Patents Assigned to AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
  • Patent number: 11523496
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component is embedded in the stack. A first thermally conductive block is located above and thermally connected with the component, and a second thermally conductive block is located below and thermally coupled with the component. Heat generated by the component during operation is removed via at least one of the first thermally conductive block and the second thermally conductive block.
    Type: Grant
    Filed: February 19, 2021
    Date of Patent: December 6, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Rainer Frauwallner, Dietmar Drofenik, Patrick Fleischhacker
  • Patent number: 11523520
    Abstract: The invention pertains to a method for the bonding of a component embedded into a printed circuit board exhibiting the following steps: Provision of a core exhibiting at least one insulating layer and at least one conductor layer applied to the insulating layer, Embedding of at least one component into a recess of the insulating layer, wherein the contacts of the component are essentially situated in the plane of an outer surface of the core exhibiting the at least one conductor layer, Application of a photoimageable resist onto the one outer surface of the core on which the component is arranged, while filling the spaces between the contacts of the component, Clearing of end faces of the contacts and of the areas of the conductor layer covered by the photoimageable resist by exposing and developing the photoimageable resist, by application of a semi-additive process, deposition of a layer of conductor material onto the cleared end faces of the contacts and the cleared areas of the conductor layer and form
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: December 6, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Gerald Weidinger, Andreas Zluc, Johannes Stahr
  • Patent number: 11510316
    Abstract: A component carrier with an electrically insulating layer having a front side and a back side, a first and a second electrically conductive layer covering the front side and the back side of the electrically insulating layer, respectively. A through hole extends through both electrically conductive layers and the electrically insulating layer. An overhang is formed along one of the electrically conductive layers and sidewalls of the electrically insulating layer structure delimiting the through hole. An annular plating layer covers the sidewalls and fills part of the overhang such that a horizontal extension of the overhang after plating is less than 20 ?m and/or such that a ratio between a horizontal extension of the overhang after plating and a width of a first window through the first electrically conductive layer and/or a width of a second window through the second electrically conductive layer is smaller than 20%.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: November 22, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Abderrazzaq Ifis
  • Patent number: 11495513
    Abstract: A component carrier with a stack that has at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a semiconductor component embedded in the stack, and a highly-conductive block embedded in the stack and being thermally and/or electrically coupled with the semiconductor component is illustrated and described.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: November 8, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Johannes Stahr, Andreas Zluc, Mike Morianz, Heinz Moitzi
  • Patent number: 11483927
    Abstract: A component carrier includes an electrically insulating layer structure having a first main surface and a second main surface with a through hole extending through the electrically insulating layer structure between the first main surface and the second main surface. An electrically conductive bridge structure connects opposing sidewalls of the electrically insulating layer structure delimiting the through hole. A vertical thickness of the electrically insulating layer structure is not more than 200 ?m and a narrowest vertical thickness of the bridge structure is at least 20 ?m.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: October 25, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Ismadi Bin Ismail, Valerian Yun Khim Chung, Alex Yucun Dou, Seok Kim Tay
  • Patent number: 11483923
    Abstract: A component carrier for carrying at least one electronic component includes (a) a plurality of electrically conductive layers; (b) a plurality of electrically insulating layers; and (c) a thermoplastic structure. The electrically conductive layers, the electrically insulating layers, and the thermoplastic structure form a laminate. Further, a method for manufacturing such a component carrier and an electronic apparatus including such a component carrier are provided.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 25, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Thomas Krivec
  • Patent number: 11450587
    Abstract: An electronic device includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a plurality of processing components on and/or in the stack, a process control component coupled with at least part of the processing components for transmitting signals and configured for controlling processes executed by the processing components and/or by the process control component, and a heat removal structure on or above which at least one of the process control component and the processing components is arranged.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: September 20, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Marco Gavagnin, Gerald Weis, Markus Leitgeb, Gernot Grober, Young Hy Jung
  • Patent number: 11452199
    Abstract: An electronic device including a first component carrier, a second component carrier connected with the first component carrier so that a thermal decoupling gap is formed between the first component carrier and the second component carrier, a first component on and/or in the second component carrier, and a second component having a first main surface mounted in the thermal decoupling gap so that at least part of an opposing second main surface and an entire sidewall of the second component is exposed with respect to material of the first component carrier and with respect to material of the second component carrier.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: September 20, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Martin Schrems, Markus Leitgeb, Steve Anderson
  • Patent number: 11445601
