Abstract: A component carrier and a method of manufacturing a component carrier are provided. The component carrier includes a stack having a front side and a back side, the stack including a plurality of stacked electrically insulating layer structures, a through hole being narrower in its inner portion compared to its exterior portions and extending through the plurality of electrically insulating layer structures so that sidewalls of each of the electrically insulating layer structures delimit respective parts of the through hole, and an electrically conductive filling medium filling at least a part of the through hole.
Type:
Grant
Filed:
September 22, 2020
Date of Patent:
October 26, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Mikael Tuominen, Seok Kim Tay, Sally Sun, Robin Zhang
Abstract: A component carrier which includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, and electrically conductive wiring structures being part of the at least one electrically conductive layer structure, wherein a value of the passive intermodulation for signals propagating along the electrically conductive wiring structures is less than ?153 dBc.
Type:
Grant
Filed:
April 6, 2020
Date of Patent:
October 5, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Kevin Pöltl, Rene Oberegger, Konrad Klaus, Erich Schlaffer
Abstract: An electronic package includes a component carrier having a stepped cavity formed therein; and a component assembly having at least two electrically connected electronic components with different sizes such that the component assembly has a stepped shape. The component assembly is accommodated at least partially inserted within the stepped cavity. Further described is a method of manufacturing such an electric package.
Type:
Grant
Filed:
June 7, 2019
Date of Patent:
September 21, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Gernot Grober, Sabine Liebfahrt, Christian Vockenberger
Abstract: A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.
Type:
Grant
Filed:
March 15, 2017
Date of Patent:
August 3, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A component carrier including a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure, a component embedded in the stack, and a sealing structure sealing at least part of the component with regard to material of the stack, wherein the sealing structure is configured for reducing stress between the component and the stack.
Type:
Grant
Filed:
November 7, 2018
Date of Patent:
August 3, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Abderrazzaq Ifis, Wolfgang Schrittwieser, Christian Vockenberger
Abstract: An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.
Type:
Grant
Filed:
November 18, 2019
Date of Patent:
August 3, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A method of manufacturing a component carrier. The method includes forming a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, and embedding a filament in the stack.
Type:
Grant
Filed:
January 13, 2020
Date of Patent:
July 27, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: An etching composition for etching an electrically conductive layer structure for forming a conductor track is provided. The etching composition includes an etchant, a highly branched compound and optionally a solvent. In addition, a method of etching an electrically conductive layer structure, a conductor track, an arrangement of at least two conductor tracks, and a component carrier are provided.
Type:
Grant
Filed:
January 14, 2019
Date of Patent:
July 20, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: An interposer-type component carrier includes a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; a cavity formed in an upper portion of the stack; an active component embedded in the cavity and having at least one terminal facing upwards; and a redistribution structure having only one electrically insulating layer structure above the component. A method of manufacturing an interposer-type component carrier is also disclosed.
Type:
Grant
Filed:
March 22, 2019
Date of Patent:
July 20, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A method of manufacturing a component carrier is disclosed. The method includes forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; patterning a front side of the stack using a first photo-imageable dielectric; and patterning a back side of the stack. A component carrier is also disclosed.
Type:
Grant
Filed:
November 20, 2019
Date of Patent:
July 6, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A method of manufacturing a component carrier is presented. The method includes providing a base structure having a front side and a back side, the back side being at least partially covered by a metallic layer, removing material of the base structure from the front side to thereby form a cavity which is at least partially closed by the metallic layer, inserting a component in the cavity and placing the component on the metallic layer.
Type:
Grant
Filed:
January 28, 2019
Date of Patent:
July 6, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Mike Morianz, Christian Galler, Gerhard Stubenberger
Abstract: A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.
