Abstract: A resin-sealing method compression molds a resin on a workpiece having a plurality of components mounted on a carrier and manufactures a plurality of packages in each of which at least one of the components is sealed with the resin, the resin-sealing method including: setting a sheet resin in a resin molding die; and compression molding the sheet resin set in the resin molding die, wherein a penetrating hole is formed in a central portion of the sheet resin so that the amount of the resin is less in the central portion than in a peripheral portion of the sheet resin in plan view.

Abstract: A compression molding device compression-molds resin to a workpiece in which components are mounted on a carrier via connection members, and produces packages each having at least one component resin-sealed therein. The compression molding device comprises: a measuring part measuring the weight of the workpiece; a calculation part calculating the supply amount of the resin based on the weight of the workpiece measured by the measuring part; a supply part supplying the resin in the supply amount calculated by the calculation part; and a molding die for compression-molding, to the workpiece, the resin supplied by the supply part. The calculation part calculates the total volume of mounted objects, including the components and the connection members, based on the weight of the workpiece and calculates the supply amount of the resin based on the total volume of the mounted objects.

Abstract: The resin sealing apparatus according to the present invention includes a press device for closing and opening an upper mold and a lower mold. The press device includes a fixed platen to which one of the upper mold and the lower mold is fixed and a movable platen to which the other one is fixed, a tie bar fixing the fixed platen and holding the movable platen so that the movable platen can be lifted and lowered, and a drive device lifting and lowering the movable platen. The fixed platen has a fixed portion fixed to the tie bar on the side of a first surface of a main body portion and a bell-shaped portion provided on the side of a second surface opposite to the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion.

Abstract: To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.

Abstract: There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.

Abstract: There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.

Abstract: A resin supply apparatus, a resin sealing apparatus, and a method for manufacturing a resin-sealed product are provided. A resin supply apparatus supplies a resin onto a workpiece on which elements are arranged in a first direction and a second direction intersecting the first direction, respectively. The resin supply apparatus includes: an acquisition unit for acquiring arrangement information of the elements on the workpiece; a supply unit for supplying the resin onto the workpiece; a calculation unit for calculating a resin supply pattern based on the arrangement information; and a drive unit for moving at least one of the workpiece and the supply unit relative to the other along the resin supply pattern. The resin supply pattern has linear paths extending along the first direction, and a region between the mutually adjacent linear paths in the plurality of linear paths is opened to the outside of the workpiece.

Abstract: A resin supply apparatus includes a calculation unit for calculating a resin supply pattern based on the shape of a cavity of a resin sealing mold, and a supply unit for supplying a resin to an object to be coated along the resin supply pattern. The resin supply pattern has a plurality of linear paths, and one of mutually adjacent linear paths is inclined with respect to an axis of symmetry that divides a cavity in line symmetry, the other one of the mutually adjacent linear paths is inclined with respect to the one linear path, and a region between the mutually adjacent linear paths is opened to the outside of the object to be coated, at least on a side on which the other linear path is separated from the one linear path.

Abstract: A resin molding device that can hold a thin and large-size workpiece without positional displacement when the workpiece is conveyed even if dimensional tolerance and rigidity are different, and can convey the workpiece to a mold frame without losing flatness or damage is provided. When a loader (4) holds a workpiece (W) aligned by a preheating part (10), a center position of a loader hand (4b) is aligned with a center position of the workpiece (W) according to an amount of positional displacement between an external form position of the workpiece (W) and a reference position in the X-Y direction and the workpiece (W) is then held.

Abstract: A resin molding device that is easy to handle until a thin and large-size workpiece is delivered to a loader, and can supply the workpiece to a mold frame while preventing the workpiece from losing its flatness and being damaged is provided. A resin molding device includes a workpiece transfer part (2) that reciprocates between a first position and a second position and transfers a workpiece (W), and in the workpiece transfer part (2), a holder plate (5) larger than an external form of the workpiece and having a thick plate thickness is mounted on a transfer part main body (2a), and the workpiece (W) that is positioned with respect to and overlaps the holder plate (5) based on the external form is transferred.

