Abstract: An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparatus, one or a plurality of flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or a plurality of counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed into the treatment agent during the treatment.

Abstract: To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus 100. This apparatus comprises at least one flow member 150 that includes respectively at least one paddle-like flow element 155, wherein at least one flow member 155 is disposed situated opposite the surface of the product W and is moveable substantially parallel to the surface of the product W.

Abstract: An aqueous, alkaline, cyanide-free electrolyte bath for deposition of zinc alloy layers on substrate surfaces is described, which contains cationic pyridinium compounds as brighteners and polyamines as complexing agents. The electrolyte bath is suitable for electroplating bright and even zinc alloy coatings.

Abstract: The invention relates to a treatment solution for producing substantially chromium(VI)-free black conversion layers on alloy layers containing zinc, the solution comprising the following: (i) at least one first carboxylic acid having 1 to 8 carbon atoms, the acid containing no polar groups with exception of the carboxyl group and being a monocarboxylic acid, (ii) at least one second carboxylic acid having 1 to 8 carbon atoms, comprising at least one further polar group that is selected from —OH, —SO3H, —NH2, —NHR, —NR2, —NR3+, and —COOH (wherein R is a C1-C6 alkyl group), (iii) 20 to 400 mmol/l Cr3+ and (iv) 50 to 2000 mmol/l NO3?, and wherein (a) the total concentration of carboxyl groups of the first carboxylic acid(s) is within a range of 5 to 150 mmol/l, (b) the total concentration of carboxyl groups of the second carboxylic acid(s) is within a range of 5 to 150 mmol/l, (c) the ratio of the concentration (in mol/l) of NO3? to Cr3+ is ?1, and (d) the following prerequisite is met (formula (I)), 0.

Abstract: An agent for the production of anti-corrosion layers on metal surfaces, produced by the following steps: A) producing an aqueous solution which contains at least the following: a) oxo-cations selected from MnO3+, VO3+, VO2+, WO22+, MoO22+, TiO2+, ZrO2+ and mixtures thereof, and b) halogen complex anions of the structure MXab?, wherein M is selected from B, Ti, Zr, Si, Al, X is selected from F, Cl, Br, I, a is an integer of between 3 and 6 and b is an integer of between 1 and 4, and B) forming nanoparticles having a mean particle diameter of <500 nm in the solution in situ by physical and/or chemical treatment of the solution, wherein the physical and/or chemical treatment is selected among a change in temperature, a change in the ion concentration, a change in the pH-value, a change in the pressure, supersaturation of the solution, agitation of the solution, adding an oxidising agent and/or adding a reducing agent.

Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt, wherein an iminosuccinic acid or a derivative thereof is used as said complexing agent.

Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.

Abstract: In regenerating an electroless metal plating bath by electrodialysis, it has been found that the metal of the metal plating bath deposits in the electrolysis arrangement. To overcome this problem, an improvement to prior art regenerating devices is suggested, said improvement consisting in providing main cation exchangers for removing ions of this metal from a concentrate fluid. The main cation exchangers are coupled to the concentrate compartments of the electrolysis arrangement in such a manner that the concentrate fluid flowing through the concentrate compartments is allowed to pass through the main cation exchangers and to be recirculated back into the concentrate compartments.

Abstract: The present invention relates to a method for treating copper or copper alloy surfaces for tight bonding to polymeric substrates, for example solder masks found in multilayer printed circuit boards. The substrate generally is a semiconductor-device, a lead frame or a printed circuit board.

Abstract: A nozzle arrangement is described which may in particular be used as a flow nozzle in galvanization systems with horizontal throughput of printed-circuit boards. The nozzle arrangement comprises a longitudinal housing (2) with at least one fluid feed opening to feed a treatment fluid for treating a work piece, for example a printed-circuit board, and preferably a plurality of slotted fluid delivery openings (8) for releasing the treatment fluid. In the housing (2) a fluid channel (5) is formed for feeding the treatment fluid from the fluid feed opening to the fluid delivery openings (8). In order to achieve the most even possible flow speed of the treatment fluid at the fluid delivery openings (8), (a) the throughput of the fluid channel (5) for the treatment fluid reduces continuously from the fluid feed opening in the longitudinal direction of the housing (2) and/or (b) before the delivery of the fluid from the fluid delivery openings (8) a storage chamber is provided.

Abstract: Disclosed is an electroplating method for filling cavities, through holes, blind holes, or micro blind holes of a work piece with metals. According to said method, the work piece containing cavities, through holes, blind holes, or micro blind holes is brought in contact with a metal deposition electrolyte, and a voltage is applied between the work piece and at least one anode such that a current flow is fed to the work piece. The invention method is characterized in that the electrolyte encompasses a redox system.

Abstract: Disclosed is a process for mixing and gentle transport and transfer of powders to substrates.

Abstract: For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) sulfur-containing compound represented by the formula Y—S—R1—SO3X??I wherein X is H or an alkali metal, R1 is an alkylene group containing from 1 to about 5 carbon atoms, Y is H, S—R1—SO3X, C(S)NR2?, C(S)OR?, C(NH2)NR2?, or a heterocyclic group, and each R? is independently H, or an alkyl group containing from 1 to about 5 carbon atoms. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.

Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

Abstract: In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating from various counter electrodes 5.x in the plant are set to values in function of the electrolytically to be processed surface areas of the work pieces 3.x as far as they are located directly opposite the respective ones of the various counter electrodes 5.x. Moreover, the distance between the work pieces 3.x and the counter electrodes 5.x is chosen to be 50 mm maximum. Means 19 for individually controlling and adjusting every single current supply unit 15.x of the counter electrodes 5.x are provided for this purpose. Said means 19 are configured in such a manner that the respective electric currents originating from the various counter electrodes 5.x are settable to values in function of the electrolytically to be processed surface areas of the work pieces 3.

Abstract: The invention relates to the conveyance and preferably also to the electrical contacting of an item to be treated (1), for example in the form of a printed circuit board or a conductor foil, in an electrolysis system. A device according to the invention comprises a large number of clamps (10) able to move along a conveyance path (4) and driven by a continuously revolving drive means (20). The device is configured in such a way that the clamps (10) at the start (4a) of the conveyance path (4) are brought from an open state into a closed state in order to grip and preferably also electrically to contact the item to be treated, and that the clamps (10) respectively at the end (4b) of the conveyance path (4) are brought from the closed into the open state in order to re-release the item to be treated (1).

Abstract: The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected from Fe, Ni, Co, Sn salts, wherein the bath can be purified continuously so that the process can be operated without interruption, as well as apparatus for carrying out this process.

Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.