Type:
Grant
Filed:
November 6, 2018
Date of Patent:
July 6, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Marco Gavagnin, Markus Leitgeb, Alexander Kasper, Gernot Schulz
Abstract: A component carrier with an electrically insulating layer having a front side and a back side, a first and a second electrically conductive layer covering the front side and the back side of the electrically insulating layer, respectively. A through hole extends through both electrically conductive layers and the electrically insulating layer. An overhang is formed along one of the electrically conductive layers and sidewalls of the electrically insulating layer structure delimiting the through hole. An annular plating layer covers the sidewalls and fills part of the overhang such that a horizontal extension of the overhang after plating is less than 20 ?m and/or such that a ratio between a horizontal extension of the overhang after plating and a width of a first window through the first electrically conductive layer and/or a width of a second window through the second electrically conductive layer is smaller than 20%.
Type:
Grant
Filed:
January 29, 2020
Date of Patent:
June 29, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.
Type:
Grant
Filed:
June 10, 2019
Date of Patent:
June 29, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Johannes Stahr, Gerald Weidinger, Gerhard Schmid, Andreas Zluc
Abstract: Provided is a method of manufacturing a component carrier that includes forming a magnetic core on a base structure; forming a through hole in at least one dielectric layer; forming a plurality of electrically conductive windings on the at least one dielectric layer around the through hole; forming a stack with the base structure having the magnetic core, the at least one dielectric layer and another base structure such that the magnetic core is inserted into the through hole and the conductive windings are arranged around the magnetic core such that the magnetic core and the plurality of electrically conductive windings are interposed between the base structure and the other base structure.
Type:
Grant
Filed:
June 19, 2019
Date of Patent:
June 29, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Rainer Frauwallner, Marco Gavagnin, Christian Vockenberger
Abstract: A component carrier includes a base structure and an electrically conductive wiring structure on the base structure. The wiring structure has a nonrectangular cross-sectional shape configured so that an adhesion promoting constriction is formed by at least one of the group consisting of the wiring structure and a transition between the base structure and the wiring structure.
Type:
Grant
Filed:
May 21, 2019
Date of Patent:
June 22, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a first component embedded in the stack, having at least one first pad on a bottom surface of the first component. The at least one first pad is electrically connected with a bottom surface of the stack. A second component embedded in the stack, having at least one second pad on a top surface of the second component. The at least one second pad is electrically connected with a top surface of the stack. The stack includes a first redistribution structure electrically connecting the at least one first pad of the first component with the bottom surface of the stack, and a second redistribution structure electrically connecting the at least one second pad of the second component with the top surface of the stack.
Type:
Grant
Filed:
October 2, 2019
Date of Patent:
June 15, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A component carrier which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a deformed layer connected to and/or forming part of the stack and being bent so as to define accommodation volumes for components, and the components, wherein each of the components is accommodated in a respective one of the accommodation volumes.
Type:
Grant
Filed:
April 29, 2020
Date of Patent:
May 18, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: An electric device which includes a first component carrier structure with a first magnet structure and a first connection structure, and a second component carrier structure with a second magnet structure and a second connection structure. The first magnet structure and the second magnet structure are configured such that upon attaching the first component carrier structure and the second component carrier structure to one another the first connection structure is connected to the second connection structure, holding the first component carrier structure and the second component carrier structure together by an attracting magnetic force between the first magnet structure and the second magnet structure.
Type:
Grant
Filed:
October 11, 2019
Date of Patent:
May 4, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Abstract: A component carrier with a base structure, an antenna arrangement, and an electronic component are disclosed. The antenna arrangement has a first antenna element and a second antenna element, wherein both antennas elements are embedded within the base structure. The electronic component is embedded within the base structure and is operatively connected both with the first antenna element and the second antenna element. The electronic component is an active electronic component capable of providing a first transmit signal to the first antenna element and a second transmit signal to the second antenna element and/or processing a first receive signal received from the first antenna element and a second receive signal received from the second antenna element. Further, an electronic apparatus comprising such a component carrier and a manufacturing method for such a component carrier are described.
Type:
Grant
Filed:
April 28, 2017
Date of Patent:
April 27, 2021
Assignee:
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft