Patents Assigned to ASE (Shanghai) Inc.
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Publication number: 20160140592Abstract: A benefit awarding system includes a terminal device and a server device. The terminal device includes: a first acquiring unit that acquires a product identifier for identifying a product; and a first transmitting unit that transmits a user identifier indicating a user and the product identifier acquired by the first acquiring unit, in a case where this terminal device is positioned inside a shop. The server device includes: a first receiving unit that receives the user identifier and the product identifier transmitted by the terminal device; and an update unit that updates benefit information stored in a storage unit in association with the user identifier received by the first receiving unit, with information indicating benefits corresponding to the product identifier received by the first receiving unit.Type: ApplicationFiled: June 10, 2014Publication date: May 19, 2016Applicants: NTT DOCOMO, INC., ASE Co., Ltd.Inventors: Daisuke KIKUCHI, Keiji ITO, Hitomi UNTEN, Hiromasa TAKUWA, Masutomo UENISHI, Susumu YAMAKAWA, Daisuke NAKAGAWA, Toshio NAKASHIMA, Kouzou SATOU, Shunsuke HATASHITA, Aki OHARA
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Patent number: 9192687Abstract: A machine for disinfecting or sterilizing endoscopes comprises a tunnel having a first opening and a second opening, an upper wall delimiting the tunnel, first and second lateral walls respectively positionable at the first and second openings to obstruct the tunnel, a bath for receiving an endoscope, a bath support, a guide for guiding the bath support and the bath along the tunnel between a first endrun and a second endrun, in which the bath projects externally from the first tunnel opening and the second tunnel opening, respectively, to enable endoscope insertion and extraction. The upper wall forms, with the bath, a closed chamber for treating an endoscope when the bath is inside the tunnel. The first and second lateral walls are removably couplable to the frame to selectively obstruct the tunnel or enable the bath support and bath to reach the respective endruns.Type: GrantFiled: November 28, 2013Date of Patent: November 24, 2015Assignee: ASE S.R.L.Inventor: Marco Lanzoni
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Publication number: 20150290349Abstract: A machine for disinfecting or sterilizing endoscopes comprises a tunnel having a first opening and a second opening, an upper wall delimiting the tunnel, first and second lateral walls respectively positionable at the first and second openings to obstruct the tunnel, a bath for receiving an endoscope, a bath support, a guide for guiding the bath support and the bath along the tunnel between a first endrun and a second endrun, in which the bath projects externally from the first tunnel opening and the second tunnel opening, respectively, to enable endoscope insertion and extraction. The upper wall forms, with the bath, a closed chamber for treating an endoscope when the bath is inside the tunnel. The first and second lateral walls are removably couplable to the frame to selectively obstruct the tunnel or enable the bath support and bath to reach the respective endruns.Type: ApplicationFiled: November 28, 2013Publication date: October 15, 2015Applicant: ASE S.R.L.Inventor: Marco Lanzoni
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Publication number: 20130178616Abstract: The present invention relates to the use of at least one compound of formula (III), (IV), (V) or (VI), in which p is an integer from 0 to 9; and R2 represents hydrogen, allyl, methylnaphthyl, benzyl, paramethoxybenzyl, or halogenoacetyl, for the preparation of a medicament for treating diseases such as tumors, cancer, viral disease, bacterial disease, fungal disease, disease of the immune system, auto-immune disease or disease linked to a deficiency in immunostimulation, in human beings and warm-blooded animals. The invention also relates to new products having a mannose or mannitol termination as well as a method for preparing them.Type: ApplicationFiled: November 19, 2012Publication date: July 11, 2013Applicant: ASE & BIO.Inventor: ASE & BIO.
