Abstract: A method for thermally conditioning an optical element includes irradiating the optical element with radiation, not-irradiating the optical element with the radiation, allowing heat flow between the optical element and a conditioning fluid that is held in a conditioning fluid reservoir, and providing a fluid flow of the conditioning fluid, to supply thermally conditioned fluid to the reservoir. A flow rate of the fluid during the irradiating of the optical element is lower than a flow rate of the fluid when the optical element is not-irradiated.

Abstract: A lithographic apparatus is disclosed that includes a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table. Measures are taken in the lithographic apparatus, for example, to reduce the effect of droplets on the final element of the projection system or to substantially avoid such droplet formation.

Abstract: A fluid handling structure for a lithographic apparatus, the fluid handling structure having, at a boundary from a space configured to contain immersion fluid to a region external to the fluid handling structure: a meniscus pinning feature to resist passage of immersion fluid in a radially outward direction from the space; a plurality of gas supply openings in a linear array at least partly surrounding and radially outward of the meniscus pinning feature; and a gas recovery opening radially outward of the plurality of gas supply openings in a linear array.

Abstract: An immersion lithographic apparatus includes a projection system, a first table with a first planar surface and a second table with a second planar surface, the first and second planar surfaces being substantially coplanar, a liquid confinement system configured to spatially confine an immersion liquid to a volume with a first surface area that is coplanar with the first and second planar surfaces, and is substantially smaller than a second surface area of the top surface of the substrate, and a swap bridge member attached to the first table, the swap bridge member having an upper surface that is substantially coplanar with the first and second planar surfaces, wherein the upper surface of the swap bridge member is configured to serve as part of the liquid confinement system and to deform when the swap bridge member collides with the second table and to remain attached to the first table

Abstract: A liquid supply system for an immersion lithographic apparatus provides a laminar flow of immersion liquid between a final element of the projection system and a substrate. A control system minimizes the chances of overflowing and an extractor includes an array of outlets configured to minimize vibrations.

Abstract: A gas knife configured to dry a surface in an immersion lithographic apparatus is optimized to remove liquid by ensuring that a pressure gradient is built up in the liquid film on the surface being dried.

Abstract: A lithographic apparatus includes an illumination system, support constructed to support patterning device, a projection system, an interferometric sensor and a detector. The interferometric sensor is designed to measure one or more wavefronts of a radiation beam projected by the projection system from an adjustable polarizer. The interferometric sensor includes a diffractive element disposed at a level of a substrate in the lithographic apparatus and a detector spaced apart from the diffractive element, the diffractive element being arranged to provide shearing interferometry between at least two wavefronts mutually displaced in a direction of shear. The detector is designed to determine, from the wavefront measurements, information on polarization affecting properties of the projection system.

Abstract: A method of optimizing a lithographic process for imaging a pattern, including a plurality of features, onto a substrate using a lithographic apparatus, the lithographic apparatus having a controllable illumination system to illuminate a patterning device and a controllable projection system to project an image of the patterning device onto the substrate, the method including selecting a feature from the plurality of features, determining an illumination setting for the illumination system to optimize imaging of the selected feature, and determining a projection setting for the projection system to optimize imaging of the selected feature taking account of the illumination setting.

Abstract: A motor includes a stator including a plurality of stator poles arranged in a repetitive arrangement with a first pitch, the stator poles facing a first side of a plane of movement, and a mover including a plurality of mover poles arranged in a repetitive arrangement with a second pitch, the mover poles facing a second, opposite side of the plane of movement. The poles of the stator and/or the mover are provided with a winding to alter a magnetic field in the respective ones of the stator poles and the mover poles in response to an electric current through the respective winding. At least one of the stator and the mover includes a permanent magnet for generating a magnetic field extending from the permanent magnet via at least one respective pole of the stator and the mover to the other one of the stator and the mover and back.

Abstract: In a lithographic apparatus, an illumination mode is set using a field mirror comprising a plurality of movable facets to direct radiation to selectable positions on a pupil facet mirror. In the event that a field facet mirror is defective and cannot be set to a desired position, another of the movable facet mirrors is set to a corrective position, different than its desired position, to at least partially ameliorate a deleterious effect of the defective facet mirror.

