Patents Assigned to Alti-Electronics Co., Ltd.
  • Publication number: 20090189176
    Abstract: Disclosed is a light-emitting diode package. The light-emitting diode package includes an electrode pad on which a chip is placed; a housing having a window through which the chip is exposed; a housing wall defining the window; and an electrode lead extended from the electrode pad in a direction of the housing to be exposed outside a surface of the housing, wherein the housing wall formed in the direction comprises a first portion and a second portion thicker than the first portion to cover the electrode lead.
    Type: Application
    Filed: March 28, 2008
    Publication date: July 30, 2009
    Applicant: Alti-electronics Co., Ltd
    Inventors: Sun-Hong KIM, Min-Sik KIM, Ji-Na LEE
  • Publication number: 20090189174
    Abstract: A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.
    Type: Application
    Filed: March 27, 2008
    Publication date: July 30, 2009
    Applicant: Alti-electronics Co., Ltd.
    Inventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim
  • Publication number: 20090189171
    Abstract: An LED package includes a housing, a substrate, a pad frame and an LED chip. The housing includes a plastic material, and has a recess with an opening at a top of the housing. The substrate includes substantially the same material with the housing. The pad frame includes conductive material, and is inserted on the substrate, and is fixed between the housing and the substrate. The LED chip is mounted on the pad frame and is disposed at a center of the recess. The housing is protruded and extended to a lower portion of the LED chip. Thicknesses of the housing's sidewalls facing to each other through the recess are substantially the same with each other.
    Type: Application
    Filed: March 27, 2008
    Publication date: July 30, 2009
    Applicant: Alti-electronics Co., Ltd
    Inventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim
  • Publication number: 20090189175
    Abstract: Disclosed is a side view light emitting diode (LED) package whose light emitting surface has been relatively expanded. The LED package includes a housing and a lead frame extended externally through the housing and bent in a direction of the recessed space. The housing includes a reflecting housing having a cavity and a supporting housing.
    Type: Application
    Filed: March 27, 2008
    Publication date: July 30, 2009
    Applicant: ALTI-ELECTRONICS CO., LTD.
    Inventors: Ik-Seong Park, Sun-Hong Kim, Jin-Won Lee, Kyoung-Il Park
  • Publication number: 20090039381
    Abstract: An LED package is disclosed. The LED package includes a substrate having a plurality of sub patterns adhered by insulation adhesive, an LED chip mounted on the substrate and electrically connected to the substrate and a molding cap covering the LED chip. According to the LED package, as well as simplifying structure, an obstacle is removed at a light course of light emitted from the LED chip, so that light efficiency of the LED chip is improved.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 12, 2009
    Applicant: Alti-electronics Co., Ltd.
    Inventors: Dong-Soo KIM, Haw-Kyung Choi
  • Publication number: 20090040416
    Abstract: A display device is disclosed in the present invention. The display device includes a case including an install space inside the case, an opened display area at a front face of the case and a slit at a side of the case, the slit connected to the install space, a display panel attached to the case at the install space to be exposed to the display area, a backlight unit installed at the install space after the display panel through the slit by sliding engagement.
    Type: Application
    Filed: August 7, 2008
    Publication date: February 12, 2009
    Applicant: Alti-electronics Co., Ltd.
    Inventors: Dong-Soo KIM, Haw-Kyung Choi
  • Patent number: D584247
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: January 6, 2009
    Assignee: Alti-Electronics, Co., Ltd.
    Inventors: Jae-Hoon Sung, Kham Lee
  • Patent number: D585848
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: February 3, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Dong-Sel Kim, Chi-Ok In, Jae Hoon Sung
  • Patent number: D586302
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: February 10, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Dong-Sel Kim, Chi-Ok In, Jae Hoon-Sung
  • Patent number: D593965
    Type: Grant
    Filed: January 16, 2008
    Date of Patent: June 9, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Gwui-Youn Park, Dong-Sel Kim
  • Patent number: D593966
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: June 9, 2009
    Assignee: Alti-electronics Co., Ltd
    Inventors: Dong-Sel Kim, Chi Ok In, Jong Won Park
  • Patent number: D595244
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: June 30, 2009
    Assignee: Alti-Electronics Co., Ltd
    Inventors: Chi-Ok In, Jong-Won Park
  • Patent number: D595677
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: July 7, 2009
    Assignee: Alti-Electronics Co., Ltd
    Inventors: Jin-Won Lee, Kyoung-Il Park, Sun-Hong Kim
  • Patent number: D596147
    Type: Grant
    Filed: August 19, 2008
    Date of Patent: July 14, 2009
    Assignee: Alti- Electronics Co., Ltd.
    Inventors: Ik-Seong Park, Sun-Hong Kim, Jin-Won Lee, Kyoung-il Park
  • Patent number: D596148
    Type: Grant
    Filed: August 22, 2008
    Date of Patent: July 14, 2009
    Assignee: Alti-Electronics Co., Ltd
    Inventors: Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
  • Patent number: D596591
    Type: Grant
    Filed: August 12, 2008
    Date of Patent: July 21, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Chi-Ok In, Jong-Won Park
  • Patent number: D597500
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: August 4, 2009
    Assignee: Alti-Electronics Co., Ltd
    Inventors: Jae-Hun Sung, Chi-Ok In
  • Patent number: D598872
    Type: Grant
    Filed: December 26, 2007
    Date of Patent: August 25, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Chi-Ok In, Jong-Won Park
  • Patent number: D599304
    Type: Grant
    Filed: September 3, 2008
    Date of Patent: September 1, 2009
    Assignee: Alti-Electronic Co., Ltd
    Inventors: Sun-Hong Kim, Min-Sik Kim, Ji-Na Lee
  • Patent number: D599305
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: September 1, 2009
    Assignee: Alti-Electronics Co., Ltd.
    Inventors: Sun-Hong Kim, Jin-Won Lee, Kyoung-Il Park