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Patent number: 8416496Abstract: An optical probe for splitting a beam of light into multiple beams. The optical probe may comprise a first polarizing beam splitter having a first polarization axis, a second polarizing beam splitter having a second polarization axis orthogonal to the first polarization axis, a first half wave plate and a second half wave plate, and optionally a first birefringent phase plate, and a second birefringent phase plate. The first half wave plate may be located before first polarizing beam splitter, and the second half wave plate may be located after the first polarizing beam splitter, relative to the propagation of the light beam. The optical probe may further include a lens for collimating the four light beams. A profilometer includes the optical probe for splitting a beam of light into four light beams, and a scanner for traversing the optical probe over a surface of an element to be measured.Type: GrantFiled: March 20, 2010Date of Patent: April 9, 2013Assignee: ASE Optics Inc.Inventors: Damon W. Diehl, Christopher T. Cotton
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Patent number: 8367641Abstract: The present invention relates to the use of at least one compound of formula (I) or (II), in which R1 is H and n is an integer from 2 to 10, for the preparation of a medicament for treating diseases chosen from the group comprising tumour, cancer, viral disease, bacterial disease, fungal disease, disease of the immune system, auto-immune disease or disease linked to a deficiency in immunostimulation, in human beings and warm-blooded animals. The invention also relates to new products having a mannose or mannitol termination as well as a method for preparing them.Type: GrantFiled: December 20, 2007Date of Patent: February 5, 2013Assignee: ASE & BIOInventors: Jean-Claude Yvin, Karine Descroix, Vincent Ferrieres, Frank Jamois, Isabelle Laurent, Vaclav Vetvika
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Patent number: 8288363Abstract: Disclosed are compositions comprising and methods of using sulphated or phoshated polysaccharides for the treatment of diseases caused by herpes viruses, more particularly by alpha-herpes viruses, and in particular by HSV-1 and HSV-2, as well as by strains of these viruses which are resistant to known antiviral agents.Type: GrantFiled: May 3, 2007Date of Patent: October 16, 2012Assignee: ASE & BIOInventors: Nathalie Bourgougnon, Jean-Claude Yvin
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Publication number: 20120044502Abstract: An optical probe for splitting a beam of light into multiple beams. The optical probe may comprise a first polarizing beam splitter having a first polarization axis, a second polarizing beam splitter having a second polarization axis orthogonal to the first polarization axis, a first half wave plate and a second half wave plate, and optionally a first birefringent phase plate, and a second birefringent phase plate. The first half wave plate may be located before first polarizing beam splitter, and the second half wave plate may be located after the first polarizing beam splitter, relative to the propagation of the light beam. The optical probe may further include a lens for collimating the four light beams. A profilometer includes the optical probe for splitting a beam of light into four light beams, and a scanner for traversing the optical probe over a surface of an element to be measured.Type: ApplicationFiled: March 20, 2010Publication date: February 23, 2012Applicant: ASE OPTICS INC.Inventors: Damon W. Diehl, Christopher T. Cotton
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Patent number: 8059422Abstract: A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.Type: GrantFiled: July 31, 2008Date of Patent: November 15, 2011Assignees: Advanced Semiconductor Engineering, Inc., ASE Electronics Inc.Inventors: Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang, Teck-Chong Lee, Jen-Chieh Kao, Jau-Shoung Chen
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Patent number: 8053175Abstract: A method of forming measuring targets for measuring the dimensions of a substrate during a substrate manufacturing process is provided. First, a board having a base layer and a conductive layer is provided, wherein the conductive layer is disposed on a surface of the base layer. Then, at least one through hole is formed in the board as a measuring target for measuring the dimensions of the substrate. Next, a plated via is formed in the through hole as another measuring target for measuring the dimensions of the substrate. Thereafter, a patterned dielectric layer is formed on the board to expose the plated via as a next measuring target for measuring the dimensions of the substrate. In the present invention, measuring targets are formed during a substrate manufacturing process and the dimensions of the substrate are measured instantly. The accuracy in process alignment is improved without increasing the fabrication cost.Type: GrantFiled: June 10, 2008Date of Patent: November 8, 2011Assignee: ASE Electroncis Inc.Inventor: Hsiang-Ming Feng
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Patent number: 7779007Abstract: Methods of identifying content of interest within a corpus are disclosed. The methods may comprise the step of applying a first marker set to the corpus, where the first marker set comprises at least one marker identifying a first type of text. For a first textual unit included in the corpus, the methods may comprise generating a score for the first marker set and comparing the score to a reference score. The score may indicate a number of instances of the at least one marker in the first textual unit.Type: GrantFiled: June 8, 2007Date of Patent: August 17, 2010Assignee: ASE Edge, Inc.Inventors: Wayne J. West, Arthur R. Crivella, Clayton Darwin
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Patent number: 7675618Abstract: A multiplexing spectrometer measures at least one parameter, such as temperature, pressure or stress. The system multiplexes the outputs of Bragg stack sensors deposited at the distant ends of optical fibers brought in contact or in close proximity to objects. The spectrometer detects the peaks of the optical signals returned from the Bragg stacks and converts them into corresponding values of the parameters of interest. The spectrometer includes an optical system that comprises an entrance slit, a diffraction grating as a light dispersing means. Multiplexing occurs on a two-dimensional solid state matrix photo detector detects and converts the light signals returned from the Bragg stack sensing elements into corresponding electrical signals, and a built-in look-up table to provides the values of the parameters of interest that correspond the spectral characteristics of the returned light signals.Type: GrantFiled: April 16, 2007Date of Patent: March 9, 2010Assignee: ASE Optics, Inc.Inventors: Todd Blalock, Christopher Cotton
