Patents Assigned to Asia Vital Components
  • Patent number: 11598584
    Abstract: A dual heat transfer structure, comprising: at least a heat pipe and at least a vapor chamber; the heat pipe having a first end, an extension portion, and a second end, the first and second ends disposed at the two ends of the extension portion; the vapor chamber being concavely bent with its two ends being joined together and selectively compasses, encircles, encloses, or surrounds one of the first and second ends and extension portion. The dual heat transfer structure of the present invention is a complex structure that can both transfer heat with a large area and to the distal end of the structure.
    Type: Grant
    Filed: April 15, 2020
    Date of Patent: March 7, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Sheng-Huang Lin
  • Patent number: 11564329
    Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: January 24, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sheng-Huang Lin, Yen-Lin Chu
  • Patent number: 11555653
    Abstract: A vapor/liquid condensation system includes a condensation unit and an evaporation unit. The condensation unit is connected with the evaporation unit via conduits. The evaporation unit has a liquid inlet, a vapor outlet and an evaporation chamber in communication with each other. The evaporation unit converts liquid-phase working fluid into vapor-phase working fluid, which spreads to the condensation unit. The condensation unit cools and condenses the vapor-phase working fluid into liquid-phase working fluid, which goes back the evaporation unit. After the vapor-phase working fluid enters the condensation unit, the vapor-phase working fluid is distributed and condensed into liquid-phase working fluid. Then the liquid-phase working fluid is collected and then goes back to the evaporation unit. The length of the pipeline is shortened and the pipeline pressure is lowered to avoid interruption of heat dissipation circulation and failure in heat dissipation.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: January 17, 2023
    Assignee: ASIA VITAL COMPONENTS CO. LTD.
    Inventors: Chih-Peng Chen, Yu-Min Lin
  • Patent number: 11542960
    Abstract: A centrifugal fan noise-lowering structure includes a frame having an upper and a lower cover and a sidewall, which together internally define a receiving space communicable with an air inlet and an air outlet of the frame; a stator assembly located in the receiving space and fixedly mounted on the lower cover; and a rotor assembly correspondingly assembled to the stator assembly. The receiving space is internally defined a high pressure zone and a low pressure zone. The upper cover is provided with an airflow passage, which has an inlet located at a position corresponding to the high pressure zone, and an outlet located at a position corresponding to the low pressure zone. With the airflow passage, air in the high pressure zone can be guided to jet out to the low pressure zone to thereby reduce noise produced by the centrifugal fan during its operation.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: January 3, 2023
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Yu-Tzu Chen, Chung-Shu Wang
  • Patent number: 11525635
    Abstract: A vapor chamber water-filling section sealing structure. The vapor chamber water-filling section sealing structure includes a main body and a capillary structure. The main body has a first plate body and a second plate body, which are correspondingly mated with each other to together define an airtight chamber and a water-filling section. A flange is disposed along an outer periphery of the main body. The water-filling section has a water-filling notch and a water-filling passage. Two ends of the water-filling passage are respectively connected with the flange and the water-filling notch to communicate with the airtight chamber. A portion of the water-filling passage that is connected with the flange is pressed to have a height equal to the height of the flange or lower than the height of the flange. The capillary structure is disposed in the airtight chamber of the main body.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: December 13, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Xiao-Xiang Zhou, Jian Zhang, Han-Min Liu
  • Patent number: 11525463
    Abstract: A fluid pressurizing structure and fan using same are disclosed. The fluid pressurizing structure includes a hub having a plate portion located therearound. The plate portion has a first and a second surface provided with a plurality of first and second hollow protrusions, respectively. Each of the first hollow protrusions has a first fluid inlet and a first fluid outlet, and each of the second hollow protrusions has a second fluid inlet and a second fluid outlet. The first and second fluid outlets extend through the plate portion to communicate the first and second fluid inlets with the second and first surface, respectively. When the fan rotates, fluid drawn thereinto sequentially flows through the first fluid inlets and outlets and the second fluid inlets and outlets in a helical movement in cycles, and is therefore continuously pressurized, which facilitates reduced fan vibration and noise and fan motor power consumption.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: December 13, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11525452
