Abstract: A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of 400 Pa·s or greater at 80° C.

Abstract: The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.

Abstract: For the purpose of providing a urethane(meth)acrylate excellent in emulsifiability in water and a production method thereof, and a light curable aqueous emulsion using the urethane(meth)acrylate having a low viscosity and excellent in the curability, provided is a urethane(meth)acrylate being represented by the following general formula (1) and having a weight average molecular weight of 1,000 to 10,000: A1-O—(CONH—B1-NHCOO—C1-O)n-CONH—B1-NH—COO-D1??(1) wherein in formula (1), n represents a natural number of 1 to 30, A1 represents a residue of a hydroxyl group-containing (meth)acrylate, B1 represents a residue of diisocyanate, C1 represents a residue of a diol of an acyclic hydrocarbon or a cyclic hydrocarbon, and D1 represents a residue of a polyoxyalkylene glycol monoalkyl ether.

Abstract: A plurality of spray units spray a cleaning liquid to a plurality of spray-target regions between which a site to be cleaned is interposed. The plurality of spray-target regions are linearly extending. The plurality of spray-target regions each has a spray pattern characterized in that a spray direction when viewed from a direction where the plurality of spray-target regions are linearly extending is perpendicular to a plane including the spray-target region. The spray units are disposed such that the plurality of spray-target regions are arranged in juxtaposition each other. The cleaning liquid sprayed from the spray units crashes against the plurality of spray-target regions and thereby generates cleaning liquid flows headed for the site to cleaned.

Abstract: An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid. The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

Abstract: The present invention provides a method for producing an epoxy compound, comprising oxidizing a carbon-carbon double bond of an organic compound by hydrogen peroxide in the presence of a neutral inorganic salt and a mixed catalyst of a tungsten compound (a), at least one phosphorus compound selected from the group consisting of phosphoric acids, phosphonic acids, and salts thereof (b) and a surfactant (c), and an epoxidizing method comprising oxidizing a carbon-carbon double bond by hydrogen peroxide in the presence of the catalyst and the neutral inorganic salt.

Abstract: An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.

Abstract: An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/° C. in the temperature range from 100 to 200° C., and the nickel plating layer has a thickness of 0.03 to 0.3 ?m.

Abstract: A rosin-modified phenolic resin, comprising a product obtained by reaction of (a) a rosin material containing 0.4 to 10% of dihydroagathic acid, (b) a condensate of a phenolic compound and formaldehyde, and (c) a polyol. The rosin-modified phenol resin is suitable for printing ink applications, and the amount of printing ink mist can reduced without the luster of the printed materials being diminished while maintaining various ink capabilities (dryng properties, emulsifying properties, etc.).

Abstract: It is an assignment to be solved to provide an electrode for secondary battery, electrode in which the active material is suppressed from coming off or falling down from the electricity collector, and that has excellent cyclic performance. It is characterized in that, in an electrode for secondary battery, the electrode being manufactured via an application step of applying a binder resin and an active material onto a surface of electricity collector, said binder resin is an alkoxysilyl group-containing resin that has a structure being specified by formula (I): wherein “R1” is an alkyl group whose number of carbon atoms is from 1 to 8; “R2” is an alkyl group or alkoxyl group whose number of carbon atoms is from 1 to 8; and “q” is an integer of from 1 to 100.

Abstract: An object of this invention is to provide a cleaner composition that has a desirable cleaning property and is easily separable from pre-rinsing water even when cleaning an object produced by using a lead-free soldering flux; and a lead-free soldering flux removal system using a pre-rinsing method that can reduce the amount of waste fluid. The invention uses a cleaner composition for lead-free soldering flux, comprising (A) specific glycol ethers; (B) a specific polyoxyalkylene amine; and (C) a chelating agent that is at least one member selected from the group consisting of (c1) aliphatic hydroxycarboxylic acid chelating agents and (c2) (poly)phosphoric acid chelating agents.

Abstract: A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.

