Abstract: Compact packages including microelectromechanical system (MEMS) devices and multiple application specific integrated circuits (ASICs) are described. These packages are sufficiently small to be applicable to contexts in which space requirements are particularly strict, such as in consumer electronics. These packages involve vertical die stacks. A first ASIC may be positioned on one side of the die stack and another ASIC may be positioned on the other side of the die stack. A die including a MEMS device (e.g., an accelerometer, gyroscope, switch, resonator, optical device) is positioned between the ASICs. Optionally, an interposer serving as cap substrate for the MEMS device is also positioned between the ASICs. In one example, a package of the types described herein has an extension of 2 mm×2 mm in the planar axes and less than 500-800 ?m in height.

Abstract: Apparatus and methods for logarithmic current to voltage conversion are disclosed herein. In certain embodiments, a logarithmic current to voltage converter includes an input terminal that receives an input current, an output terminal that provides a logarithmic output voltage, a first field-effect transistor (FET) having a gate connected to the input terminal, a first bipolar transistor having a collector connected to the input terminal and an emitter connected to the output terminal, and a stacked transistor connected to the output terminal and to the first FET to form a feedback loop. For example, the stacked transistor can correspond to a second bipolar transistor having a collector connected to the output terminal and a base connected to the source of the first FET, or to a second FET having a drain connected to the output terminal and a gate connected to the source of the first FET.

Abstract: One or more electromagnetic radiation sources, such as a light emitting diode, may emit electromagnetic waves into a volume of space. When an object enters the volume of space, the electromagnetic waves may reflect off the object and strike one or more position sensitive detectors after passing through an imaging optical system such as glass, plastic lens, or a pinhole located at known distances from the sources. Mixed signal electronics may process detected signals at the position sensitive detectors to calculate position information as well as total reflected light intensity, which may be used in medical and other applications. A transparent barrier may separate the sources and detectors from the objects entering the volume of space and reflecting emitted waves. Methods and devices are provided.

Abstract: There is disclosed herein programmable delay lines and control methods having glitch suppression. In particular, the programmable delay lines may include latches that are triggered based on a trigger event of an input signal (which is often an edge of the input signal). The programmable delay lines may include one or more latches coupled between capacitor and transistor subassemblies and the latches, where the latches cause a delay between the time the trigger event arrives at the capacitor and transistor subassemblies and the latches. The delay can prevent the latches from updating at the same time that the edge of the input signal arrives at the capacitor and transistor subassemblies, which can suppress glitches that can causes errors in operation.

Abstract: A semiconductor-based stress sensor can include a bipolar transistor device with first and second collector terminals. An excitation circuit can provide an excitation signal to an emitter terminal of the bipolar transistor device, and a physical stress indicator for the semiconductor can be provided based on a relationship between signals measured at the collector terminals in response to the excitation signal. The signals can indicate a charge carrier mobility characteristic of the semiconductor, which can be used to provide an indication of physical stress. In an example, the physical stress indicator is based on a current deflection characteristic of a base region of the transistor device.

Abstract: Apparatus and methods for control and calibration of external oscillators are provided herein. In certain embodiments, an electronic oscillator system includes a semiconductor die and a controllable oscillator that is external to the semiconductor die. The oscillation frequency of the controllable oscillator is tuned by a first varactor and a second varactor. The semiconductor die includes a phase-locked loop (PLL) that provides fine tuning to the controllable oscillator by controlling the first varactor, and a calibration circuit that provides coarse tuning to the controllable oscillator by controlling the second varactor.

Abstract: Fin field-effect transistor (FinFET) thyristors for protecting high-speed communication interfaces are provided. In certain embodiments herein, high voltage tolerant FinFET thyristors are provided for handling high stress current and high RF power handling capability while providing low capacitance to allow wide bandwidth operation. Thus, the FinFET thyristors can be used to provide electrical overstress protection for ICs fabricated using FinFET technologies, while addressing tight radio frequency design window and robustness. In certain implementations, the FinFET thyristors include a first thyristor, a FinFET triggering circuitry and a second thyristor that serves to provide bidirectional blocking voltage and overstress protection. The FinFET triggering circuitry also enhances turn-on speed of the thyristor and/or reduces total on-state resistance.

Abstract: Gallium nitride-based monolithic microwave integrated circuits (MMICs) can comprise aluminum-based metals. Electrical contacts for gates, sources, and drains of transistors can include aluminum-containing metallic materials. Additionally, connectors, inductors, and interconnect devices can also comprise aluminum-based metals. The gallium-based MMICs can be manufactured in complementary metal oxide semiconductor (CMOS) facilities with equipment that produces silicon-based semiconductor devices.

Abstract: A soft-switching Phase-Shift Full-Bridge (PSFB) converter system may include a transformer comprising a primary side and a secondary side. Phase-leading circuitry and phase-lagging circuitry may be located on the primary side of the transformer. The phase leading a phase lagging circuitry may include one or more bridge switches. The system may further include clamping circuitry coupled to the secondary side of the transformer. The clamping circuitry configurable to, when in an active clamping mode, short the secondary side of the transformer. An inductance may be included on the primary side of the transformer to collect and store energy from an input source when the secondary side of the transformer is shorted. The energy stored in the inductance may be used to enable soft-switching of the bridge switches in the phase-lagging circuitry during a dead time or a circulating time of the bridge switches in the phase-leading circuitry.

