Abstract: A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.

Abstract: The purpose of the present invention is to provide a method for efficiently removing a quaternary salt from an organic solvent. The present invention relates to a method for removing a quaternary salt, the method including: contacting a solution of a quaternary salt in an organic solvent with an aqueous solution containing at least one member selected from the group consisting of (a1) compounds having one or more anionic functional groups and (a2) polymers having at least one member selected from the group consisting of carboxyl group and sulfonic acid group, thereby removing the quaternary salt from the organic solvent.

Abstract: A method for manufacturing light-colored purified tall oil rosin includes a distillation process of distilling unpurified tall oil rosin in a presence of activated carbon. A method for manufacturing a tall oil rosin ester includes a rosin production process of producing light-colored purified tall oil rosin by this method for manufacturing, an esterification process of carrying out an esterification reaction of the purified tall oil rosin obtained in the rosin production process and alcohols, and an antioxidant-addition-process of adding at least one antioxidant selected from a sulfur-based organic compound, a thiophosphite-based organic compound and a phosphorus-based antioxidant during or after the esterification process.

Abstract: The present invention provides a heat dissipating coating composition in a liquid or paste form for application to a heat generating article, comprising an infrared absorbing binder resin (A), infrared absorbing inorganic particles (B), and an organic solvent, having such proportions of the component (A) and the component (B) that the component (A) is 10 to 70 vol % and the component (B) is 90 to 30 vol % based on the total of both components being 100 vol %, and satisfying conditions 1, 2, and 3 specified herein, and also provides a heat dissipating coating film obtained by applying the heat dissipating coating composition to a heat dissipating article and then thermally curing the composition.

Abstract: A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H2N—(CH2)n—X—(CH2)n—NH2 (wherein n represents an integer of 1 to 6 and X represents —NH—CH2CH2—NH— or a piperazine residue).

Abstract: To provide a method for producing an epoxy compound having fewer residual quaternary salt compound by removing the quaternary salt compound from an organic solution containing an epoxy compound and the quaternary salt compound.

Abstract: The object of the present invention is to provide a soldering-flux-oriented novel base resin that enhances the fluidity of a soldering flux and both the visco-stability and adhesion of a solder paste, while improving the color tone and anti-crack property of the flux residue. The present invention is directed to a base resin for a soldering flux, the base resin comprising a rosin (A) containing at least 15 wt % of a pimarane-type resin acid (a-1), at least 1 wt % of a labdane-type resin acid (a-2), and at least 50 wt % of an abietane-type resin acid that has no conjugated double bond (a-3).

Abstract: The present invention provides a hot melt adhesive composition comprising (A) an ethylene copolymer obtained by copolymerizing ethylene and ?-olefin using a single-site catalyst and (B) a rosin ester, in a hydrolyzate of which a dehydroabietic acid content is 30 wt % or less and an abietic acid content is 10 wt % or less, and in a methylated product of the hydrolyzate of which a content of components having a molecular weight of 320 is equal to or greater than 10 wt % of a total amount of components having a molecular weight of 314 to 320.

Abstract: An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.

Abstract: A thermally decomposable binder resin containing, as an active ingredient, a rosin derivative (A) that is obtained by subjecting a rosin (a) to distillation and a disproportionation treatment and/or hydrogenation treatment, wherein the rosin derivative (A) has a 99 wt % weight loss temperature of 500° C. or lower in thermogravimetric measurement, under an air atmosphere at a heating rate of 5° C./min, a binder resin composition containing the resin, and a use of the binder resin composition.

Abstract: The present invention provides a method for producing an epoxy compound, comprising oxidizing a carbon-carbon double bond of an organic compound by hydrogen peroxide in the presence of a neutral inorganic salt and a mixed catalyst of a tungsten compound (a), at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphonic acids, and salts thereof (b) and a surfactant (c), and an epoxidizing method comprising oxidizing a carbon-carbon double bond by hydrogen peroxide in the presence of the catalyst and the neutral inorganic salt.

Abstract: To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.

Abstract: To provide a method for producing an epoxy compound having fewer residual quaternary salt compound by removing the quaternary salt compound from an organic solution containing an epoxy compound and the quaternary salt compound.

Abstract: The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.

Abstract: An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 ?m.

Abstract: A principal object of the present invention is to provide a flux which can be used to produce a lead-free solder paste which is excellent in viscosity stability and exhibits excellent wettability at the time of soldering even in atmospheric air. The flux is a lead-free solder flux having a bromine atom concentration of 400 to 20000 ppm based on 0.1 g of the flux and comprising 0.01 to 0.7% by weight of an amine compound (a) represented by the general formula (1): H2N—(CH2)n—X—(CH2)n—NH2 (wherein n represents an integer of 1 to 6 and X represents —NH—CH2CH2—NH— or a piperazine residue).

Abstract: A rosin-modified phenolic resin, which consists of a reaction product among (a) a rosin that contains a component derived from communic acid in an amount of 0.1 to 0.8 wt %, (b) a condensation product of a phenol and formaldehyde, and (c) a polyol. The rosin-modified phenol resin makes it possible to produce a printing ink which has a good balance among ink performances such as fluidity, emulsification resistance, misting resistance, drying properties, and gloss.

Abstract: The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.

Abstract: A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition.

Abstract: A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C6-C15 alkyl group and a (meth)acrylate other than the above-mentioned (meth)acrylate; and rosins. The weight ratio of the acrylic resin is 0.5 or greater and 1.2 or less when the weight of the rosins is taken as 1, and the flux for a solder paste is fluidized by application of a shear force of 10 Pa or greater and 150 Pa or less.