Abstract: A curable resin composition which is easily cured by heating or ultraviolet irradiation and capable of forming a thick cured film due to low shrinkage. This curable resin composition enables to obtain a cured product satisfying various characteristics such as heat resistance, chemical resistance, high surface hardness and high refractive index. Also disclosed is a cured product obtained from such a composition.

Abstract: The object of the present invention is to provide a novel cleaner composition that not only reduces ignition by flame and has a small influence on the environment, but that also has an excellent property of dissolving flux residues adhered on narrow portions or in narrow gaps in an object to be cleaned that was subjected to soldering with a lead-free solder, and reduces recontamination of the object in the water-rinsing process. The present invention uses a halogen-free organic solvent (A) represented by a specific Formula; an amine-based compound (B) represented by a specific Formula; a chelating agent having no amino group (C); and, as required, water.

Abstract: The present invention provides a tackifier that is a raw material of an adherence adhesive having good adhesion performance (in particular, holding power) for all members and can be used for various adherence adhesives, and a tackifier emulsion capable of being used for various aqueous adherence adhesives. The tackifier and the tackifier emulsion including a rosin resin wherein a ratio of the content of a component with a molecular weight of at most 300 comprised in the rosin resin to the softening point of the rosin resin (the content (% by weight) of a component with a molecular weight of at most 300/softening point (K)) is at most 0.004; and the adherence adhesive composition including the tackifier; and the aqueous adherence adhesive composition including the tackifier emulsion.

Abstract: The present invention provides a cleaner composition that can satisfactorily remove lead-free soldering flux adhered to the object to be cleaned, has little impact on the environment, and has odor, inflammability, etc., which are of an acceptable level for practical use; a rinsing agent for rinsing the cleaned object after cleaning with the cleaner composition to remove lead-free soldering flux more effectively; and a removal method using the composition (and the rinsing agent). The cleaner composition for the removal of lead-free soldering flux contains: (A) a polyoxyalkylene phosphate-based surfactant, (B) a metal chelating agent, and (C) a halogen-free organic solvent; and the rinsing agent for removal of lead-free soldering flux contains a carbonate represented by MaHb(CO3)C??General Formula (7) where a is an integer of 1 or 2, b is an integer of 0 to 2, c is an integer of 1 or 2, and M is a volatile organic base.

Abstract: A flux for a lead-free solder that is able to reduce “void(s) appear within solder joint”, “void(s) appear within solder joint”, and “solder-balling” without impairing general solderabilities. The flux for a lead-free solder comprising 6-55 wt % of a polyvalent alcohol ester of a resin acid (a1) as a base resin (A). Further, a solder paste comprising the said flux for a lead-free solder and a lead-free solder powder provides a very small number of void(s) or a very small amount thereof.

Abstract: The present invention provides the following three laminates: First, a polyimide-metal laminate which is obtainable by applying to one side of a metal foil a silane-modified polyimide resin composition (A) comprising alkoxy-containing silane-modified polyimide (a) and a polar solvent (b), drying and curing the composition; Second, a polyamideimide-metal laminate which is obtainable by applying to one side of a metal foil a silane-modified polyamideimide resin composition (C-1) comprising methoxy-containing silane-modified polyamideimide (d), a polar solvent (b) and an inorganic filler (c), drying and curing the composition; and third, a polyimide-metal laminate in which the cured film of the above composition (A) has a metal plated layer thereon.

Abstract: The present invention provides a resin composition for a primer comprising (a) 100 parts by weight of a chlorinated polyolefin having a chlorine content of 5–50 wt. % and a weight-average molecular weight of 30000–120000, and (b) 15–80 parts by weight of a hydroxyl-containing petroleum resin.

Abstract: The cleaning composition of this invention comprises, as effective components, a compound (A) represented by the formula (1) and a nonionic surfactant (B): wherein R1 represents a hydrogen atom or a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms and R2 represents a hydrogen atom or a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms. The cleaning composition of the invention is excellent in detergency and is satisfactory in respect of environmental protection properties, odor and flammability. An article to be cleaned can be cleaned by coming into contact with this cleaning composition.