Abstract: An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor.

Abstract: An electronically active sheet, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; at least one semiconductor element having a first conductor and a second conductor. The electronically active sheet includes an adhesive having at least one semiconductor element fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination. The adhesive is activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into electrical communication with the electrically conductive pattern and so that the other of the first conductor and the second conductor of the at least one semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface of the first substrate.

Abstract: A method of manufacturing a photo-radiation source comprising the steps of providing a first planar conductor; disposing a formation of light emitting chips on the first planar conductor, each chip having a cathode and an anode, one of the cathode and anode of each chip being in contact with the first planar conductor. The method of manufacturing a photo-radiation source also includes the steps of disposing a second planar conductor on top of a formation of light emitting chips so that the second planar conductor is in contact with the other of the cathode and anode of each chip; and binding the first planar conductor to the second planar conductor to permanently maintain the formation of light emitting chips without the use of solder or wiring bonding for making an electrical and mechanical contact between the chips and either of the first planar conductor and the second planar conductor.

Abstract: A method for making a sheet of light active material. A first substrate is provided having a transparent first conductive layer. A pattern of light active semiconductor elements are formed. The pattern of light active semiconductor elements may be formed using an electrostatic attraction and transferring process. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate having a second conductive layer is provided. The second substrate is secured to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element in electrical communication with the second conductive layer. Thus, a solid-state sheet of light active material is formed.