Abstract: Apparatus (11) for handling articles (12), such as semiconductor devices, temporarily mounted to an adhesively coated surface of a diaphragm (29) of a mounting frame (21) includes an index table (31) for positioning a selected one of the articles (12) at a pickup axis (34). The article (12) is removed from adhesive contact with the diaphragm (29) by first engaging the underside of the diaphragm with spaced support pins (72) and urging the engaged portions of the diaphragm and the selected article upward while pulling adjacent regions of the diaphragm out of contact with the article by means of an applied vacuum. Then a vacuum tip (112) moves downward toward the selected article as supported in its original orientation in a position raised above a plane of an array of the articles.

Abstract: A tactile sensor (100) comprises a printed circuit board (102) having a plurality of spaced apart, electrically conductive foils (104) thereon, each coupled to a decoder (106) which selectively applies a voltage individually thereto. The foils are separated from each other by each of a plurality of upraised insulative portions (116) each comprised of a layer of photoresist material. An anisotropically electrically conductive rubber pad (107) having alternating electrically conductive and nonconductive strips (108, 110) overlies the substrate so that the conductive strips are supported in spaced relationship from the conductive foils by the upraised photoresist layers. Each conductive strip is coupled to a multiplexer (115). Upon the application of a force against the rubber sheet, the conductive strips are deformed into electrical contact with the conductive foils on the substrate.

Abstract: A system for generating a substantially-continuous stream of binary signals representative of the presence of copper on the surface of a fluorescent substrate of a board. A beam is swept by mirror facets of a rotating mirror drum along a path on the board. When the beam strikes copper it is merely relected. When the beam strikes the substrate, a fluorescence is produced. The resultant light is gathered by cylindrical lenses and fiber optic bundles. The color of the light is blocked by filters and the fluorescence color energizes photomultiplier tubes. A threshold setting and sensing circuit senses the output of the photomultiplier tubes and controls their bias voltage to produce a constant level of output from fluorescence and then produces a stream of binary signals that are representative of the presence/absence of copper on the surface of the board. The swept beam is split to send a portion of its energy through an optical grating.

Abstract: Sheets 12 are fed one at a time from a stack 11 by a freely mounted roller 13 magnetically coupled to a rotating drive roller 14. As the stack is depleted, an elevator 27 is operated to maintain the top sheet in contact with the roller 13.

Abstract: A technique for dynamically changing from a full, rotating spool (18) of lightguide fiber (10) to an empty spool (19) while maintaining a substantially constant feed velocity is described. The fiber (10) is moved along a tapered transition section (40 or 52) having a continually decreasing cross-sectional diameter as the spools (18 and 19) and the transition section (40 or 52) rotate at the same velocity. The rotational velocity of the spools and the transition section are increased as the fiber is wound therealong. The fiber is transferred from the transition section onto the empty spool.

Abstract: A multilayer circuit device comprises a substrate having a plurality of metallized patterns thereon said patterns being separated by a photodefined polymeric dielectric film formed from a polymeric photodefinable triazine base mixture including a photosensitive acrylate moiety. The various circuit patterns are interconnected by means of microvias through the polymeric film or film layers.

Abstract: The use of a particular configuration in a downstream etching apparatus and technique allows the rapid and economical treatment of a plurality of semiconductor substrates. Additionally, through the use of this technique, global and localized loading effects are avoided. The downstream apparatus utilizes a discharge region that is relatively large compared to the volume occupied by the substrates. Additionally, the concentration of the etchant species in the effluent is maintained at a level that is of the same order as that produced in the discharge region.

Abstract: An open end (61) of a tube (62) is disposed below a free surface of a treating solution (60) which is capable of reacting with a liquid effluent to provide a disposable reaction product. A pressurized gas which is non-reactive with the effluent and with the treating solution causes the effluent to be moved through the tube and discharged into contact with the treating solution. Also, the gas is flowed through a shroud (63) disposed concentrically about the tube. The gas envelops the effluent and the shroud prevents contact of the treating material with the effluent and the gas along a predetermined distance beyond the open end of the tube. This arrangement causes the treating material to react with the effluent at a location spaced from the end of the tube thereby preventing clogging of the tube. The discharge of the gas along with the liquid effluent into the treating solution causes a substantial mixing of the two liquids to provide a substantially complete reaction.

Abstract: An encapsulant for an electronic device comprises a silicone resin having a highly colored porphyrin compound doped therein.

Abstract: A leading end portion (33) of a supply of cordage (31) is clamped to a mandrel (32) such that it is straight, after which a plurality of convolutions of the cordage are wound on the mandrel. The cordage is severed from the supply and a trailing end portion (34) of the wound cordage is clamped to the mandrel in a manner which causes it to be straight and hence suitable for termination with a modular plug (37). The coiled cordage is heated and cooled and is then removed from the mandrel while simultaneously the direction of the helices is reversed. Then the cordage is severed at a predetermined location to produce two retractile cords, for example, one including the leading end portion of the length of wound cordage and a newly formed straight trailing portion. The second cord includes a newly formed straight leading end portion and the initial trailing end portion. The newly formed end portion of each cord is caused to be held in a straight configuration and annealed to cause it to retain that configuration.