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Publication number: 20090258320Abstract: A method of forming measuring targets for measuring the dimensions of a substrate during a substrate manufacturing process is provided. First, a board having a base layer and a conductive layer is provided, wherein the conductive layer is disposed on a surface of the base layer. Then, at least one through hole is formed in the board as a measuring target for measuring the dimensions of the substrate. Next, a plated via is formed in the through hole as another measuring target for measuring the dimensions of the substrate. Thereafter, a patterned dielectric layer is formed on the board to expose the plated via as a next measuring target for measuring the dimensions of the substrate. In the present invention, measuring targets are formed during a substrate manufacturing process and the dimensions of the substrate are measured instantly. The accuracy in process alignment is improved without increasing the fabrication cost.Type: ApplicationFiled: June 10, 2008Publication date: October 15, 2009Applicant: ASE Electronics Inc.Inventor: Hsiang-Ming Feng
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Patent number: 7511366Abstract: A multi-row substrate strip mainly includes a plurality of first and second substrate units in parallel, a plurality of connecting bars, a degating metal layer and at least one plating layer. The connecting bars are used to connect the first substrate units and connect the second substrate units. The degating metal layer includes a plurality of runner portions on the connecting bars, a plurality of first gate portions and a plurality of second gate portions. The first gate portions are formed on the first substrate units, and the second gate portions are formed on the second substrate units. The plating layer is formed on the first gate portions and the second gate portions, and exposes the runner portions, so as to save the plating material.Type: GrantFiled: October 26, 2005Date of Patent: March 31, 2009Assignee: Ase (Shanghai) Inc.Inventors: Yao-Ting Huang, Kuang-Lin Lo
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Publication number: 20090075027Abstract: A manufacturing process for a thermally enhanced package is disclosed. First, a substrate strip including at least a substrate is provided. Next, at least a chip is disposed on an upper surface of the substrate, and the chip is electrically connected to the substrate. Then, a prepreg and a heat dissipating metal layer are provided, and the heat dissipating metal layer is disposed on a first surface of the prepreg and a second surface of the prepreg faces toward the chip. Finally, the prepreg covers the chip by laminating the prepreg and the substrate.Type: ApplicationFiled: July 31, 2008Publication date: March 19, 2009Applicants: ADVANCED SEMICONDUCTOR ENGINEERING, INC., ASE ELECTRONICS INC.Inventors: Ho-Ming Tong, Shin-Hua Chao, Ming-Chiang Lee, Tai-Yuan Huang, Chao-Yuan Liu, Yung-Cheng Huang, Teck-Chong Lee, Jen-Chieh Kao, Jau-Shoung Chen
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Patent number: 7504282Abstract: A method of manufacturing a substrate for packaging ICs is disclosed, which coats a thin conductive layer on the bottom surface of the laminated circuit board, for electrically connecting the pad and the circuit pattern formed on the bottom surface after one line photolithography/etching step. The pad formed on the top surface of the laminated circuit board can be electrically connected to the power applied in the electroplating process through the electroplating layer in the through hole and the conductive layer. Hence, the times of line photolithography/etching steps required for the prior process can be reduced, thereby solving the issues of lowering yield caused by the line photolithography/etching steps.Type: GrantFiled: November 28, 2006Date of Patent: March 17, 2009Assignee: ASE (Shanghai) Inc.Inventor: Chi-Chao Tseng
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Publication number: 20090055503Abstract: A method of tracking electronic communications may include generating a notification in response to receiving information associated with an insurance claim. The content of the notification may be defined by one or more first business rules. The method may include receiving an identifier associated with the received notification, generating an electronic message comprising the notification and the identifier and sending the electronic message to one or more recipients. The one or more recipients may be defined by one or more second business rules.Type: ApplicationFiled: June 2, 2008Publication date: February 26, 2009Applicant: ASE EDGE, INC.Inventors: Arthur R. Crivella, Wayne J. West
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Patent number: 7445944Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.Type: GrantFiled: December 28, 2006Date of Patent: November 4, 2008Assignee: ASE (Shanghai) Inc.Inventors: Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Che-Ya Chou, Shin-Hua Chao, Song-Fu Yang, Kao-Ming Su
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Patent number: 6940182Abstract: A dam or barrier around the periphery of a die in a flip-chip package changes the shape of the underfill to reduce stress resulting from edge effects. The dam can include a treated region of a substrate having an affinity to an underfill material. The treated region causes liquid underfill material to bead, thereby controlling the wetting angle of the underfill material and shaping the underfill to eliminate sources of stress such as underfill fillet regions that are subject to significant shrinkage. The dammed underfill additionally avoids or reduces the extent of areas having thermal coefficients of expansion that differ from the optimal level because of low filler particle concentration.Type: GrantFiled: March 29, 2004Date of Patent: September 6, 2005Assignees: Celerity Research Pte. Ltd., ASE Electronics (M) Sdn. Bhd.Inventors: Robert M. Hilton, Sabran B. Samsuri
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Patent number: 6883008Abstract: A system is provided for utilizing audible, visual and textual data with multimedia forms of presenting information for real-time interactive use by multiple users in different remote environments. Library science concepts are utilized to uniformly categorize the information managed by the system, and linguistics concepts are implemented for defining information acquisition, exchange and workflow to permit categorization of the managed information using the library science concept. Managed information is stored in a database according to a unique schema which implements this categorization.Type: GrantFiled: July 31, 2001Date of Patent: April 19, 2005Assignee: ASE Edge, Inc.Inventors: Arthur Ray Crivella, Wayne Jacob West