Abstract: An apparatus for cooling an integrated circuit device includes a container defining a chamber that is partially filled with a coolant which forms a coolant pool in the chamber, wherein heat generated by the integrated circuit device causes boiling of the coolant at a heating area of the coolant pool so that vaporized coolant rises upwardly from the coolant pool and condenses on a ceiling of the chamber forming coolant droplets thereon. The apparatus further includes a baffle positioned within the chamber and at least partially out of the coolant pool, the baffle further being positioned within a path traveled by the coolant droplets falling from the ceiling due to gravity, wherein the baffle is configured to guide the coolant droplets away from the heating area of the coolant pool as the coolant droplets fall from the ceiling towards the coolant pool due to gravity.

Abstract: A method for detecting JTAG errors in which components in a boundary scan path of a JTAG serial test bus connect a single bit bypass register into the scan path rather than the expected register when errors are detected. JTAG instruction signals are shifted into the scan path to determine whether an instruction error was received by a component. Data scanned into the component is prefixed by a header which is monitored by the JTAG control circuitry to detect any instruction errors. The combined data and header are padded by bits preceding the header to be equal to a multiple of a data register contained within the JTAG control circuitry. The least significant bit positions of the header and the padding bits are shifted out of the data register prior to the time that the header or first byte of the header should have been in the data register of the JTAG control circuitry such that the least significant bit of the data register is a 1, if no single error occurred, and is a 0 if a single error occurred.

Abstract: A charge pump circuit for a phase-locked loop circuit which provides substantially constant charge and discharge currents characterized by minimal overshoots and undershoots. The charge pump circuit includes a level shifter circuit which attenuates voltage swings in Up and Down signals from the phase detector and provides control signals. The charge pump circuit also includes a feedback circuit coupled to the level shifter which compares the output voltage of the charge pump to predetermined first and second reference voltages and increases and decreases the charge and discharge currents to minimize overshoot and undershoot noise as determined by the control signals.

Abstract: A hot bar apparatus for effecting solder bonds for high density electronic components has a diamond or diamond-like (i.e. a generally diamond crystal lattice with graphite impurities) surface that makes contact with the leads of the electronic component and transmits the heat necessary to effect a solder bond. The diamond or diamond-like surface has superior wear characteristics over any other material, and it also is an electrical insulator to protect the electronic components from spurious voltages and currents generated by electrical currents that provide the heat for the hot bar.