Abstract: A resin molding apparatus and a cleaning method of a workpiece which can prevent a workpiece from being carried into a mold die in a state where particles (dust) are adhered to the workpiece, and can prevent deterioration of molding quality. A resin molding apparatus according to the present invention, in which a workpiece with an electronic component mounted on a carrier and a mold resin are carried into a mold die, includes: a press part having the mold die for clamping and resin-sealing the workpiece and the mold resin; and a cleaning apparatus for cleaning a back surface of the workpiece conveyed to the press part, wherein the electronic component is not mounted on the back surface. The cleaning apparatus is arranged at a position overlapping a conveyance path of the workpiece on the upstream side of the press part.

Abstract: To provide a resin molding apparatus capable of correcting the bending of a workpiece during preheating or the like, improving production efficiency, and preventing the occurrence of defective products. A resin molding apparatus according to the present invention includes: a molding die which performs resin molding of a workpiece W having an electronic component mounted inside a carrier; and a loader which transports the workpiece, the loader includes a frame body which comes into contact with and separates from an outer edge portion of an upper surface of the workpiece, a moving device which moves the frame body up and down, and a chuck claw which comes into contact with an outer edge portion of a lower surface of the workpiece, and the frame body includes a contact portion which is provided over the entire circumference of the outer edge portion in the upper surface of the workpiece.

Abstract: A resin molding apparatus that can prevent a workpiece from deflecting during transfer and prevent the occurrence of molding defects due to the deflection is provided. A resin molding apparatus according to the present invention includes a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin and a loader that transfers the workpiece, the loader includes a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and at least during transfer, the workpiece is able to be interposed between the chuck and the frame.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: The compact resin molding machine is capable of efficiently performing a sequence of molding actions from feeding a work and resin to accommodating the molded work. The resin molding machine comprises: a work conveying mechanism including a robot, which has a robot hand for holding the work and which is capable of rotating and linearly moving; a work feeding section for feeding the work; a resin feeding section for feeding the resin; a press section including a molding die set, in which the work is resin-molded; a work accommodating section for accommodating the molded work; and a control section controlling the entire resin molding machine. The work feeding section, the resin feeding section, the press section and the work accommodating section are located to enclose a moving area of the robot of the work conveying mechanism.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.

Abstract: A technology capable of improving the production yield of molded articles. A film is supplied to a die surface of a resin molding die set. Next, the film is adhered to the die surface and caused to be in a state of being separated from the die surface at a corner section of a cavity recess. Next, a die set is closed to clamp the film. Next, a resin filling the interior of the cavity recess is thermoset, on the film provided therebetween, while adhering the film to the corner section.

Abstract: The method is capable of resin-molding one side face of a work in a molding die set, in which the work is sucked and held on at least one of clamping faces and resin-molded in a cavity concave section. The method comprises the steps of: sucking and holding a release film which covers at least one of the clamping faces of the molding die set; setting the work in the molding die set; sucking the other side face of the work through a work sucking hole of the release film, which is formed before or after holding the release film, so as to hold the work on the clamping face; closing the molding die set so as to clamp the work; and pressurizing and heating the resin, which has been accommodated in the cavity concave section, with resin.

Abstract: Provided is a resist film forming device which uses an electrostatic spray device which is capable of forming a thin film with a uniform thickness on a workpiece. A resist film forming device (100), which forms a resist film (108) on a substrate by electrostatic spraying, comprises: a nozzle (102) which, upon application of a prescribed voltage, sprays liquid particles which form the raw material for a resist film (108) toward a substrate (105) having stepped portions (105a); a driving means (111) for causing relative movement of the substrate (105) or the nozzle (102); and a control means (110) for controlling such that the resist film (108) is formed on the substrate (105) having the stepped portions (105a) by the liquid particles.