Abstract: Fin field-effect transistor (FinFET) thyristors for protecting high-speed communication interfaces are provided. In certain embodiments herein, high voltage tolerant FinFET thyristors are provided for handling high stress current and high RF power handling capability while providing low capacitance to allow wide bandwidth operation. Thus, the FinFET thyristors can be used to provide electrical overstress protection for ICs fabricated using FinFET technologies, while addressing tight radio frequency design window and robustness. In certain implementations, the FinFET thyristors include a first thyristor, a FinFET triggering circuitry and a second thyristor that serves to provide bidirectional blocking voltage and overstress protection. The FinFET triggering circuitry also enhances turn-on speed of the thyristor and/or reduces total on-state resistance.

Abstract: Apparatus and methods for control and calibration of external oscillators are provided herein. In certain embodiments, an electronic oscillator system includes a semiconductor die and a controllable oscillator that is external to the semiconductor die. The oscillation frequency of the controllable oscillator is tuned by a first varactor and a second varactor. The semiconductor die includes a phase-locked loop (PLL) that provides fine tuning to the controllable oscillator by controlling the first varactor, and a calibration circuit that provides coarse tuning to the controllable oscillator by controlling the second varactor.

Abstract: Gallium nitride-based monolithic microwave integrated circuits (MMICs) can comprise aluminum-based metals. Electrical contacts for gates, sources, and drains of transistors can include aluminum-containing metallic materials. Additionally, connectors, inductors, and interconnect devices can also comprise aluminum-based metals. The gallium-based MMICs can be manufactured in complementary metal oxide semiconductor (CMOS) facilities with equipment that produces silicon-based semiconductor devices.

Abstract: A semiconductor-based stress sensor can include a bipolar transistor device with first and second collector terminals. An excitation circuit can provide an excitation signal to an emitter terminal of the bipolar transistor device, and a physical stress indicator for the semiconductor can be provided based on a relationship between signals measured at the collector terminals in response to the excitation signal. The signals can indicate a charge carrier mobility characteristic of the semiconductor, which can be used to provide an indication of physical stress. In an example, the physical stress indicator is based on a current deflection characteristic of a base region of the transistor device.

Abstract: A soft-switching Phase-Shift Full-Bridge (PSFB) converter system may include a transformer comprising a primary side and a secondary side. Phase-leading circuitry and phase-lagging circuitry may be located on the primary side of the transformer. The phase leading a phase lagging circuitry may include one or more bridge switches. The system may further include clamping circuitry coupled to the secondary side of the transformer. The clamping circuitry configurable to, when in an active clamping mode, short the secondary side of the transformer. An inductance may be included on the primary side of the transformer to collect and store energy from an input source when the secondary side of the transformer is shorted. The energy stored in the inductance may be used to enable soft-switching of the bridge switches in the phase-lagging circuitry during a dead time or a circulating time of the bridge switches in the phase-leading circuitry.

Abstract: The present subject matter relates to active balun circuits. An active balun circuit includes a plurality of transistors; an output transmission line connected to output terminals of the transistors; an input transmission line; and a plurality of serial capacitors coupled to an input terminal of the transistors and the input transmission line.

Abstract: There is disclosed herein examples of systems and methods for compressing a signal. Samples of the signal can be segmented and the samples within each of the segments can be averaged to produce a value that can represent the samples within the segment. The number of samples to average in each segment may be determined based on an error threshold, such that the number of samples being averaged can be maximized to produce less data to be transmitted while maintaining the representation of the samples within the error threshold. In some embodiments, a signal can be separated into a timing reference, a representative periodic function, and a highly compressible error signal. The error signal can be utilized for reproducing a representation of the signal.

Abstract: A semiconductor device includes a layer of a first semiconducting material, where the first semiconducting material is epitaxially grown to have a crystal structure of a first substrate. The semiconductor device further includes a layer of a second semiconducting material disposed adjacent to the layer of the first semiconducting material to form a heterojunction with the layer of the first semiconducting material. The semiconductor device further includes a first component that is electrically coupled to the heterojunction, and a second substrate that is bonded to the layer of the first semiconducting material.

Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.

Abstract: Device for improving an optical detecting smoke apparatus and implementing thereof. Apparatus and methods for detecting the presence of smoke in a small, long-lasting smoke detector are (disclosed. Specifically, the present disclosure shows how to build one or more optimized blocking members in a smoke detector to augment signal to noise ratio. This is performed while keeping the reflections from the housing structure to a very low value while satisfying all the other peripheral needs of fast response to smoke and preventing ambient light. This allows very small measurements of light scattering of the smoke particles to be reliable in a device resistant to the negative effects of dust. In particular, geometrical optical elements, e.g., cap and optical defection elements, are disclosed.

