Abstract: A novel low sintering temperature ceramic composition particularly suitable for multilayer ceramic capacitors is disclosed. The composition comprises a mixture represented by the formula(1-x)Bi.sub.2 (ZnNb.sub.2(1+d))yO.sub.3+6y+5dy (x)Bi.sub.3 (Ni.sub.2 Nb)O.sub.9where 0<x<1, 0.6.ltoreq.y.ltoreq.1.1 and -0.05.ltoreq.d.ltoreq.0.05.

Abstract: A process of laser-induced metal deposition for repairing transparent defects (18) in patterned metal films (14) of photomasks (10). The process comprises the steps of (a) coating the surface (16) of the substrate (12) having the film (14) thereon with a layer of metal-organic compound (50); (b) exposing the portions of the layer of metal-organic compound (50) overlying the defects (18) to a beam (24) of electromagnetic radiation from a laser (22); (c) ramping the power level of the radiation beam (24) delivered by the laser (22) until a metal patch (52) is reflective and adherent is formed; and (d) removing the unexposed portions of metal-organic compound (50) remaining on the substrate surface (16).

Abstract: A high speed gas valve (10) comprises an annular base member (14) having a plurality of plenums (18--18) into which a gas is admitted through a passage (42) in an overlying coverplate (16). Within each plenum is a conductive disc (26) which seals an orifice (20) leading from the respective plenum into an annular channel (39) in the top surface of a plate (34) in intimate contact with the bottom of the base member. The channel (39) connects each of a plurality of inclined nozzles (36--36) in the plate to each of the plenums (18--18). Underneath each disc (26) is a portion of an electrode (22). When a time varying voltage is applied to the electrode, a time varying current passes therein causing an eddy current to be induced in each of the discs (26--26) which lifts them simultaneously out of sealing engagement with the respective orifices (20--20). As a result, gas is discharged from the nozzles (36--36) as inclined gas streams (46--46) which form a shell (48).

Abstract: A data terminal suitable for home use and having the ability to communicate in both bit synchronous and character asynchronous formats is provided. When a user places a call to a database, the terminal automatically detects whether the database is operating in the bit synchronous or character asynchronous format by examining the received signal for a specific character stream. In response to the presence or absence of this character stream, the terminal automatically configures its receiver and transmitter to communicate in the desired format. This frees the user from the task of modifying a synchronous/asynchronous setup parameter each time a different database is accessed.

Abstract: A head (45) engages a chip (10) having peripheral sides (16), and then engages the chip (10), to a workpiece (35) for bonding chip (10) to a substrate (30). Body (46) has a lower portion terminating in a downwardly presented, working face (48). For receiving chip (10), face (48) has a cavity (54) formed by a plurality of inwardly and upwardly directed surfaces (56). Such surfaces (56) engage upper edges of, and position a chip (10) such that at least a portion of the peripheral sides (16) protrude from working face (48). Body (46) includes a vacuum bore (58) adapted for connection between face (48) and a vacuum for removably engaging and holding chip (10) against surfaces (56). Pockets (60) are also provided in face (48) and connected to a vacuum for moving air streams toward face (48) at the sides (16) of an engaged chip ( 10).

Abstract: A device for splicing together aerial drop wires and comprising: (a) a housing shell having a throughpassage (b) a partition dividing such passage into two channels with outer ramp walls causing the channels to have respective wide openings at opposite ends of the passage and narrow openings at the other ends of the channels, (c) insulating piercing terminals projecting from the partition into these channels and adapted to electrically splice together conductor inserted through the narrow openings into the channels, and (d) wedges drivable through the wide openings to press the drop wires against the terminals and then squeeze the drop wires between the partition and the wedges, is characterized by the following improvements. The wedges are smooth surfaced on their sides which contact the drop wires. Different size wedges are provided to accommodate different size drop wires in the channels. Affixed to the partition are ribs projecting into the channels at their wide ends.

