Abstract: A vapor chamber structure includes a main body, a fan and perforations. The main body has a heat absorption section, a heat dissipation section and a chamber. The heat absorption section and the heat dissipation section are respectively horizontally disposed on left and right sides of the main body. The heat absorption section is attached to at least one heat source. The chamber is positioned at the heat absorption section and partially extends to the heat dissipation section. The chamber has a capillary structure and at least one perforated section. The perforated section is connected between an upper side and a lower side of the chamber. The fan is disposed on one side of the heat dissipation section. The perforations are formed through the parts of the main body, which parts are free from the chamber and the parts of the main body, where the perforated section is disposed.

Abstract: A face identification camera module includes a circuit board, a camera device, at least one infrared LED light-emitting unit, an image processor and a connector. The respective units are disposed on a first side of the circuit board and electrically connected with the circuit board. The infrared LED light-emitting unit is disposed on left and right sides of the camera device. The infrared LED light-emitting unit serves to enhance the brightness, uniformity and contrast of the image so that a higher identification ratio can be achieved and a higher-definition face feature identification effect can be obtained by the camera device.

Abstract: A water-cooling radiator structure with internal partition member includes a water-cooling radiator unit, which includes a first water-receiving plate defining a first inner space and having a water inlet and a water outlet fluid-communicable with the first inner space. A working fluid flows into the first inner space via the water inlet and leaves the first inner space via the water outlet. The first inner space is internally provided with at least one first partition member, which horizontally divides the first inner space into a plurality of independent water chambers, so that the working fluid sequentially flow through the water chambers.

Abstract: A heat dissipation unit includes a main body and a mesh body. The main body has an upper plate and a lower plate. The upper and lower plates are correspondingly overlapped and mated with each other to together define an airtight chamber. A working fluid is contained in the airtight chamber. One face of the lower plate, which faces the airtight chamber, is formed with a capillary structure by means of laser processing. The mesh body is attached to the face of the lower plate with the capillary structure. By means of the mesh body, the liquid working fluid backflow efficiency of the capillary structure can be enhanced and the water content of the internal evaporation section of the heat dissipation unit can be increased to avoid dry burn.

Abstract: A heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A locating unit with a base seat locating structure. The base seat locating structure includes a base seat and a locating unit. The base seat has a pair of locating holes each having a first locating hole section and a second locating hole section and a connection section connected therebetween. The second locating hole section has a locating recess. The locating unit has a main body having a first side and a second side and a through hole passing through the main body between the first and second sides. A first protruding key and a second protruding key protrude from the second side beside the through hole. The first and second protruding keys are displaceably assembled and connected with the locating holes. Free ends of the first and second protruding keys respectively have a first end section and a second end section connected and assembled with the locating recesses.

Abstract: A fixing structure for heat dissipation assembly includes a base and multiple female fastener holders. The base has at least one through bore axially extending through an upper and a lower surface thereof, as well as coupling holes located outside the through bore and respectively having an engaging element disposed therein. The female fastener holder has a lower side formed with coupling protrusions corresponding to the coupling holes. The coupling protrusion has a guiding groove radially provided thereon and having a lower and an upper end recess for engaging with the engaging element in the corresponding coupling hole. The engaging elements in the coupling holes are guided by the guiding grooves to move from the lower to the upper recesses when the female fastener holder is turned relative to the through bore and the coupling holes on the base, bringing the coupling protrusions to axially insert into the coupling holes.

Abstract: A thermal module assembling structure includes a heat dissipation board and at least one heat pipe. The heat dissipation board has a receiving channel for fitting the heat pipe therethrough. Two sides of upper side of the receiving channel are respectively formed with two ribs. The ribs horizontally protrude and extend toward the middle of the receiving channel to face the heat pipe fitted in the receiving channel. At least one deformed recess is formed on an upper surface of each of the ribs, whereby the lower surfaces of the ribs and a surface of the heat pipe are deformed to form at least one deformed connection section between the lower surfaces of the ribs and the surface of the heat pipe. By means of the restriction of the deformed connection section, the heat pipe is prevented from being extracted out of the receiving channel.

Abstract: A liquid transfer module is applied to a liquid cooling system. The liquid transfer module includes a first flow guide body and a second flow guide body removably connected with a liquid reservoir tank and a pump unit. The first and second flow guide bodies are formed with multiple internal flow passages. Some of the flow passages communicate with each other via a check valve and some other flow passages communicate with each other via an opening. The liquid transfer module serves to transfer and guide a working liquid to flow through the liquid reservoir tank and the pump unit.