    Abstract: A fan frame body structure includes a first frame body. The first frame body has a first upper end, a first lower end, a first frame wall and a first main flow way. The first main flow way passes through the first frame body and is formed with a first main inlet and a first main outlet respectively at the first upper end and the first lower end. A first subsidiary flow way is disposed in the first frame wall. The first subsidiary flow way is in parallel the first main flow way. The first subsidiary outlet is positioned at the first upper end of the first frame body in flush with and in adjacency to the first main inlet.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: December 13, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventors: Sung-Wei Sun, Chu-Hsien Chou, Yi-Chih Lin, Pei-Chuan Lee, Wen-Hao Liu
  • Patent number: 11512711
    Abstract: A centrifugal fan frame body structure includes a lower case body and a cover body. The lower case body has a bottom section and an outer wall section. The outer wall section is formed with a wind outlet. The cover body and the lower case body are correspondingly mated with each other to form a space. In the space, the lower case body and the cover body define therebetween a first height. The lower case body and the cover body define therebetween a second height at the wind outlet. The second height is larger than the first height. The height of the wind outlet is enlarged, whereby the wind outlet will not be blocked by the cooperative heat dissipation component (module) so that the flow field efficiency is enhanced and the noise is lowered.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: November 29, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11516940
    Abstract: A middle bezel frame with heat dissipation structure includes a main body, which includes a frame portion and at least one heat-exchange portion. The frame portion is located around and connected to the heat-exchange portion. The heat-exchange portion internally has an airtight chamber, in which at least one wick structure and a working fluid are provided. With these arrangement, the middle bezel frame has enhanced structural strength while provides good heat dissipation effect.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: November 29, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventor: Ming-Tai Weng
  • Patent number: 11473591
    Abstract: A fan blade unit and a fan impeller structure thereof. The fan blade unit includes a main body having a root section and an end section. The root section is connected with a hub. The end section extends in a radial direction away from the hub. The end section defines a first direction and a second direction. Multiple protrusion bodies are disposed at the end section and at least one channel is formed between the protrusion bodies. The channel extends in the first direction. The fan blade unit is applied to the fan impeller structure. When the fan impeller rotates, a high-pressure area is created between the channel and the wall of the outer frame of the fan, whereby the airflow is restrained from turning over from the lower wing face to the upper wing face to generate wingtip vortex.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: October 18, 2022
    Assignee: Asia Vital Components (China) Co., Ltd.
    Inventors: Chung-Shu Wang, Yu-Tzu Chen
  • Patent number: 11466937
    Abstract: A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: October 11, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Kuei-Feng Chiang
  • Patent number: 11448474
    Abstract: A protection element for vapor chamber includes a main body and a protection element. The main body is divided into a working zone and a sealing zone. The sealing zone is located around an outer periphery of the working zone and is provided with a notch area, to which a fluid-adding and air-evacuating pipe is connected. The protection element is correspondingly mounted to the notch area to contact with the sealing zone of the main body. With the arrangement of the protection element, the fluid-adding and air-evacuating pipe is protected against collision and impact and accordingly, the main body of the vapor chamber is protected against vacuum and working fluid leakage.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: September 20, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Han-Min Liu, Jian Zhang, Xiao-Xiang Zhou
  • Patent number: 11448226
    Abstract: The present invention is a fan having rotation sensing, comprising a casing, a motor disposed within the casing, a rotation sensing unit, and a control unit, the rotation sensing unit detecting a first rotation of the casing and outputting a first sensing signal, the control unit having a controller electrically coupled to the rotation sensing unit and the motor, the controller receiving the first sensing signal according thereto to control the motor to perform a first operation mode. Through this design, an operation mode of the fan can be adjusted according to the rotation of the fan in the present invention.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: September 20, 2022
    Assignee: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Po-Sheng Huang
  • Patent number: 11435144
    Abstract: A heat dissipation device includes a base seat having a first chamber. The first chamber has multiple partitioning sections to partition the first chamber into multiple rooms without communicating with each other. A first working fluid is disposed in the rooms. Multiple two-phase fluid radiating fins are disposed on upper side of the base seat. Each of the two-phase fluid radiating fins is formed with an internal second chamber in communication with the rooms or not in communication with the rooms. The heat dissipation device can achieve better heat dissipation effect.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: September 6, 2022
    Assignee: Asia Vital Components (China) Co., Ltd.
