Abstract: In an optical element, diffractive focusing features and diffractive anti-reflection features can extend into a first surface of a body, such as by etching. The diffractive focusing features can have a same first depth that is greater than a wavelength, and can be located in a first area to have a duty cycle that varies over the first area. The diffractive anti-reflection features can have a same second depth that is less than the wavelength. In some examples, an effective refractive index of the diffractive focusing features and the diffractive anti-reflection features, together, can be less than or equal to a specified value, such as 120% of a square root of a refractive index of a material of the body. In other examples, the diffractive anti-reflection features can be located in the first area to have a duty cycle that is constant over the first area.

Abstract: Herein disclosed are multiple embodiments of a signal-processing circuit that may be utilized in various circuits, including conversion circuitry. The signal-processing circuit may receive an input and produce charges on multiple different capacitors during different phases of operation based on the input. The charges stored on two or more of the multiple different capacitors may be utilized for producing an output of the signal-processing circuit, such as by combing the charges stored on two or more of the multiple different capacitors. Utilizing the charges on the multiple different capacitors may provide for a high level of accuracy and robustness to variations of environmental factors, and/or a low noise level and power consumption when producing the output.

Abstract: One embodiment is a method of deconvolving overlapping first and second pulses in a photon-counting CT scanning system, the method comprising detecting a first pulse event having a first detected level; detecting a second pulse event having a second detected level; determining an amount of time that elapses between the detected first pulse event and the detected second pulse event; and reconstructing the first pulse and the second pulse using the first and second detected levels, the duration of time between the first and second pulse events, and a known pulse shape.

Abstract: A semiconductor device includes a layer of a first semiconducting material, where the first semiconducting material is epitaxially grown to have a crystal structure of a first substrate. The semiconductor device further includes a layer of a second semiconducting material disposed adjacent to the layer of the first semiconducting material to form a heterojunction with the layer of the first semiconducting material. The semiconductor device further includes a first component that is electrically coupled to the heterojunction, and a second substrate that is bonded to the layer of the first semiconducting material.

Abstract: Systems and methods are provided for architectures for a digital class D driver that increase the power efficiency of the class D driver. In particular, systems and methods are provided for a digital class D driver having a feedback analog-to-digital converter (ADC) that can have a latency of 1 cycle or more than 1 cycle. A feedback ADC with a latency of 1 cycle or more is significantly lower power than a low latency feedback ADC. Systems and methods are disclosed for a power efficient digital class D driver architecture that allows for a latency of one or more cycles in the feedback ADC.

Abstract: Systems, devices, and methods related to using model architecture search for hardware configuration are provided. A method includes receiving, by a computer-implemented system, information associated with a pool of processing units; receiving, by the computer-implemented system, a data set associated with a data transformation operation; training, based on the data set and the information associated with the pool of processing units, a parameterized model associated with the data transformation operation, where the training includes updating at least one parameter of the parameterized model associated with configuring at least a subset of the processing units in the pool; and outputting, based on the training, one or more configurations for at least the subset of the processing units in the pool.

Abstract: An industrial control system module and methods are described for self-destruction or the destruction and/or erasure of sensitive data within the industrial control system module upon an indication of an unauthorized module access event. In an implementation, a secure industrial control system module includes a circuit board including electrical circuitry; a sealed encasement that houses the circuit board, where the sealed encasement includes a housing having a first housing side and a second housing side, where the housing is configured to house the circuit board when the first housing side and the second housing side are coupled together; and a first sensor component integrated with the sealed encasement, where the first sensor component is communicably coupled to the circuit board and electrical circuitry and is configured to provide an indication of an unauthorized access event.

Abstract: Microelectromechanical systems (MEMS) capacitive strain gauge sensors are described. The strain gauge sensors include a lever configured to mechanically amplify a strain response. In some embodiments, an anchored beam is coupled to the effort arm of the lever and a movable sensing finger to the resistance arm. The effort arm may be shorter than the resistance arm, thus providing a mechanical amplification.

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

Abstract: An impedance sensing circuit includes three impedance elements and a sensing element arranged in a bridge configuration. A first input terminal is coupled to two of the impedance elements to apply a stimulus signal. In a mutual-sensing mode, a second input terminal is coupled to the third impedance element and the sensing impedance element to apply an opposite phase stimulus signal. The impedance sensing circuit may be configured in a self-sensing mode, in which the opposite phase stimulus signal is decoupled from the third impedance element and the sensing impedance element. At least one of the impedance elements is variable and may be adjusted to balance an offset impedance load on the sensing element.

