Abstract: Apparatus for automatically selecting a semiconductor wafer out of a wafer cassette, and identifying the selected wafer. The apparatus (10) comprises means for accessing a selected individual semiconductor wafer (11) out of a plurality of wafers within a cassette (12), an arm (27) coupled to the accessing means for lifting the selected wafer partially out of the cassette, and a driving member (33) contacting the edge of the selected wafer and rotating the wafer to expose a predetermined portion thereof. An optical reader (37) is positioned proximate to the driving member for identifying information stored in the predetermined portion of the wafer (FIG. 1).

Abstract: An apparatus (10) for automatically feeding and measuring circular discs (12) includes a gauging station (15). The latter includes a pair of opposed capacitive displacement measuring probes (27 and 28). The probes are connected to a thickness measuring test set (66), adapted to provide a capacitance-derived measurement of the thickness of each advancing disc (12) at either one or a plurality of spaced measurement points (142) extending across the major surfaces thereof. Precise control must be maintained over the speed at which each disc is passed between the capacitive probes (27, 28) in a non-contacting manner. This is accomplished through the use of a controllably driven drive wheel (98), and a cooperative arcuate feed channel section (74), which includes an outer arcuate sidewall ramp insert (92).

Abstract: A bonded ASP cable includes a multiconductor core which is filled with a waterproofing material. The core is enclosed by a plastic layer (28) which is flooded with a waterproofing material. Wrapped longitudinally about the plastic layer is a corrugated inner shield (31) having a longitudinal seam (35) and having an outer surface covered with a waterproofing material. The inner shield is enclosed by a corrugated outer shield (36) which has an overlapped longitudinal seam (38) and which has an outer surface coated with a layer of an adhesive material. As the outer shield is being formed, a sealant material is introduced into engagement with the inner shield in the vicinity of the longitudinal edge portions of the outer shield. Then as the longitudinal edge portions of the outer shield are overlapped and engaged with each other, the sealant material is caused to flow into cavities between the two shields adjacent to the seam of the outer shield to form a gasket (66).

Abstract: Parts (10) to receive a thin strip of solder are advanced along top surfaces of a pair of upwardly inclined channel plates (26, 27). Pressurized solder (31) is pumped between the plates to a precise head which projects as a meniscus (28) above the top surfaces of the channel members and is deposited on the advancing parts. The head of solder is maintained at a height to insure a partial flow of solder through a V-shaped trough (51). Any fluctuations in the height of head of solder is rapidly compensated by an increased or decreased flow of solder through the trough. A significant reservoir of solder is maintained between the channel plates so that the solder is held at a substantially constant temperature.

Abstract: An electret sheet is clamped on an apertured support around the aperture so that a sheet portion stretches all across the aperture. A tension-producing ring is advanced against the sheet portion normal to its stretch direction to produce progressively increasing tension therein. Concurrently, a loudspeaker on one side of the sheet emits constant-amplitude sound waves of fixed frequency and directed against the sheet portion to cause it to vibrate at that frequency. When, because of the increasing tension in the sheet portion, it's vibration amplitude rises to a predetermined value at or near resonance, the advance of the mentioned ring is ended, and the sheet portion is adhered to another ring which retains in that portion the tension then existing in it. Such tensioned sheet and adhering ring are then used to make electret diaphragms for electret microphones.

Abstract: A semiconductor wafer pickup device (26) making use of vacuum and Bernoulli effect in order to hold the wafer (11) against the device and to minimize wafer contamination. The wafer pickup device comprises a centrally located Bernoulli orifice (32) and a plurality of peripherally located small tubular legs (38,39,40). In a first stage of a pickup operation, air is blown out of the Bernoulli orifice and out of the tubular legs. Next, vacuum is applied to the tubular legs while pressurized air is still blown out of the Bernoulli orifice. The combination of the Bernoulli effect with the suction at the vacuum legs locates the wafer in a position where the legs hold onto it. Then, the pressurized air is turned off thus leaving the wafer held only by the vacuum legs (FIGS. 2A, 2B).