Abstract: Leads (22) of an electrical component (20) are positioned within and extend through a plurality of apertures (74) formed through a substrate (54). The substrate (54) includes a circuit (56) formed on one major surface thereof and a plurality of contacts (76) mounted thereon which is electrically connected to the circuit (56) and which overlaps a portion of the appropriate one of the plurality of apertures (74) formed therethrough. A lead pusher (32) moves the leads (22) into engagement with the contacts (76). Thereafter, free ends of the leads (22) are moved beyond a point of engagement between the leads and the contacts (76) so that the lead is flexed to insure a firm engagement between the leads and the contacts.

Abstract: In a plastic injection apparatus comprising a barrel, an axially reciprocable, rotatable, plastic working screw in the bore of the barrel, a nozzle for injecting melted plastic from out of the front of the bore into a mold, and a plurality of axially spaced heater bands ringing the barrel over its length, the heat control for such apparatus is improved by subdividing the barrel into rear and front parts, impeding outward flow of heat from the rear part by the use of thermal insulating material and a heat reflective surface, and promoting outward flow of heat from the front part by the use of cooling means and of a tubular barrel cover which encloses such front part and has inner and outer surfaces which are heat absorptive and heat reflective, respectively. In one embodiment, the mentioned thermal insulating material is incorporated in a tubular insulating shroud enclosing the heater bands in the rear part and of greater I.D. than the O.D. of such bands.

Abstract: A diverter and coextrusion diverter are described which include means for adjusting the cavity of the diverter so as to control the uniformity of extrudate exiting the diverter.

Abstract: An induction furnace (60) for reflowing a portion of an optical preform (12) in order to draw a lightguide fiber (11) therefrom includes a tubular susceptor (80) which is disposed centrally within a beaker (75) and a sleeve (82) which is disposed concentrically about the susceptor. The sleeve is spaced from the susceptor and is surrounded by insulating grain (83). A high frequency coil (84) is energized to couple its electromagnetic field to the susceptor to heat and reflow a portion of the preform. The movement of contaminating particles of the insulating grain into the interior of the susceptor is prevented substantially by annular, felt-like discs (91, 105) at the bottom and top of the beaker. The discs collect particulates which move downwardly and upwardly and because of their compliant engagement with the beaker and with the sleeve, they provide seals at those interfaces.

Abstract: Projecting leads (28) on a support container (16) for a mini-oscillator assembly (14) initially are straightened in perpendicular directions in a lead-straightening mechanism (48). The straightened leads (28) then are reverse-bent in a bending mechanism (50), utilizing contact pads (26) on a substrate (22) of the mini-oscillator assembly (14) as anvils, so that the lead outer end portions retain the assembly adjacent the support container and so that the lead outer end portions can be bonded to the contact pads. Seating of the lead outer end portions (59) firmly on the contact pads (26) is insured by a lead-seating mechanism 60. The lead-bending mechanism 50 also applies pressure to the substrate (22) in the lead-bending operation to cause uniform spreading of an adhesive material (33) between the substrate and the support container (26).

Abstract: Parts (10) with terminals (17) wrapped with insulation coated wire (20) are loaded into quick clamp and release fixtures (24) and then advanced by a conveyor (26) through a flux applying station (42) and then through an insulation removing and solder depositing station (46). Solder is pumped through a well (47) and divided into two oppositely flowing sets of streams capped by open top housings (66, 67 and 68). The hot solder flowing counter to the direction of movement of the terminals acts to melt and wash away the insulation whereafter the solder flowing in the direction of movement of the terminals acts to deposit solder on the wire wrapped terminals.

Abstract: A technique for dynamically transferring a lightguide fiber (10) from a full spool (18) to an empty spool (19) as both spools rotate at the same velocity and the input velocity of the fiber is constant. The lightguide fiber (10) is wound onto the rotating spool (18) in such a manner as to form a package of wound material having a conically tapered section (52) when full. The fiber (10) is then wound along the tapered section (52) as the velocity of the spools (18 and 19) are increased. When the fiber (10) is at the diameter of the tapered section (52) which is equal to the diameter of the empty spool, it is transferred to the empty spool without any substantial loss of fiber spooling control.

Abstract: A spring clip (30) for holding chip carriers in place on a pallet (20) serves to urge a case (12) seated in each of a plurality of pallet cavities (22) against an underlying lid (14) therein during fabrication of the chip carrier (10). The spring clip (30) comprises a central shaft (32) which extends vertically through the center of a metal plate (31). The plate (31) has a plurality of radially outstretched resilient arms (36), each sloping downwardly from a separate side thereof and having an upturned end (37). The lower end (38) of the shaft (32) is sized for lockable engagement with a corresponding one of a plurality of receiving passages (24) in the pallet (20). Each passage (24) is surrounded by a group of pallet cavities (22). When the first end of each shaft (32) of the spring clip (30) is lockably engaged with the pallet (20), the chip carriers (10) are held on the pallet (20) by the ends (37) of the arms (36).

Abstract: An arrangement is described which multiplies the apparent horizontal resolution of color video display systems without requiring that the video memory in the system be multiplied equivalently. The arrangement may advantageously comprise any given number of bits per picture element for defining a displayable number of colors. One or more additional bit(s) per picture element is provided to convey positional information used for determining the location in a display at which the bits of color information are displayed. The additional memory requirement is limited to this one or more additional bits for each picture element in the display, instead of having the effect of multiplying the number of bits stored per PEL.