Abstract: Control over the diameter variations in a glass rod (10) during the stretching thereof is accomplished by cooling the rod after heating and initial neck down of a portion (22) thereof. After cooling, the rod (10) is reheated, at a lower temperature sufficient to reflow the glass in the necked-down portion (22) thereof, and is then stretched to the desired final diameter. Heating the rod (10) at a lower temperature during stretching increases the viscosity thereof which reduces its response to the stretching conditions, thereby affording better control over diameter fluctuations.

Abstract: A method for inserting a multilead component (30) into a printed wiring board (31) (PWB), wherein the component has its leads (32, 33) arranged in two or more rows and the PWB (31) has two or more rows of apertures (36, 37) arranged in a pattern corresponding to that of the leads of the component. The method comprises spreading the lead rows of the component (30) further apart than the aperture rows of the PWB (31); placing the component on the PWB (31) and applying a downward insertion force (41) thereon; vibrating the component (30) and the PWB (31) relative to each other; and moving the lead rows toward the aperture rows thereby inserting each lead in its corresponding aperture in the PWB.

Abstract: A connector 14 with rows of contacts 12 is placed in a holder carriage 22 which is loaded into a wire insertion tool 10. Insertion blades 56 and 57 are moved by a trigger mechanism 17 to insert a pair of wires 11 into two contacts whereupon the blades act to sever excess sections of the wires at points closely adjacent to the contacts. Upon release of the trigger 17, an index mechanism 23 is operated to move the holder carriage 22 and the connector to position the next two contacts in alignment with the insertion blades 56 and 57.

Abstract: Printed circuit boards having a plurality of circuit layers are produced on a copper-clad substrate by first forming a pattern in a desired configuration to produce the first layer of the printed circuit board, then covering it with an energy-sensitive material comprising a rubber modified epoxy resin, an acrylated epoxy resin and a viscosity modifier; the energy-sensitive material is delineated in a desired pattern and developed to uncover portions of the underlying metallization pattern and the entire substrate is then blanket cured to produce a rigid layer having openings in appropriate places; the openings are metallized and a second copper pattern is produced on the cured polymer by conventional metallization and lithographic techniques. If desired, the process is repeated until a suitable number of copper patterned levels are obtained.

Abstract: A heating device is disclosed wherein a printed circuit board is uniformly preheated before discrete electronic components are soldered onto the boards. The soldering process includes a reflow stage where the boards are subject to rapid temperature change causing internal heat stresses which warp the boards if they haven't been preheated. The device comprises a non-conductive body and conductive elements, such as steel staples, embedded in said body. The staples extend through both sides of said body making contact with a heating surface and supporting the printed circuit board which sits upon them. The staples are spaced and arranged so the components' electrical pins which extend beyond the bottom surface of the board pass into the bed of staples without interference. Therefore, heat is transferred from the heating surface directly to the board via the conducting staples in a uniform fashion.

Abstract: Nondestructive characterization of each of the layers (d.sub.n) of a multilayer thin film structure (25) is obtained by directing a first beam of radiation (40) into an optical coupler (37) having a base (38) in contact with the surface of the structure (25). The angle of the beam entering the coupler is such that the beam is reflected from the base with an evanescent wave component passing from the coupler and coupling into the multilayer thin film structure as a real beam. The real beam is reflected from the layers of the thin film structure (25) back in the coupler (37) where it combines with the beam (51) reflected from the base and exits the coupler with an intensity related to the characteristics of the structure layers. A servo motor (46) rotates the coupler to scan the first beam therein and a detector (50) detects the intensity of the combined beams exiting the coupler during the scanning thereof by the first beam.

Abstract: This invention pertains to a microcomputer controlled coin telephone set which prevents coin call fraud and performs all of the coin discrimination functions. The microcomputer also checks the operational readiness of the telephone set to prevent the acceptance of coins into a hopper for late collection by a coin box unless or until the set is fully functional.

Abstract: A leading end portion (33) of a supply of cordge (31) is clamped to a mandrel (32) such that it is straight, after which a plurality of convolutions of the cordage are wound on the mandrel. The cordage is severed from the supply and a trailing end portion (34) of the wound cordage is clamped to the mandrel in a manner which causes it to be straight and hence suitable for termination with a modular plug (37). The coiled cordage is heated and cooled and is then removed from the mandrel while simultaneously the direction of the helices is reversed. Then the cordage is severed at a predetermined location to produce two retractile cords, for example, one including the leading end portion of the length of wound cordage and a newly formed straight trailing portion. The second cord includes a newly formed straight leading end portion and the initial trailing end portion. The newly formed end portion of each cord is caused to be held in a straight configuration and annealed to cause it to retain that configuration.