Abstract: Systems and methods are provided for wirelessly communicating with multiple sensors. In particular, a multi-sensor platform is provided that acts as an intermediary node and can communicate with multiple integrity sensors. The integrity sensors are each coupled via a wired connection to the multi-sensor platform, and the multi-sensor platform is powered wirelessly by a radiofrequency transmitter. The radiofrequency transmitter can receive data from multiple sensors via one node, the multi-sensor platform, thus allowing the radiofrequency transmitter to have a static transmission beam.

Abstract: Simple, low-cost systems and methods allow to shape the output spectrum of pre-equalized Tomlinson Harashima Precoding (THP)-equalized transmitters in a manner such as to create a relatively narrow DC null to facilitate transmission over DC-null channels in AC-coupled communication channels. Advantageously, this may be accomplished without significantly adding to the peak value of the to-be-transmitted signal and without the need to resort to high-order filters in the signal path or the use of recursive taps to compensate such filters.

Abstract: The battery monitoring techniques described herein use a self-characterizing wireless monitor coupled to a battery to monitor different properties of the battery. The wireless monitor may measure, among other things, an alternating current frequency response (ACFR) of the battery. To accomplish this, the wireless monitor may generate and inject a stimulus signal into the battery, and the monitor may then synchronously measure the corresponding impedance response of the battery.

Abstract: A stress-isolated microelectromechanical systems (MEMS) device and a method of manufacture of the stress-isolated MEMS device are provided. MEMS devices may be sensitive to stress and may provide lower performance when subjected to stress. A stress-isolated MEMS device may be manufactured by etching a trench and/or a cavity in a first side of a substrate and subsequently forming a MEMS device on a surface of a platform opposite the first side of the substrate. Such a stress-isolated MEMS device may exhibit better performance than a MEMS device that is not stress-isolated. Moreover, manufacturing the MEMS device by first forming a trench and cavity on a backside of a wafer, before forming the MEMS device on a suspended platform, provides increased yield and allows for fabrication of smaller parts, in at least some embodiments.

Abstract: A structural electronics wireless sensor node is provided that includes layers of electronic components fabricated from patterned nanostructures embedded in an electrically conductive matrix. In some aspects, the structural electronics wireless sensor node includes a plurality of nanostructure layers that each form individual electronic components of the structural electronics wireless sensor node. In certain embodiments, the structural electronics wireless sensor node includes electronic components such as a resistor, a inductor, a capacitor, and/or an antenna.

Abstract: A set of redundant industrial control system communications/control modules includes at least a first communications/control module and a second communications/control module.

Abstract: Techniques for setting a gain of an amplifier circuit in which the external resistor of the amplifier circuit is used to determine an internal gain setting to select. A voltage across the external resistor can be compared to an on-chip reference, and then used to program the desired gain. The techniques can mitigate or eliminate the need for a high-accuracy external resistor and can allow substantial improvements in initial gain accuracy and gain drift for existing boards and/or systems with only a bill of material change.

Abstract: A current sensing technique for coupled inductors in switching regulator circuits, where the current sensing technique can provide the current information needed for a power converter design and can be implemented as a real-world solution. The current sensing techniques can provide complete information of the coupled inductor current, such as peak current, valley current, and intermediate ripples. The current sensing techniques can use a simple RC network, such as two resistors and two capacitors for 2-phase operation. The techniques, however, are not limited to two-phase operation. The current sensing techniques of this disclosure can be extended to power stage assembly implementations, e.g., DrMOS modules, with current output in order to increase signal-to-noise ratio, which is significant for reliable control. in addition, the current sensing techniques of this disclosure can be extended to multi-phase operation, such as three or more phases.

Abstract: One embodiment is a microelectronic assembly including an assembly support structure; a first die including a pair of hot via comprising through-substrate-via (TSVs) extending through the first die between first and second sides thereof and a plurality of ground vias surrounding the pair of hot vias and extending through the first die between the first and second sides thereof. The first die further includes a pair of signal interconnect structures electrically connected to the pair of hot vias disposed on the second side of the first die. The assembly further includes a second die between the assembly support structure and the first die the pair of signal interconnect structures disposed on the first side thereof. The first die is connected to the second die via a signal die-to-die (DTD) interconnect structure including the signal interconnect structures of the first and second dies.

Abstract: A lidar system and method includes a photodiode array, a wafer, and a plurality of structures integrated on the wafer to form a metasurface lens. The metasurface lens is configured to focus the light pulses to the photodiode array and each of the plurality of structures includes at least one dimension that is less than a wavelength of the light pulses.