Abstract: An apparatus and a method are disclosed for placing at least two elements on a surface. The apparatus comprises means for supplying a surface, means for transferring the two elements to the surface, means for adjusting the position of the surface in a first direction, and means for adjusting the position of the transferring means in a second direction and about a rotation axis parallel to a third direction, the first, second and third directions being mutually orthogonal. Recognizing means are provided on at least one of the transferring means for recognizing position alignment marks provided on the surface.

Abstract: A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question.

Abstract: A method and apparatus are described for placing a plurality of balls in a predetermined array. The method and apparatus are particularly suitable for transferring solder balls to a ball grid array package. In the method the balls are transferred from a supply means 1 to a template 2 in which the balls are positioned in the desired array before being picked up by a ball pick head 3 for transfer to the final position while remaining in the desired array.

Abstract: A wire bonding machine has a wire bonding head that provides five directions of movement or degrees of freedom. The radial direction of movement supports the wire bonding process and reduces the moving mass of the wire bonder during the generation of the wire bonds. The wire bonding machine further includes a selectable side view inspection system. Through a group of optical components, the assembly process can be selectively viewed from either a side view or a top view. The side view of the assembly process provides for improved analysis of the wire bond quality which can be monitored by a camera.

Abstract: An apparatus and method for making high-speed wire bonds between a semiconductor chip and a chip carrier. A chuck supported on a pushrod passing through a rotating sleeve holds the chip and provides Z- and theta- motions, while the bonding head provides X- and Y- movements relative to the chip. Limiting the bonding head to X- and Y- motions significantly reduces the dynamic forces on the bonding head and supporting mechanism, thereby enabling a faster rate of reliable operation. A signal source directly contacts the pushrod to provide reference signals to control circuitry regarding the position of the anvil and chip supported thereon.

Abstract: A wire-bonding apparatus which employs a belt-and-pulley driven, spring-returned Z-motion plate to appropriately locate a wire-axis-aligned, solenoid operated, wire feed-and-tear apparatus so that bonds can be quickly and effectively made upon devices located on an X-Y movement table.

Abstract: A four-motion wire bonding apparatus, for effecting wire bonds between a semiconductor chip and a lead frame. In addition to employing X-, Y-, Z- and theta-motion drives for the bonding head, the apparatus provides a bulk wire-feed, which delivers bonding wire along the theta-rotation axis.