Abstract: A multi-row substrate strip mainly includes a plurality of first and second substrate units in parallel, a plurality of connecting bars, a degating metal layer and at least one plating layer. The connecting bars are used to connect the first substrate units and connect the second substrate units. The degating metal layer includes a plurality of runner portions on the connecting bars, a plurality of first gate portions and a plurality of second gate portions. The first gate portions are formed on the first substrate units, and the second gate portions are formed on the second substrate units. The plating layer is formed on the first gate portions and the second gate portions, and exposes the runner portions, so as to save the plating material.

Abstract: A method of manufacturing a substrate for packaging ICs is disclosed, which coats a thin conductive layer on the bottom surface of the laminated circuit board, for electrically connecting the pad and the circuit pattern formed on the bottom surface after one line photolithography/etching step. The pad formed on the top surface of the laminated circuit board can be electrically connected to the power applied in the electroplating process through the electroplating layer in the through hole and the conductive layer. Hence, the times of line photolithography/etching steps required for the prior process can be reduced, thereby solving the issues of lowering yield caused by the line photolithography/etching steps.

Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.