Abstract: The method of resin molding is capable of preventing molded products from forming resin flash on their surfaces. The method comprises the steps of: covering over a parting face, of at least one of molding dies with release film; clamping a work piece, with the release film, by the molding dies; and filling the melted resin in the molding section of the molding die, wherein the release film is tightly pressed on a surface of a part of the work piece, which is exposed after molding, in the clamping step. By pressing the release film on the surface of the part of the work piece, the release film prevents the melted resin from invading into a gap between the release film and the work piece, so that no resin flash is formed on the surface of the work piece.

Abstract: A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal wall surface of the cavity hole, the method including the steps of: arranging the cavity piece provided in the lower molding die so as to be movable in a direction in which the molding dies are opened or closed; covering a parting surface of each of the resin molding dies with a release film; sucking the release film from an area in the vicinity of an inner bottom surface of the cavity indentation of the lower molding die, to thus form a storage section for storing resin used for a molding operation within the cavity hole; feeding a required amount of resin to the storage section; setting the article on the lower molding die and clamping the article between the resin molding dies; and pressing the cavity piece of the lower mol

Abstract: A resin sealing method for a chip size package electrically connected to electrodes of a semiconductor chip in a chip face of the semiconductor chip with one end of leads joined and the other end thereof exposed to an outer face of a sealing resin for sealing the chip face as connection parts to a package substrate, includes the steps of: providing a first transfer mold formed with a cavity recess in which an object to be molded including the semiconductor chip joined to leads is set, and a second transfer mold mated with the first transfer mold; setting the object to be molded in the cavity recess with a transfer mold face containing the cavity recess of the transfer mold; covering the mold face of the first and second mold with release films having flexibility and heat resistance, respectively; clamping the object to be molded with the transfer mold face of the second mold; and filling the cavity of the first mold with a resin for sealing the package with the resin.

Abstract: In a feeding mechanism 4 which reciprocates the feed arm 80 in a direction of transporting a lead frame, a movable body is linked via a second fulcrum 37 (movable fulcrum) with a rocking arm 30 which is pressingly contacted with a feed cam 11 and which rocks about a first fulcrum 31 (stationary fulcrum), rocking movement of the rocking arm 30 is converted into linear movement of the movable body which is directly coupled to reciprocal movement of the feed arm 80, and the distance between the first fulcrum 31 of the rocking arm 30 and the second fulcrum 37 is changed in the longitudinal direction of the rocking arm 30, thereby enabling a feed stroke of the feed arm 80 to be linearly changed.

Abstract: An object of the present invention is to provide a resin molding machine having molding dies, which have simple structures and which can be easily made. Another object is to provide a method of resin molding using release film, which is capable of employing various materials as a material for the molding dies. In the resin molding machine of the present invention, molding dies have molding sections including cavities, and the molding dies are capable of clamping a member to be molded. A pot pressurizes and sends resin melt to the cavities. A fixing mechanism fixes release film, which is capable of easily peeling off from the molding dies and resin for molding, on inner faces of the molding sections and clamping faces, and the fixing mechanism fixes the release film by sucking air.

Abstract: A method and apparatus for resin molding upon an insert-member. The molding machine includes an upper die and a lower die, a cavity in at least one of the dies, a pot in which resin is introduced, and a resin path which allows the resin to flow from the pot into the cavity and onto the insert-member set in the dies. A film member is set between a parting face of the die and the insert-member. The film member covers a part of the insert-member corresponding to the resin path. An edge of the film member coincides with at least one of side edges of the cavity. The insert-member is clamped by the dies together with the film member when molding occurs.

Abstract: A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.

Abstract: Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first position, an unloading mechanism (C) and a parts-loading mechanism (D) execute to clean parting faces of the mold, and to set resin tablets and insert-parts. The lower die (10) returns to the molding position for next molding. By sliding the lower die (10), works of taking out molded products, setting insert-parts, etc. can be easier, and the molding cycle time can be shortened.

Abstract: In a motor-operated press mechanism, a rocking link is rockingly supported by a supporting shaft which is pivotally supported by a top plate of a press machine, while a crank shaft which supports a crank is supported on one end portion of the rocking link, and a drive section is provided on another end portion of the rocking link, which, in a press working operation, regulates the position of the rocking link so that the crank shaft, the supporting shaft, and the press ram are substantially on a straight line, and, in a resetting operation, swings the rocking link so that the press ram is moved to a retracting position above the position where it is located in the press working operation.

Abstract: An improved lead working machine has a mechanism portion that supplies a leadframe 100, a working and handling portion that performs the necessary working processes on the work as it is fed consecutively, and a receiving mechanism portion that receives the worked products. A plurality of dies 40 and 42 for performing working processes including resin removal, dam bar cutting and lead forming, etc. are provided in tandem in the working and handling portion such that the direction of the working line of the first die 40 aligns with that of the subsequent die 42. A rail mechanism for guiding the lateral edge portions of the leadframe to be transported from the first die 40 to the subsequent die 42, as well as a pickup mechanism, by which a piece part that has been obtained by separating the product portion of the leadframe 100 in the first die 40 is picked up and transported to the subsequent die 42, are provided in positions intermediate between the dies 40 and 42.

Abstract: A transport-by-suction type die for use in a working machine having working stages, the die comprises a feed arm mounted in a position above the working stage in a lower part of the die to be slidable in the direction of consecutive feed and to be vertically movable with respect to a surface of the working stage; suction pads for supporting a piece part by suction, the suction pads being attached to the feed arm at the same interval as that of the working stages; a negative-pressure aspiration mechanism connected with each of the suction pads; and a drive control mechanism for causing the feed arm to move vertically and reciprocate in synchronism with working processes.

Abstract: The object of the present invention is to provide a lead frame taping machine, which is capable of waiting the fade at a position away from a lead frame holding section and preventing the punch from shaking when the tape-chip is taped onto the lead frame. The lead frame taping machine of the present invention comprises: a lead frame holding section for holding a lead frame; a die plate for holding a tape to be punched, the die plate being provided away from the lead frame holding section and having a through punch-hole; a punch being provided away from the die plate, the punch being capable of moving to and away from the lead frame holding section through the through punch-hole whereby the punch is capable of punching the tape and pressing a tape-chip, which has punched off from the tape, onto the lead frame; and a driving mechanism for moving the punch.