Abstract: A bottom electrically conductive surface is disposed on the top surface of a substrate and a top electrically conductive surface disposed on the bottom surface of a superstrate. A bare die electronic device is disposed with at least one of its top conductor in direct electrical communication with the bottom electrically conductive surface and/or its bottom conductor in direct electrical communication with the top conductive surface. A non-conductive adhesive secures the substrate to the superstrate so that the bare die electronic device is retained in direct electrical communication. The non-conductive adhesive has a melting point temperature at least greater than a minimum operating temperature of the operating temperature range of the bare die, so that the non-conductive adhesive does not melt and flow thereby preventing a separation or degradation of the direct electrical connection of the bare die electronic device.

Abstract: An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.

Abstract: An electronically active sheet, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; at least one semiconductor element having a first conductor and a second conductor. The electronically active sheet includes an adhesive having at least one semiconductor element fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination. The adhesive is activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into electrical communication with the electrically conductive pattern and so that the other of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface of the first substrate.

Abstract: A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Abstract: A light sheet module includes a light sheet having LEDs on a substrate and a driver circuit for the LEDs. The driver circuit includes a first control loop and a second control loop. The first loop contains TRIACS for regulating current from an external AC power source to the LEDs in response to trigger signals. A constant current circuit receives a command signal indicative of a target current in the LEDs, and generates the trigger signals. Current feedback circuitry generates a current feedback signal indicative of the actual current in the LEDs. The constant current circuit responds to the current feedback circuitry and adjusts the trigger signals so that the actual current in the LEDs more closely approaches the target current. The second control loop contains a Driver controller that generates the command signal and that is responsive to an input device for the Driver controller.

Abstract: A bare die semiconductor device, e.g., a bare die LED, includes a substrate having a bottom face and a bottom die electrode. There is also a top face having a top face edge, a top face area, a top face periphery and a top die electrode. A semiconductor material provides a p-n semiconductor junction between the top and bottom faces. The top die electrode inhibits an external top planar electrode from contact with the top face edges. Such bare die LEDs can be incorporated into a light sheet that has a transparent first substrate having a planar top electrode and a second substrate having a bottom substrate electrode. An adhesive secures the second substrate to the first substrate. Bare die LEDs are disposed in the adhesive with their top die electrodes contacting the top planar electrode and their bottom die electrodes contacting the bottom substrate electrode.

Abstract: A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top substrate is provided having a conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate.

Abstract: A method for making a light active device, including providing a mixture of light active material and a monomer in a first region and a second region. The light active material includes a plurality of electro-statically active microcapsules each comprising OLED material encapsulated within a polymer shell. Chains of the electro-statically active microcapsules are formed in the first region. The monomer is cured to form a polymer in the first region and in the second region to lock the chains of the electro-statically active microcapsules in the first region.

Abstract: A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate.

Abstract: A light active sheet, comprising a first substrate flexible sheet having an electrically conductive surface, a second transparent substrate flexible sheet having a transparent conductive layer disposed thereon, an electrically insulative adhesive flexible sheet and light active semiconductor elements fixed to the electrically insulative adhesive sheet. The light active semiconductor elements each have an n-side and a p-side. The electrically insulative adhesive sheet having the light active semiconductor elements fixed thereon is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination which is activated so that the electrically insulative adhesive electrically insulates and binds the second substrate sheet to the first substrate sheet. One of the n-side and p-side are in electrical communication with the transparent conductive layer and the other of the n-side or the p-side is in electrical communication with the electrically conductive surface.

Abstract: A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Abstract: An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.

Abstract: A photo-radiation source for the selective polymerization of photo-radiation-curable organic material. In a first embodiment, a first electrode is provided with a second electrode disposed adjacent to the first electrode, and defining a gap therebetween. A photo-radiation emission layer is disposed in the gap. The photo-radiation emission layer includes a charge-transport matrix material and an emissive particulate dispersed within the charge-transport matrix material. The emissive particulate receives electrical energy through the charge-transport matrix material applied as a voltage to the first electrode and the second electrode photo-radiation. The emissive particulate generates photo-radiation in response to the applied voltage. This photo-radiation is effective for the selective polymerization of photo-radiation curable organic material.

Abstract: Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

Abstract: A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top transparent substrate is provided having a transparent conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the transparent conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate.

Abstract: A light active device includes a semiconductor particulate dispersed within a carrier material. A first contact layer is provided so that on application of an electric field charge carriers having a polarity are injected into the semiconductor particulate through the conductive carrier material. A second contact layer is provided so that on application of the electric field to the second contact layer charge carriers having an opposite polarity are injected into the semiconductor particulate through the conductive carrier material. The semiconductor particulate comprises at least one of an organic and an inorganic semiconductor. The semiconductor particulate may comprise an organic light active particulate that includes at least one conjugated polymer.

Abstract: Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

Abstract: A method of making a light active sheet. A bottom substrate having an electrically conductive surface is provided. A hotmelt adhesive sheet is provided. Light active semiconductor elements, such as LED die, are embedded in the hotmelt adhesive sheet. The LED die each have a top electrode and a bottom electrode. A top substrate is provided having a conductive layer. The hotmelt adhesive sheet with the embedded LED die is inserted between the electrically conductive surface and the conductive layer to form a lamination. The lamination is run through a heated pressure roller system to melt the hotmelt adhesive sheet and electrically insulate and bind the top substrate to the bottom substrate. As the hotmelt sheet is softened, the LED die breakthrough so that the top electrode comes into electrical contact with the conductive layer of the top substrate and the bottom electrode comes into electrical contact with the electrically conductive surface of the bottom substrate.

Abstract: An electronically active sheet includes a bottom substrate having a bottom electrically conductive surface. A top substrate having a top electrically conductive surface is disposed facing the bottom electrically conductive surface. An electrical insulator separates the bottom electrically conductive surface from the top electrically conductive surface. At least one bare die electronic element is provided having a top conductive side and a bottom conductive side. Each bare die electronic element is disposed so that the top conductive side is in electrical communication with the top electrically conductive surface and so that the bottom conductive side is in electrical communication with the bottom electrically conductive surface.

Abstract: A method of making polymer blend light active particles, comprising the steps of providing a solution comprised of a first organic light active diode material and a second organic light active diode material in a solvent and providing a non-solvent liquid. The method of making polymer blend light active particles also includes the step of adding the solution to the non-solvent liquid to cause a precipitation reaction resulting in multi-layered particles comprising the first and second organic light active diode materials. A method of making a light active electronic device, comprising the steps of providing at least one of organic and inorganic light active particles in a non-solvent liquid; adding a charge transport carrier polymer to the non-solvent liquid to form a fluid carrier/particle mixture; and disposing the mixture between electrodes to form a light active electronic device.