    Inventors: Han-Min Liu, Jian Zhang, Xing-Xing Lyu
  • Patent number: 11401946
    Abstract: A fan flow guide structure includes a centrifugal fan impeller and a case. The case includes an upper cover and a base seat. A fan impeller space and a flow passage are defined between the upper cover and the base seat. The fan impeller space serves to receive the centrifugal fan impeller. The flow passage is in communication with the fan impeller space and a lateral wind outlet. A tongue section is disposed in the flow passage in adjacency to the lateral wind outlet. A wind supplementing section is defined opposite to the tongue section. An intake gill section is disposed on the upper cover and/or the base seat in communication with the wind supplementing section. Accordingly, the airflow outside the case can be guided from the intake gill section into the wind supplementing section to enhance the flow amount of the fan.
    Type: Grant
    Filed: January 6, 2021
    Date of Patent: August 2, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Sung-Wei Sun, Ming-Che Lee
  • Patent number: 11399446
    Abstract: A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: July 26, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Jung-Yi Chiu, Fu-Kuei Chang
  • Patent number: 11395568
    Abstract: A multifunctional cleaning device includes a main body, a telescopic tube body, a cleaning head set and a control unit. Multiple drive units are mounted on one side of the main body. The main body has a detection unit for detecting cleaning range and path. The telescopic tube body is telescopically connected with the main body. The telescopic tube body has a first end and a second end. The first and second ends are respectively connected with the main body and the cleaning head set in communication therewith. The control unit is disposed in the main body to execute system control and judge received signals so as to give commands to the drive units for controlling the move of the main body.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: July 26, 2022
    Assignee: Asia Vital Components Co., Ltd.
    Inventors: Mao-Lin Chen, Yu-Tzu Chen, Bor-Haw Chang
  • Patent number: 11397054
    Abstract: A heat dissipation structure includes a main body. The main body has an upper plate, a lower plate, an extensible portion and a chamber. The upper plate, the extensible portion and the lower plate together define the chamber. The extensible portion is disposed between the upper and lower plates. A main body capillary structure is disposed in the chamber. The main body capillary structure is disposed on an inner wall of the chamber. A working fluid is filled in the chamber.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: July 26, 2022
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventors: Xiao-Xiang Zhou, Han-Min Liu
  • Patent number: 11397056
    Abstract: A vapor chamber structure includes a main body having multiple internal independent chambers. A capillary structure is disposed in each of the independent chambers. A working fluid is contained in each of the independent chambers. The working fluids contained in the independent chambers have different physical or chemical properties. The independent chambers are respectively in contact with different heat sources with different properties to conduct the heat. Accordingly, one single vapor chamber structure can provide complex heat conduction effect for different heat sources.
    Type: Grant
    Filed: May 5, 2019
    Date of Patent: July 26, 2022
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventor: Han-Min Liu
  • Publication number: 20220214117
    Abstract: A thin-type two-phase fluid device includes a first plate body, a second plate body and a polymer layer. The first plate body has a first face, a second face and multiple bosses. The bosses are disposed on the first face and raised therefrom. The second plate body has a nanometer capillary layer on one face. The nanometer capillary layer is formed from a mixture of multiple kinds of powders with different sizes. The nanometer capillary layer is attached to a surface of the second plate body opposite to the first face of the first plate body. The polymer layer is selectively connected with the first plate body or the second plate body. The total thickness of the thin-type two-phase fluid device is equal to or smaller than 0.25 mm, whereby the object of thinning the heat dissipation device is achieved.
    Type: Application
    Filed: January 6, 2021
    Publication date: July 7, 2022
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Kuo-Chun Hsieh