circuits. In one embodiment, a plurality of integrated circuits are arranged on a wafer. The integrated circuits are separated on the wafer across the boundary region. Testing interconnects are disposed across the boundary region to test switchable couplings included in each of the integrated circuits on the wafer. After the integrated circuits are tested on the wafer using the testing interconnects across the boundary region, the boundary region is removed, which separates the wafer into individual integrated circuit dice and severs the testing interconnects.

Abstract: Methods and apparatus for fabricating a multiple display modular assembly. In one example of a method, a first flexible layer is coupled to a substrate, a second flexible layer is coupled to the first flexible layer, and a third flexible layer is coupled to the second flexible layer. Each of the flexible layers may be generated from a separate web-line process. In one example, one flexible layer may have a display plane with a driver backplane, a second flexible layer may have a fine interconnect, and a third flexible layer may have gross interconnect. The multiple flexible layer modular assembly may apply to either flexible or rigid displays.

Abstract: A functionally symmetric integrated circuit die to be mounted into a mutually symmetric receptor site. In one embodiment, a functionally symmetric integrated circuit die includes a substrate and a plurality of interface pads arranged thereon. The plurality of interface pads couple integrated circuitry disposed in the substrate to a plurality of interface pads of a mutually symmetric receptor site of an electronic device. The integrated circuit die can be mounted into the receptor site in any of a plurality of rotational orientations relative to the receptor site. The plurality of interface pads on the integrated circuit die and the receptor site are arranged such that an electronic device functions with the integrated circuit die in mounted in the receptor site in any one of the plurality of orientations.

Abstract: Methods and devices are claimed wherein blocks with integrated circuits thereon are rolled or pressed into recessed regions of a flexible or rigid substrate which is used in forming displays. Rolling the blocks into the substrate may take place in either a batch operation or in a continuous process.

Abstract: Apparatuses and methods for forming holes or recessed regions in a substrate or a web material used in displays is disclosed. One embodiment of the invention relates to a roller or template that creates recessed regions or holes by pressing protruding structures from a template or roller in the substrate while the substrate is moving through a web process. These recessed regions or holes in the substrate receive, in one embodiment, elements that have integrated circuits thereon. Another embodiment shows recessed regions or holes being created in a web material by a template or a roller while the web material is moving through a web process. Another embodiment of the invention includes using a web wheel to create recessed regions or holes in the substrate. Another embodiment includes using chemical etching to create recessed regions or holes in the web material.