Abstract: Disclosed is a device manufacturing method, and accompanying inspection and lithographic apparatuses. The method comprises measuring on the substrate a property such as asymmetry of a first overlay marker and measuring on the substrate a property such as asymmetry of an alignment marker. In both cases the asymmetry is determined. The position of the alignment marker on the substrate is then determined using an alignment system and the asymmetry information of the alignment marker and the substrate aligned using this measured position. A second overlay marker is then printed on the substrate; and a lateral overlay measured on the substrate of the second overlay marker with respect to the first overlay marker using the determined asymmetry information of the first overlay marker.

Abstract: A system for an extreme ultraviolet light source includes one or more optical elements positioned to receive a reflected amplified light beam and to direct the reflected amplified light beam into first, second, and third channels, the reflected amplified light beam including a reflection of at least a portion of an irradiating amplified light beam that interacts with a target material; a first sensor that senses light from the first channel; a second sensor that senses light from the second channel and the third channel, the second sensor having a lower acquisition rate than the first sensor; and an electronic processor coupled to a computer-readable storage medium, the medium storing instructions that, when executed, cause the processor to: receive data from the first sensor and the second sensor, and determine, based on the received data, a location of the irradiating amplified light beam relative to the target material in more than one dimension.

Abstract: A projection system (PS) is provided which includes, in an embodiment, two frames. The optical elements of the projection system are mounted on a first frame (200). The position of the optical elements is measured relative to a second frame (300) using a first measurement system (910). A second measurement system (920) is used to measure a parameter associated with a deformation of the second frame. The measurement made by the second measurement system can be used to compensate for any errors in the position of the optical elements as measured by the first measurement system resulting from deformations of the second frame. Typically, deformations of the frames are due to resonant oscillation and thermal expansion. Having two frames enables the optical elements of the projection system to be positioned with a high degree of accuracy.

Abstract: A radiation source generates extreme ultraviolet radiation for a lithographic apparatus as a chamber that is provided with a low pressure hydrogen environment. A trace amount of a protective compound, e.g., H2O, H2O2, O2, NH3 or NOx, is provided to the chamber to assist in maintaining a protective oxide film on metal, e.g., titanium, components in the chamber.

Abstract: An electrical connector comprises a high voltage pad and a high voltage plate. When connected to another electrical connector, the two plates, which are at the same voltage as the pads, form a region of high voltage in which the field is low. The pads are positioned in that region. An electrostatic clamp of an EUV lithographic apparatus may have such a pad and plate, for connecting to the electrical connector. By placing the interconnection in a low field region, triple points (points of contact between a conductor, a solid insulator and a gas) may be present in that region.

Abstract: An immersion liquid is provided comprising an ion-forming component, e.g. an acid or a base, which has a relatively high vapor pressure. Also provided are lithography processes and lithography systems using the immersion liquid.

Abstract: A method of generating radiation for a lithography apparatus. The method comprises providing a continuously renewing fuel target (50) at a plasma formation location (12) and directing a continuous-wave excitation beam (6) at the plasma formation location such that fuel within the continuously renewing fuel target is excited by the continuous-wave excitation beam to generate a radiation generating plasma.

Abstract: A backside illuminated sensor comprising a supporting substrate, a semiconductor layer which comprises a photodiode comprising a region of n-doped semiconductor provided at a first surface of the semiconductor layer, and a region of p-doped semiconductor, wherein a depletion region is formed between the region of n-doped semiconductor and the region of p-doped semiconductor, and a layer of p-doping protective material provided on a second surface of the semiconductor layer, wherein the first surface of the semiconductor layer is fixed to a surface of the supporting substrate.

Abstract: A method of determining exposure dose of a lithographic apparatus used in a lithographic process on a substrate. Using the lithographic process to produce a first structure on the substrate, the first structure having a dose-sensitive feature which has a form that depends on exposure dose of the lithographic apparatus on the substrate. Using the lithographic process to produce a second structure on the substrate, the second structure having a dose-sensitive feature which has a form that depends on the exposure dose of the lithographic apparatus but which has a different sensitivity to the exposure dose than the first structure. Detecting scattered radiation while illuminating the first and second structures with radiation to obtain first and second scatterometer signals. Using the first and second scatterometer signals to determine an exposure dose value used to produce at least one of the first and second structures.

Abstract: A droplet generator, for an EUV radiation source, comprises: a capillary in which, in use, molten material flows; an actuator configured to modulate a pressure inside the capillary; and a controller configured to drive the actuator at a driving frequency; wherein the droplet generator is arranged such that, in use, the driving frequency is equal or about equal to a main resonance frequency of the molten material in the capillary.