Abstract: The present invention provides a backlight unit including an LED module and a frame separately, and each separated part is stable and is capable of simple use and assembly. The backlight unit of direct type includes a plurality of makeup LED modules including an LED package of direct type on a PCB and a heat sink releasing heat generated from driving the LED package of direct type, a reflection plate reflecting light emitted from the makeup LED module to a front face, and attached at the remaining surface except for the makeup LED packages, an optical sheet disposed on the reflection plate, and improving brightness and uniformity of the light emitted from the makeup LED module and the reflection plate, and guide the light into a front face of the optical sheet and a frame including a guide rail to combine the makeup LED module by a sliding combination.

Abstract: A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

Abstract: Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.

Abstract: A side view type light emitting diode (LED) and a method of manufacturing the same are disclosed. In one embodiment, the LED includes i) a pair of lead frames, ii) a reflector surrounding the lead frames, wherein a groove is defined in the reflector, wherein the reflector comprises a plurality of walls surrounding the groove, and wherein at least two walls of the groove face each other, iii) an LED chip mounted in the groove and electrically connected to the lead frames and iv) a lens array contained in the groove.

Abstract: A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.

Abstract: A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal, (b) forming a reflector which surrounds the lead frames, such that portions of the cathode terminal and anode terminal protrude from both sides, and which includes a groove open in the upward direction and a wall surrounding the groove, (c) die-attaching an LED chip onto the lead frames inside the groove, (d) bonding the LED chip to the cathode terminal or to the anode terminal with a conductive wire, (e) dispensing a liquid curable resin into the groove to form a lens part and (f) sawing the walls facing each other using a sawing machine such that the thicknesses at the upper surfaces are about 0.04 mm to about 0.05 mm.

Abstract: Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.

Abstract: A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.

Abstract: A display device is disclosed in the present invention. The display device includes a case including an install space inside the case, an opened display area at a front face of the case and a slit at a side of the case, the slit connected to the install space, a display panel attached to the case at the install space to be exposed to the display area, a backlight unit installed at the install space after the display panel through the slit by sliding engagement.

Abstract: An LED package is disclosed. The LED package includes a substrate having a plurality of sub patterns adhered by insulation adhesive, an LED chip mounted on the substrate and electrically connected to the substrate and a molding cap covering the LED chip. According to the LED package, as well as simplifying structure, an obstacle is removed at a light course of light emitted from the LED chip, so that light efficiency of the LED chip is improved.