Abstract: An electronic tone ringer provides a distinctive ringing capability through the use of two oscillators which allow selection of four tones and four modulation rates. In determining the type of tone generated, formattable inputs select between frequency shift or amplitude modulation modes or disabling the modulation altogether to generate a single tone. In the frequency shift mode, two fundamental frequencies are generated which are related by a predetermined ratio, the output tone alternating between these two frequencies at one of four selectable modulation rates. In the amplitude modulation mode, a single frequency is switched on and off at the selected modulation rate. All of the tones are produced with a duty cycle appropriate for driving an electromagnetic acoustic transducer.

Abstract: A method of plating a ductile Ni-Sb alloy on a substrate from a solution containing a Ni salt and a mixed alkali metal-antimony salt comprises pulse plating wherein the off-time is much longer than the on-time.

Abstract: A microcomputer controlled coin telephone set prevents coin call fraud and also checks the operational readiness of the telephone set to prevent the acceptance of coins into a hopper for later collection by a coin box unless or until the set is fully functional. Capable of being interrogated remotely, a local memory is used for storing coin deposit information and generating coin deposit signals in order of deposit to a central office. In those instances where the line power drops below that necessary for full operation as a coin telephone, low power sensing circuits convert the telephone to the POTS mode which allows speech and dialing capabilities. Similarly, any type of chute failure, or a full hopper causes the telephone to revert to the POTS mode. While in the POTS mode, any coins deposited in the telephone are returned to the customer.

Abstract: Capacitor blanks (10) are gravity advanced down an inclined chute (22) into engagement with a flipper vane (36) whereat one (18) of a pair of oppositely disposed test probes (18) and (19) is advanced to engage and push the capacitor blank into engagement with the other probe. If the capacitor blank is not engaged by the test probes so that a predetermined minimum capacitance reading is attained by a test set (29), the test probe (18) is withdrawn and a signal generated to control the operation of the flipper vane (36) which functions to thrust the capacitor back up the chute. Upon proper positioning of the capacitor and completion of a test, the flipper vane is again operated in such a fashion that the tested capacitor passes to a sorting device (61, 64, and 65) which directs the capacitor blank into either an accept recepticle (62) or reject recepticle (63).

Abstract: A lead frame (10) having external leads (26--26) and internal leads (22--22). The internal leads (22--22) are made of soft metal to provide bondability to ceramic substrates having a semiconductor chip thereon while the external leads (26--26) are hard metal to facilitate insertion thereof into a PWB. The lead frame (10) is fabricated by providing a hard metal strip (50) with a soft metal stripe (52) along the central portion thereof. Lead patterns (17--17) are punched in the strip (50) in such a manner as to punch the internal leads (22--22) from the soft metal while simultaneously punching most of the external leads (26--26) from the hard metal. The stripe (52) may be formed by annealing, inlaying or a separate piece of soft metal bonded to two outer hard metal sections (56--56).

Abstract: An article of manufacture comprises an electronic device having a silicone resin encapsulant thereover, wherein the silicone resin is an oxime and water free formulation derived from curing a mixture consisting essentially of a heat curable silicone elastomer prepolymer and a dialkylaminoalkoxysilane. The mixture may also contain fillers and a small amount of curing catalyst and stabilizer.

Abstract: A bonded ASP cable includes a multiconductor core which is filled with a waterproofing material. The core is enclosed by a plastic layer (28) which is flooded with a waterproofing material. Wrapped longitudinally about the plastic layer is a corrugated inner shield (31) having a longitudinal seam (35) and having an outer surface covered with a waterproofing material. The inner shield is enclosed by a corrugated outer shield (36) which has an overlapped longitudinal seam (38) and which has an outer surface coated with a layer of an adhesive material. As the outer shield is being formed, a sealant material is introduced into engagement with the inner shield in the vicinity of the longitudinal edge portions of the outer shield. Then as the longitudinal edge portions of the outer shield are overlapped and engaged with each other, the sealant material is caused to flow into cavities between the two shields adjacent to the seam of the outer shield to form a gasket (66).

