Abstract: A centrifugal-to-axial mixed flow blower includes a blower enclosure defining a blower chamber and a centrifugal impeller supported on an impeller seat to suspend in the blower chamber. The centrifugal impeller includes a plurality of blades and a radially outward declined flow passage defined between any two adjacent blades and communicable with the blower chamber. The blower chamber is communicable with a rectangular air outlet of a heat dissipation system via a frame passage of a flow guide frame connected to below the blower enclosure. Air stream centrifugally drawn in by the centrifugal impeller passes through the declined flow passages to radially outward and downward flow into the blower chamber and then passes through the frame passage to flow axially through the rectangular air outlet into the heat dissipation system, so as to realize the effects of reduced noise, changing centrifugal vortical flow into axial flow, and decreased flow loss.

Abstract: A fan electrical connection structure includes a fan having a fan frame, which has a circuit board and an electrical connection section provided therein. The electrical connection section includes a plurality of metal terminals and is extended in a direction parallel to an air flow passage defined in the fan frame. The metal terminals respectively have an end electrically connected to the circuit board and another end extended into the electrical connection section. With the above arrangements, parts for electrical connection in the fan are simplified and can be easily connected or disconnected by a user with only one hand.

Abstract: A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome.

Abstract: A vapor chamber structure includes an upper plate, a lower plate, a middle layer and a polymer layer. The polymer layer is selectively connected with any of the upper and lower plates. The lower plate and the upper plate are mated with each other to together define a chamber. A working fluid is filled in the chamber. The middle layer is disposed in the chamber. The middle layer has a first face, a second face, multiple perforations and multiple channels. The multiple perforations pass through the first and second faces. The multiple channels are disposed on one of the first and second faces. By means of the above arrangement, the total thickness of the vapor chamber structure is equal to or smaller than 0.25 mm, whereby the vapor chamber can be extremely thinned.

Abstract: A knockdown water-cooling module latch device structure is assembled and connected with a water-cooling module. The knockdown water-cooling module latch device structure includes a latch device assembly having multiple latch members. The multiple latch members are correspondingly assembled and connected with each other around the water-cooling module to form the knockdown water-cooling module latch device structure, whereby the water-cooling module is framed in the latch device assembly. The knockdown water-cooling module latch device structure can be conveniently assembled and has high assembling freeness and better structural strength.

Abstract: A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

Abstract: A fan engagement structure for the fan to quickly and securely plug into or extract out of another structure. The fan engagement structure includes a frame main body. The frame main body has a first end and a second end. The frame main body has an internal hollow passage. The first end is mated with a fan. The frame main body has a first side and a second side. An engagement elastic plate extends from the first side. The surface of the engagement elastic plate has a latch section. The second side has a finger latch section, whereby the fan can be quickly and securely plugged into or extracted out of the other structure.

Abstract: A fan inspection jig includes a jig assembly having multiple spring abutment pillars for holding two sides of a fan (or a series fan) to make the fan or the series fan positioned in a suspending position. A vibration sensor is disposed in at least one of the spring abutment pillars of two sides of the fan for measuring a vibration signal of the fan in operation.

Abstract: A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.

Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.

Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.

Abstract: A centrifugal fan noise-lowering structure includes a frame having an upper and a lower cover and a sidewall, which together internally define a receiving space communicable with an air inlet and an air outlet of the frame; a stator assembly located in the receiving space and fixedly mounted on the lower cover; and a rotor assembly correspondingly assembled to the stator assembly. The receiving space is internally defined a high pressure zone and a low pressure zone. The upper cover is provided with an airflow passage, which has an inlet located at a position corresponding to the high pressure zone, and an outlet located at a position corresponding to the low pressure zone. With the airflow passage, air in the high pressure zone can be guided to jet out to the low pressure zone to thereby reduce noise produced by the centrifugal fan during its operation.

Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.

Abstract: A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.

Abstract: A fluid pressurizing structure and fan using same are disclosed. The fluid pressurizing structure includes a hub having a plate portion located therearound. The plate portion has a first and a second surface provided with a plurality of first and second hollow protrusions, respectively. Each of the first hollow protrusions has a first fluid inlet and a first fluid outlet, and each of the second hollow protrusions has a second fluid inlet and a second fluid outlet. The first and second fluid outlets extend through the plate portion to communicate the first and second fluid inlets with the second and first surface, respectively. When the fan rotates, fluid drawn thereinto sequentially flows through the first fluid inlets and outlets and the second fluid inlets and outlets in a helical movement in cycles, and is therefore continuously pressurized, which facilitates reduced fan vibration and noise and fan motor power consumption.

Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.

Abstract: A centrifugal fan frame body structure includes a lower case body and a cover body. The lower case body has a bottom section and an outer wall section. The outer wall section is formed with a wind outlet. The cover body and the lower case body are correspondingly mated with each other to form a space. In the space, the lower case body and the cover body define therebetween a first height. The lower case body and the cover body define therebetween a second height at the wind outlet. The second height is larger than the first height. The height of the wind outlet is enlarged, whereby the wind outlet will not be blocked by the cooperative heat dissipation component (module) so that the flow field efficiency is enhanced and the noise is lowered.

Abstract: A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.