Abstract: An apparatus (28) for dispensing solder paste into openings (26-26) in a stencil (24) comprises a housing (30) having a piston (60) slidably mounted therein. A manifold (70), having a successively increasing cross-sectional area, is attached to a side wall (42) of the housing for admitting a viscous material, such as solder paste therein through successively larger sized openings (76-76) so the paste is distributed evenly beneath the piston. A pair of elastomeric blades (50-50) are secured to, and depend from the housing on opposite sides of a slot (46) to contact the stencil (24). Upon the application of a fluid pressure against the piston, paste will be expelled from the slot within a working region (96) between the blades. The blades force paste into the openings in the stencil when the housing is moved thereacross.

Abstract: A bonded ASP cable includes a multiconductor core which is filled with a waterproofing material. The core is enclosed by a plastic layer (28) which is flooded with a waterproofing material. Wrapped longitudinally about the plastic layer is a corrugated inner shield (31) having a longitudinal seam (35) and having an outer surface covered with a waterproofing material. The inner shield is enclosed by a corrugated outer shield (36) which has an overlapped longitudinal seam (38) and which has an outer surface coated with a layer of an adhesive material. As the outer shield is being formed, a sealant material is introduced into engagement with the inner shield in the vicinity of the longitudinal edge portions of the outer shield. Then as the longitudinal edge portions of the outer shield are overlapped and engaged with each other, the sealant material is caused to flow into cavities between the two shields adjacent to the seam of the outer shield to form a gasket (66).

Abstract: In order to mold a plurality of articles (20--20) which are disposed in a line, a molding arrangement in an apparatus (60) includes a plurality of cavities (109--109) which are spaced equidistantly from an infeed sprue (131). A primary network of a distribution system (50) through which an injection molding material is flowed from the infeed sprue to cavity gates (151--151) is disposed substantially along a vertical plane (150). Afterwards the injection molding material which has been flowed from the primary network and along a secondary network into the cavities is solidified. Then the primary network is exposed by causing wedge blocks (79--79) to be disengaged from each other and from an adjacent stationary platen (62) and cavity plate (90) by movement of each block in a direction transverse to the plane.

Abstract: An advancing optical fiber (22) is marked with a plurality of spaced indicia along its longitudinal axis. The indicia are applied by an applicator wheel (56) in the form of a disc which is mounted for rotation about an axis which is transverse to the path of travel of the optical fiber. The wheel has a plurality of marking teeth (70-70) arranged about its periphery with each tooth provided with a groove (72) for receiving increments of length of the optical fiber as it is moved rotatably. As the wheel is turned, each tooth in seriatim compresses a porous, resilient pad (80) which is disposed to one side of the wheel in a chamber through which the optical fiber is advanced to cause ink from the pad to be received in the groove of each tooth. Further rotation of the wheel causes ink to be transferred from each groove to the moving fiber. The pad is supplied with ink through a tube by a peristaltic pump (90).

Abstract: A component module (15, 70), adapted for piggyback mounting on an IC Dip (51,81), preferably incorporates a decoupling capacitor (18, 44, 74), with opposite end electrodes (23, 24), encapsulated within a molded housing (21, 72) of preferably parallelepiped configuration. The electrodes are uniquely connected to only two of preferably four rectangularly shaped terminals (26-29, 76-79) that project downwardly from different corners of the housing. The terminals, as well as an optional heat sink (61) are preferably formed out of a strip stock carrier (33). The two capacitor-connected terminals (27, 29 and 77, 79) are uniquely diagonally disposed and spaced, for a decoupling application, so as to respectively engage the battery and ground leads of a standard pin-out DIP (51, 81). The other two diagonally disposed component module terminals (26, 28 or 76, 78) are electrically isolated from the capacitor, being employed only to facilitate the mounting of the module on an associated DIP.