Abstract: A solder flux comprises rosin, an activator, an optional surfactant and the dimer of linoleic acid.

Abstract: Temperature variations across the surface of a semiconductor wafer (12), having at least one major surface thereof exposed to a source of radiant heat energy (18), are reduced by positioning a reflective ring (30, 30', 30" or 30'") proximate the wafer edge (28). The reflective ring (30, 30', 30" or 30'") reflects the heat energy towards the wafer periphery (27) to provide substantially uniform heat across the wafer.

Abstract: Chip carriers (10--10) are released from an end of a dispensing means (38) drawn across a holder (22) having a plurality of apertures (28--28) therein, to place a carrier in each aperture. Small solder spheres (58--58) are located in a plurality of dimples (56--56) of a planar plate (40) in arrays that are substantially the same as a plurality of bonding pad arrays (18--18) on the bottom surface of a plurality of chip carriers. A vacuum is applied to the holder (22) to hold the chip carriers (10--10) in the apertures (28--28) as the holder rotates to place the bonding pads (18--18) in contact with the solder spheres (68--68). The solder spheres (58--58) are reflowed by applying heat to form a solder "bump" (68) on each pad (18). The chip carriers (10--10) are then cooled and loaded into a plurality of the tubular members (39--39).

Abstract: A strip (10) of delicate foil is advanced longitudinally along a substantially flat path such as along a platen (104) for printing patterns of lead clusters (12) in photoresist on the foil. A margin (28) of strip (10) is formed into a guiding member such as a standing ridge (98), leaving a residue portion (29) in a desirably flat condition. Ridge (98) has a convenient reference edge (102) and a structural angle is formed by ridge (98) with adjacent foil portions. Such angle is sufficiently strong that advancing strip (10) receives no unacceptable deformation as the reference edge (102) is contacted such as to a reference wall (100) for guidance. Strip (10) is biased so the reference edge (102) maintains contact with guiding apparatus so located that the strip follows the desired path. For example, a flat member (122) is biased downward upon the residue portions (29) of strip (10) and the flat path while a side of member (122) is biased against ridge (98) and the reference wall (100).

Abstract: A plurality of pins (14) are placed on a carrier (12) in a spaced, parallel arrangement and held in place by an adhesive-backed strip (13). Thereafter tabs (39) are formed in the strip (13) and are pressed into pockets (41) of the carrier (12) as the pockets are being formed. This enhances the securance of the strip (13) with the carrier (12) and holds the pins (14) in the spaced, parallel arrangement.

Abstract: A sheath system (50) for a lightguide fiber cable (20) includes a corrugated inner shield (51) which is made of a metallic material having suitable electrical and thermal conductivity to dissipate lightning energy and a corrugated outer shield (60). The outer shield which has an overlapped longitudinal seam is a laminate comprising a corrosion-resistant metallic material (64) which has a relatively high elongation, at least a predetermined chromium content, and a relatively coarse outer surface, and an adhesive system (62). Included in the adhesive system is a first adhesive material (66) which bonds to the outer surface of the metallic material and a second adhesive material (68) which causes the outer shield to become bonded to a plastic jacket (70) which is extruded thereover. The bond between the jacket and the outer shield has sufficient peel strength to prevent the jacket from being separated readily from the outer shield.

Abstract: A hand (10) capable of simultaneously handling a plurality of articles (11) comprising a pickup head (15) having a plurality of vacuum pickup cavities (18), each cavity substantially matching the size and shape of the article to be handled. In one embodiment, the pickup head comprises a seal (26) positioned around an article-matching cavity (18) thereof and an opening (19) therethrough for communicating the cavity (18) with a vacuum chamber (20). In another embodiment, the pickup head comprises, positioned within its opening, a bellows (48) having a cylindrical sleeve (51) at one end and a planar flange (49) coupled to the vacuum chamber (20) by means of a seal (52) at its other end.