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure, a first electrically insulating layer structure and a second electrically insulating layer structure. The first electrically insulating layer structure is made of a material which has first physical properties. The second electrically insulating layer structure is made of another material which has second physical properties differing from the first physical properties. The first electrically insulating layer structure and the second electrically insulating layer structure are at least partially in direct physical contact with each other. A method of manufacturing a component carrier is also disclosed.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: September 13, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Mikael Tuominen, Seok Kim Tay
  • Patent number: 11445612
    Abstract: A component carrier including: i) a layer stack with at least one electrically insulating layer structure and at least one electrically conductive layer structure, ii) a cavity formed in the layer stack, iii) a dielectric element at least partially placed in the cavity, wherein the dielectric element and the layer stack are electromagnetically couple-able, and iv) an electrically insulating connection material between the dielectric element and the layer stack.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: September 13, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Patrick Lenhardt, Sebastian Wolfgang Sattler
  • Patent number: 11439018
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack and has a non-polygonal outline. A component is in the cavity. A method of manufacturing such a component carrier is also provided.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: September 6, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Patent number: 11430703
    Abstract: A method of manufacturing component carriers includes carrying out a test for each of multiple sections of a component-carrier structure, inserting at least one functional component in each of further sections of a further component-carrier structure to be connected with the component-carrier structure so that each further section assigned to a respective section having successfully passed the test is provided with at least one functional component, and inserting at least one functionally inactive dummy component in each of the further sections assigned to a respective section having failed the test.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: August 30, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Marco Gavagnin, Gernot Schulz
  • Patent number: 11408076
    Abstract: A method of performing an immersion tin process in the production of a component carrier is provided which includes immersing at least a part of a copper surface of the component carrier in a composition containing Sn(II) in an immersion tin unit, while passing a non-oxidizing gas through the immersion tin unit, wherein at least part of the non-oxidizing gas is recycled. In addition, an apparatus for performing an immersion tin process in the production of a component carrier, a method of performing a copper plating process in the production of a component carrier and an apparatus for performing a copper plating process in the production of a component carrier are provided.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Heinrich Trischler
  • Patent number: 11412622
    Abstract: A component carrier includes a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; a dielectric filling medium filling at least part of the at least one recess; and a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium. A method of manufacturing a component carrier includes forming a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; at least partially filling the at least one recess by a dielectric filling medium; and thereafter forming a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Thomas Kristl, Ewald Moitzi
  • Patent number: 11412618
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A cavity is formed in the stack. A component in the cavity has a stepped profile at at least one of its main surfaces. A resin clamping structure laterally engages the component and extends up to a step of the stepped profile. A method of manufacturing such a component carrier is also provided.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier, Julia Platzer, Markus Frewein
  • Patent number: 11410965
    Abstract: An electronic device having a first component carrier and an electronic component which is surface mounted on or embedded within the first component carrier. The electronic device further has a second component carrier. The first component carrier together with the electronic component is at least partially embedded within the second component carrier.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Mikael Tuominen
  • Patent number: 11398334
    Abstract: A component carrier which includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and an inductor arranged at least partially in the stack is disclosed. The inductor includes an electrically conductive coil structure, wound around a coil opening, and a magnetic core. At least part of the magnetic core at least partially fills the coil opening. At least part of at least one of the coil structure and the magnetic core is configured as an inlay embedded in the stack.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: July 26, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Gerald Weis
  • Patent number: 11399432
    Abstract: A component carrier includes a stack with a plurality of electrically conductive layer structures and at least one electrically insulating layer structure. The electrically conductive layer structures include an electrically conductive vertical through-connection and a horizontally extending electrically conductive trace electrically coupled with an end portion of the vertical through-connection. A back-drill hole extends through at least part of the at least one electrically insulating layer structure towards the end portion of the vertical through-connection. An etching neck connects the back-drill hole with the end portion of the vertical through-connection.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 26, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Markus Kastelic, Lackner Sebastian
  • Patent number: 11394105
    Abstract: A component carrier has a laminated stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a front-end chip on and/or in the stack and extending at least up to a main surface of the stack, an antenna interface on an opposing other main surface of the stack, and an impedance matching circuitry in the stack and arranged vertically between the front-end chip and the antenna interface.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: July 19, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Gerald Weis
  • Patent number: 11387117
    Abstract: A component carrier having a base structure consisting of an electrically conductive material, an electronic component arranged on the base structure and a surrounding structure on the base structure, where the surrounding structure at least partially surrounds the electronic component laterally.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: July 12, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Minwoo Lee