Abstract: A damping apparatus is provided for a positioning stage that is operative to move and position an object along a motion axis. The damping apparatus comprises a motion transformation device operative to rotate the positioning stage about a rotary axis that is substantially perpendicular to the motion axis, in response to forces generated to the positioning stage during acceleration or deceleration thereof. Resilient elements connected to the positioning stage serve to reduce transmission of vibration generated from the positioning stage.

Abstract: A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

Abstract: A linear motor is provided that includes a magnetic assembly, a movable element and a coil assembly that is operative to interact with the magnetic assembly to drive the movable element along a direction. The coil assembly further includes a first coil section having a first motor force constant and a second coil section having a second motor force constant that is lower than that of the first coil section for driving the movable element along the said direction.

Abstract: A cooling apparatus is provided for a linear motor that comprises a coil assembly and a magnet assembly, wherein the coil assembly generates heat during operation. The cooling apparatus comprises a compressed air inlet positioned to discharge compressed air in a direction directly towards a gap between the coil assembly and magnet assembly, and an inclined surface extending from the compressed air inlet and sloping at an obtuse angle away from the discharge direction of the compressed air. The compressed air inlet is configured to discharge the compressed air at a sufficient velocity so as to entrain atmospheric air along the inclined surface to amplify the compressed air that is discharged.

Abstract: A method of detecting wear and damage to a rotary cutting blade for singulating a substrate is provided comprising the steps of providing a sensor to locate a first detecting position at an edge of the blade and performing dicing with the blade while the sensor is maintained substantially at the first detecting position for detecting damage to the blade. Subsequently, an extent of wear of the blade is determined by driving the sensor in the direction of the blade to locate a second detecting position at the edge of the blade as a diameter of the blade is reduced due to dicing. Thereafter, while dicing is performed with the blade, the sensor is maintained substantially at the second detecting position for detecting damage to the blade.

Abstract: A configurable die detachment apparatus is provided that can be used to handle a wide range of die sizes. The apparatus comprises a pin mounting assembly having a plurality of pin sites for selectively mounting ejector pins in a desired configuration on some of the pin sites and a vacuum enclosure enclosing the pin mounting assembly. The vacuum enclosure has a support platform comprising a plurality of openings that are sized and arranged to accommodate different configurations of ejector pins mounted on the pin mounting assembly, the ejector pins being drivable to project through the openings towards a die to be detached.

Abstract: A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

Abstract: An apparatus and method is provided for flipping electronic components in the sense of changing their orientation, such as for changing the orientation of electronic components between ‘live bug’ and ‘dead bug’ orientations. The apparatus comprises a rotary device that is configured to receive the electronic component and a force actuator operative to bias the electronic component into engagement with the rotary device. A driving mechanism coupled to the rotary device is operative to rotate said rotary device for changing the orientation of the electronic component, after which an ejector is used to eject the electronic component from the rotary device after changing the orientation of the electronic component.

Abstract: A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.

Abstract: A tunable vibration absorption device is provided that is suitable for active or semi-active vibration absorption or damping of vibrations in vibrating structures. It comprises a stack including a force actuator mechanism for generating an axial actuation force and a force sensor mechanism which is responsive to an external force acting on the stack to generate a force signal. A controller unit is electrically connected to the force sensor mechanism for receiving the force signal generated by the force sensor mechanism, and it is also electrically connected to the force actuator mechanism for adjusting the axial actuation force generated by the force actuator mechanism in response to the received force signal generated by the force sensor mechanism.

Abstract: An oven is provided for curing or reflowing compounds on objects, such as lead frames or other substrates. The oven comprises a heating chamber, a heating assembly mounted in thermal communication with the heating chamber to provide heat thereto, and a support assembly for supporting the object in the heating chamber for heating. The heating assembly and support assembly are configured to be movable relative to one another for controllably positioning the object at variable distances with respect to the heating assembly. Heating of the object according to a heating profile can thus be achieved by controlled heating of the object at different temperatures by positioning the object at different distances with respect to the heating assembly during the heating process although there is a single heating zone.

Abstract: A die sorting apparatus for a wafer is provided that associates logical positions of each die from a map file for storing records of testing information based upon testing performed on individual dice comprised in the wafer with its physical position as illustrated by an image acquired by an image capturing device showing physical positions of the dice, after the dice have been singulated. A processing device can thus determine actual physical positions of the dice for reference by a die pick-up device configured to selectively pick up dice that meet predetermined criteria according to the testing information from their actual physical positions as determined.

Abstract: A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.

Abstract: A driving mechanism and method are provided for driving a detachment tool adapted to detach a chip from an adhesive tape to which the chip is mounted. The mechanism includes a first actuator coupled to the detachment tool and operative to drive the detachment tool to move along a first axis substantially perpendicular to a surface of the chip, and a second actuator coupled to the detachment tool and operative to drive the detachment tool to move adjacent to a width of the chip along a second axis perpendicular to the first axis. The first actuator is configured for programmable movement along the first axis with respect to the chip in conjunction with the second actuator for movement adjacent the width of the chip to provide controlled lifting of the chip for propagation of delamination between the chip and the adhesive tape.

Abstract: An apparatus and method are provided for aligning a plurality of semiconductor devices placed on a carrier. Alignment guides are located adjacent to each device in use, and arranged such that they correspond to a desired alignment of each semiconductor device. For alignment, the semiconductor devices are held by a positioning device comprising a plurality of holders, each holder being configured to generate a force to hold a semiconductor device. Actuators are also provided that are operative to move the positioning device and holders to bias the semiconductor devices against the alignment guides to orientate the semiconductor devices until they are aligned with said alignment guides.

Abstract: A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level of wear resistance.

Abstract: An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.

Abstract: The invention provides an apparatus and method for aligning a bonding tool. A force sensor having a plurality of force sensing sections is configured to measure a force generated by the bonding tool on the force sensor. Each sensing section is adapted to individually detect an amount of force from a part of the bonding tool acting on that sensing section, so that an alignment of the bonding tool may be determined.

Abstract: A piezoelectric device is provided that comprises a mechanical amplifier adapted to produce a displacement output and/or receive a force input, and first and second flexible platforms connected to the mechanical amplifier. The first flexible platform is connected to one side of the mechanical amplifier and piezoelectric material is mounted on the first flexible platform for controllably flexing the first flexible platform. The second flexible platform is connected to another side of the mechanical amplifier and piezoelectric material is mounted to the second flexible platform for controllably flexing the second flexible platform.

Abstract: The invention provides an apparatus and method for calibrating a dispensing system. A dispenser dispenses a controlled quantity of material into a container for receiving material. A system, preferably a vision system comprising an image capturing device and an imaging system, is adapted to capture an image of a physical dimension of a quantity of dispensed material in a given time. The physical dimension may be a width of a top surface area, a height or a cross-sectional area of the dispensed material. A calibrating system is adapted to calculate a volume of the quantity of material based upon said physical dimension.