Abstract: Integrated circuits can include semiconductor devices with back-side field plates. The semiconductor devices can be formed on substrates that have conductive layers located within the substrates. The conductive layers can include at least one of a conducting material or a semi-conducting material that modifies an electric field produced by the semiconductor devices. The semiconductor devices can include one or more semiconductor layers that include one or more materials having a compound material that includes at least one Group 13 element and at least one Group 15 element.

Abstract: The present disclosure is related to sensors, such as structural sensors, and related systems and methods.

Abstract: A clamp circuit comprises an output transistor and a replica transistor coupled as a current minor pair, wherein the replica transistor is scaled in size to the output transistor by a size ratio; a first current source configured to set a current in the replica transistor, wherein the output current is set at a clamped output current value that is a sum of current of the first current source and a scaled value of the current of the first current source determined according to the size ratio; and a register circuit, wherein a register value stored in the register circuit sets the clamped output current value.

Abstract: Systems and methods are provided for a distributed mufti-sensor witness integrity sensing platform (WISP) approach which allows for positioning of sensors in an enclosed space. In particular, a WISP platform is divided into two modules, with a base module is connected to multiple edge sensor modules with a wired connection. In general, splitting up the distributed WISP system described herein allows multiple sensors to be placed in an enclosed (and generally inaccessible) location. The sensor data can be transmitted from the multiple edge sensor modules via a connection to the base module. Additionally, the use of the two module system as provided herein allows the sensors to be positioned meters away from the first module.

Abstract: Operator actions and/or other commands or requests are secured via an authentication path from an action originator to a communications/control module or any other industrial element/controller. In implementations, an industrial control system includes an action authenticator configured to sign an action request generated by the action originator. The destination communications/control module or any other industrial element/controller is configured to receive the signed action request, verify the authenticity of the signed action request, and perform a requested action when the authenticity of the signed action request is verified.

Abstract: Comprehensive system for fire detection and implementing thereof. The disclosed system combines and optimizes optical, electrical, and sensor sub-systems to provide the functionality demanded by the market. While many of the individual functions exist separately, none of the existing products combine elements from different sub-systems to provide a much higher level of functionality. The present disclosure shows how to build a very compact housing around the smoke detector while keeping the reflections from the housing structure to a very low value while satisfying all the other peripheral needs of fast response to smoke and preventing ambient light. This allows very small measurements of light scattering of the smoke particles to be reliable in a device resistant to the negative effects of dust.

Abstract: Apparatus and methods for clock synchronization and frequency translation are provided herein. Clock synchronization and frequency translation integrated circuits (ICs) generate one or more output clock signals having a controlled timing relationship with respect to one or more reference signals. The teachings herein provide a number of improvements to clock synchronization and frequency translation ICs, including, but not limited to, reduction of system clock error, reduced variation in clock propagation delay, lower latency monitoring of reference signals, precision timing distribution and recovery, extrapolation of timing events for enhanced phase-locked loop (PLL) update rate, fast PLL locking, improved reference signal phase shift detection, enhanced phase offset detection between reference signals, and/or alignment to phase information lost in decimation.

Abstract: A multiple operating-mode comparator system can be useful for high bandwidth and low power automated testing. The system can include a gain stage configured to drive a high impedance input of a comparator output stage, wherein the gain stage includes a differential switching stage coupled to an adjustable impedance circuit, and an impedance magnitude characteristic of the adjustable impedance circuit corresponds to a bandwidth characteristic of the gain stage. The comparator output stage can include a buffer circuit coupled to a low impedance comparator output node. The buffer circuit can provide a reference voltage for a switched output signal at the output node in a higher speed mode, and the buffer circuit can provide the switched output signal at the output node in a lower power mode.

Abstract: Low-leakage switch circuit techniques to reduce leakage current of an off-state switch, while maintaining a low on-resistance. The low-leakage switch circuit may allow measurement of low current signals in a transimpedance amplifier with improved accuracy without, the need for calibration. The low-leakage switch circuit may include a bootstrapping path connecting two or more terminals or voltage nodes of an off-state switch in the switch circuit. The bootstrapping path is configured to bootstrap major leakage current contributors in the switch circuit, such as the substrate diode leakage, the subthreshold leakage, or combinations thereof.

Abstract: Herein disclosed are multiple embodiments of a signal-processing circuit that may be utilized in various circuits, including conversion circuitry. The signal-processing circuit may receive an input and produce charges on multiple different capacitors during different phases of operation based on the input. The charges stored on two or more of the multiple different capacitors may be utilized for producing an output of the signal-processing circuit, such as by combing the charges stored on two or more of the multiple different capacitors. Utilizing the charges on the multiple different capacitors may provide for a high level of accuracy and robustness to variations of environmental factors, and/or a low noise level and power consumption when producing the output.