Abstract: A manufacturing method of heat dissipation unit includes steps of: providing a mold having an upper mold section and a lower mold section, the lower mold section being formed with a receiving depression and at least one sink; providing an upper plate, a lower plate, a capillary structure and at least one heat conduction member, the heat conduction member being positioned in the sink, the lower plate, the capillary structure and the upper plate being sequentially positioned in the receiving depression, then the heat conduction member, the lower plate, the capillary structure and the upper plate being thermally pressed and connected with each other by means of the upper and lower mold sections; and integrally connecting the heat conduction member with the lower plate when the upper and lower plates are thermally pressed and connected to form the plate body by means of the upper and lower mold sections.

Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.

Abstract: A fan structure includes a frame body and a fan impeller. The frame body has a base seat and an annular wall. A bearing cup upward extends from a center of the base seat. At least one groove is annularly formed on inner wall face of the annular wall. The fan impeller is pivotally disposed in the bearing cup and has a hub and multiple blades outward extending from the hub. Each blade has an end edge. At least one protrusion section outward protrudes from the end edge into the groove. According to the design of the fan structure, the protrusion section can destroy the production of the vortex of the blade of the conventional fan so as to greatly minify the strength of the vortex. Therefore, the structure of the sound field of the vortex is changed so that the noise of the fan structure is lowered.

Abstract: A heat-conducting case unit for handheld electronic device includes a ceramic back cover having an outer surface and an inner surface. The inner surface faces a receiving space of the handheld electronic device and has a heat conducting element provided thereon to contact with at least one heat source in the receiving space, and the heat conducting element has a thermal conductivity higher than that of the ceramic back cover. The outer surface is exposed to an external environment. Heat produced by the heat source is transferred via the heat conducting element to the ceramic back cover, from where the produced heat is dissipated into the external environment.

Abstract: A case heat dissipation unit of handheld electronic device includes a back cover including a ceramic layer. A titanium metal layer or a stainless steel metal layer is disposed on the ceramic layer in a position corresponding to at least one heat source. The ceramic layer is an outer surface of the handheld electronic device and exposed to an external environment. The titanium metal layer or the stainless steel metal layer faces a receiving space of the handheld electronic device in contact with the heat source in the receiving space. The titanium metal layer or the stainless steel metal layer serves to absorb the heat generated by the heat source and transfer the heat to the ceramic layer for dissipating the heat.

Abstract: A fan wire trimming module includes a lower moldboard, an upper moldboard and a base plate. One side of the lower moldboard is formed with a depression and multiple locating bosses. One side of the upper moldboard is formed with multiple locating holes. A periphery of the upper moldboard is formed with at least one fixing split. The locating bosses are fitted in the locating holes. A fixing member is assembled in the fixing split. The upper moldboard is formed with a stator receiving space and at least one hollow section. An inner circumference of the stator receiving space is formed with at least one rib. The hollow section is formed around the stator receiving space. A stator assembly is received in the stator receiving space. Multiple windings are wound on the stator assembly. One end of each winding is engaged in the fixing split.

Abstract: A securing unit and a base seat securing structure. The base seat securing structure includes a base seat and multiple securing units. The base seat has a top side, a bottom side, multiple perforations and multiple securing holes formed through the base seat between the top side and the bottom side. The securing holes are positioned around the perforations. Each securing unit has a seat section disposed on the top side of the base seat and multiple connection sections. The seat section has a bore in communication with and corresponding to the perforation. The connection sections are disposed under a lower side of the seat section. One end of each connection section has one or multiple stopper end sections. The stopper end sections are passed through the corresponding securing holes to abut against the bottom side of the base seat.

Abstract: A fan noise-lowering structure includes a fan frame main body and a connection section. The fan frame main body has a bottom side and a frame peripheral wall. The frame peripheral wall is perpendicularly annularly disposed on the outer rim of the bottom side. The inner rim of the frame peripheral wall defines an airflow passage. Two ends of the airflow passage respectively have an inlet and an outlet. The connection section is disposed in the frame peripheral wall. Two ends of the connection section are connected with the frame peripheral wall. The two ends of the middle passage are an inlet end and an outlet end in communication with the airflow passage. The connection section serves to guide the high-pressure air of the outlet to jet toward the inlet so as to achieve multiple noise-lowering effects.