Abstract: The present subject matter relates to active balun circuits. An active balun circuit includes a plurality of transistors; an output transmission line connected to output terminals of the transistors; an input transmission line; and a plurality of serial capacitors coupled to an input terminal of the transistors and the input transmission line.

Abstract: A semiconductor device includes a layer of a first semiconducting material, where the first semiconducting material is epitaxially grown to have a crystal structure of a first substrate. The semiconductor device further includes a layer of a second semiconducting material disposed adjacent to the layer of the first semiconducting material to form a heterojunction with the layer of the first semiconducting material. The semiconductor device further includes a first component that is electrically coupled to the heterojunction, and a second substrate that is bonded to the layer of the first semiconducting material.

Abstract: There is disclosed herein examples of systems and methods for compressing a signal. Samples of the signal can be segmented and the samples within each of the segments can be averaged to produce a value that can represent the samples within the segment. The number of samples to average in each segment may be determined based on an error threshold, such that the number of samples being averaged can be maximized to produce less data to be transmitted while maintaining the representation of the samples within the error threshold. In some embodiments, a signal can be separated into a timing reference, a representative periodic function, and a highly compressible error signal. The error signal can be utilized for reproducing a representation of the signal.

Abstract: A heat transfer element is disclosed. The heat transfer element can be configured to directly bond to a metal surface of an element. The heat transfer element can include a chamber that is defined at least in part by a housing that has a metal portion. The heat transfer element can also include a phase change material disposed in the chamber. The phase change material can be in thermal communication with the metal portion. The Heat transfer element can be bonded to the element to define a bonded structure.

Abstract: Integrated circuits can include semiconductor devices with back-side field plates. The semiconductor devices can be formed on substrates that have conductive layers located within the substrates. The conductive layers can include at least one of a conducting material or a semi-conducting material that modifies an electric field produced by the semiconductor devices. The semiconductor devices can include one or more semiconductor layers that include one or more materials having a compound material that includes at least one Group 13 element and at least one Group 15 element.

Abstract: Device for improving an optical detecting smoke apparatus and implementing thereof. Apparatus and methods for detecting the presence of smoke in a small, long-lasting smoke detector are (disclosed. Specifically, the present disclosure shows how to build one or more optimized blocking members in a smoke detector to augment signal to noise ratio. This is performed while keeping the reflections from the housing structure to a very low value while satisfying all the other peripheral needs of fast response to smoke and preventing ambient light. This allows very small measurements of light scattering of the smoke particles to be reliable in a device resistant to the negative effects of dust. In particular, geometrical optical elements, e.g., cap and optical defection elements, are disclosed.

Abstract: The present disclosure is related to sensors, such as structural sensors, and related systems and methods.

Abstract: A clamp circuit comprises an output transistor and a replica transistor coupled as a current minor pair, wherein the replica transistor is scaled in size to the output transistor by a size ratio; a first current source configured to set a current in the replica transistor, wherein the output current is set at a clamped output current value that is a sum of current of the first current source and a scaled value of the current of the first current source determined according to the size ratio; and a register circuit, wherein a register value stored in the register circuit sets the clamped output current value.

Abstract: Systems and methods are provided for a distributed mufti-sensor witness integrity sensing platform (WISP) approach which allows for positioning of sensors in an enclosed space. In particular, a WISP platform is divided into two modules, with a base module is connected to multiple edge sensor modules with a wired connection. In general, splitting up the distributed WISP system described herein allows multiple sensors to be placed in an enclosed (and generally inaccessible) location. The sensor data can be transmitted from the multiple edge sensor modules via a connection to the base module. Additionally, the use of the two module system as provided herein allows the sensors to be positioned meters away from the first module.

Abstract: Operator actions and/or other commands or requests are secured via an authentication path from an action originator to a communications/control module or any other industrial element/controller. In implementations, an industrial control system includes an action authenticator configured to sign an action request generated by the action originator. The destination communications/control module or any other industrial element/controller is configured to receive the signed action request, verify the authenticity of the signed action request, and perform a requested action when the authenticity of the signed action request is verified.

Abstract: Apparatus and methods for clock synchronization and frequency translation are provided herein. Clock synchronization and frequency translation integrated circuits (ICs) generate one or more output clock signals having a controlled timing relationship with respect to one or more reference signals. The teachings herein provide a number of improvements to clock synchronization and frequency translation ICs, including, but not limited to, reduction of system clock error, reduced variation in clock propagation delay, lower latency monitoring of reference signals, precision timing distribution and recovery, extrapolation of timing events for enhanced phase-locked loop (PLL) update rate, fast PLL locking, improved reference signal phase shift detection, enhanced phase offset detection between reference signals, and/or alignment to phase information lost in decimation.