Patents Assigned to AmberWave Systems Corporation
  • Publication number: 20020197803
    Abstract: A structure includes a tensile strained layer disposed over a substrate, the tensile strained layer having a first thickness. A compressed layer is disposed between the tensile strained layer and the substrate, the compressed layer having a second thickness. The first and second thicknesses are selected to define a first carrier mobility in the tensile strained layer and a second carrier mobility in the compressed layer.
    Type: Application
    Filed: June 21, 2002
    Publication date: December 26, 2002
    Applicant: AmberWave Systems Corporation
    Inventors: Christopher W. Leitz, Minjoo L. Lee, Eugene A. Fitzgerald