Abstract: For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) sulfur-containing compound represented by the formula Y—S—R1—SO3X??I wherein X is H or an alkali metal, R1 is an alkylene group containing from 1 to about 5 carbon atoms, Y is H, S—R1—SO3X, C(S)NR2?, C(S)OR?, C(NH2)NR2?, or a heterocyclic group, and each R? is independently H, or an alkyl group containing from 1 to about 5 carbon atoms. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.

Abstract: The invention relates to a control of etching processes of insulating substrates by means of gloss measurement. By this method a surface roughness can be achieved which leads to good adhesion of metals layers deposited in subsequent metallization steps. This method is particularly suited for the production of printed circuit boards.

Abstract: In order to avoid an edge-effect (increased electrical field line density at the edges of electrolytically to be processed work pieces) during the electrolytic processing of work pieces 3.x in a conveyorized system, the electric currents originating from various counter electrodes 5.x in the plant are set to values in function of the electrolytically to be processed surface areas of the work pieces 3.x as far as they are located directly opposite the respective ones of the various counter electrodes 5.x. Moreover, the distance between the work pieces 3.x and the counter electrodes 5.x is chosen to be 50 mm maximum. Means 19 for individually controlling and adjusting every single current supply unit 15.x of the counter electrodes 5.x are provided for this purpose. Said means 19 are configured in such a manner that the respective electric currents originating from the various counter electrodes 5.x are settable to values in function of the electrolytically to be processed surface areas of the work pieces 3.

Abstract: The invention relates to the conveyance and preferably also to the electrical contacting of an item to be treated (1), for example in the form of a printed circuit board or a conductor foil, in an electrolysis system. A device according to the invention comprises a large number of clamps (10) able to move along a conveyance path (4) and driven by a continuously revolving drive means (20). The device is configured in such a way that the clamps (10) at the start (4a) of the conveyance path (4) are brought from an open state into a closed state in order to grip and preferably also electrically to contact the item to be treated, and that the clamps (10) respectively at the end (4b) of the conveyance path (4) are brought from the closed into the open state in order to re-release the item to be treated (1).

Abstract: The invention provides a process for depositing metallic layers from acidic or alkaline zinc or zinc alloy baths containing organic additives selected from brighteners, surfactants and complexing agents, a soluble zinc salt and optionally further metal salts selected from Fe, Ni, Co, Sn salts, wherein the bath can be purified continuously so that the process can be operated without interruption, as well as apparatus for carrying out this process.

Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.

Abstract: A method for the regeneration of etching solutions containing iron for the use in etching or pickling copper or copper alloys and an apparatus for carrying out the method is described. The method involves feeding the etching solution to be regenerated from the etching system into an electrolysis cell being hermetically sealed or having an anode hood (8), the electrolysis cell comprising a cathode (1), an inert anode (2), means (3) for removing the electrolytically deposited copper from the cathode and means (4) for collecting the removed copper and applying a potential to the removed copper, wherein the electrolysis cell does not have an ion exchange membrane or a diaphragm.

Abstract: The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask.

Abstract: In one embodiment, this invention relates to an aqueous acid iron phosphorus bath which comprises (A) at least one compound from which iron can be electrolytically deposited, (B) hypophosphite ion, and (C) a sulfur-containing compound selected from sulfoalkylated polyethylene imines, sulfonated safranin dye, and mercapto aliphatic sulfonic acids or alkali metal salts thereof. Optionally, the aqueous acidic iron phosphorus electroplating bath of the invention also may comprise aluminum irons. The alloys which are deposited on the substrates by the process of the present invention are characterized by the presence of iron, phosphorus and sulfur.

Abstract: For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof.

Abstract: The problem in forming solderable and bondable layers on printed circuit boards is that the surfaces tarnish after storage of the boards prior to further processing (mounting of the electrical components), thus affecting solderability and bondability. In order to overcome this problem it is suggested to deposit, in a first method step, a first metal which is more noble than copper to the printed circuit board and to plate silver in a second method step with the proviso that the first metal be deposited at a rate that is at most half the rate of silver in the second method step when the first metal is silver.

Abstract: In order to even out the electrolytic treatment of workpieces 9 made of electrically non-conductive material and having a very thin base metallising 6, 8, a device is employed in a manner according to the invention comprising means for bringing treatment liquid into contact with the workpieces 9, means 10 for electrical contracting of the workpieces 9 at contacting sites and counterelectrodes 5.x which are so arranged that the workpieces 9 may be arranged opposing them, whereby the counterelectrodes 5.x are each subdivided into at least two electrode segments 13.x such that at least one contact-near electrode segment 13.1 and at least one contact-remote electrode segment 13.4 and possibly further electrode segments 13.2, 13.3 arranged between them are provided and each electrode segment 13.x is fed by a separate current source 15.x.

Abstract: To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.

Abstract: The invention relates to a process for the mixing and gentle transport and the transfer of powders to substrates wherein the powder particles are first charged by friction in the presence of magnetic particles and then transported by means of a fluidized bed and optionally one or more mixing rolls and then transferred and applied to a substrate by means of an electric field between a brush drum and a substrate drum carrying said substrate, characterized in that the mixing and the transport of the powder particles and the magnetic particles are carried out by means of a boiling bed.

Abstract: An electroplating bath, a system, a process for, and the article obtained from, depositing a zinc-nickel ternary or higher alloy, a) zinc ions; b) nickel ions; and c) one or more ionic species selected from ions of Te+4, Bi+3 and Sb+3, and in some embodiments, further including one or more additional ionic species selected from ions of Bi+3, Sb+3, Ag+1, Cd+2, Co+2, Cr+3, Cu+2, Fe+2, In+3, Mn+2, Mo+6, P+3, Sn+2 and W+6. In some embodiments, the system includes a divider forming a cathodic chamber and an anodic chamber, with the electroplating bath in the cathodic chamber only. In various embodiments, the zinc-nickel ternary and higher alloys may provide improved properties to the conductive substrates upon which the alloys are deposited.

Abstract: For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.

Abstract: To reduce ionic contaminants on printed circuit boards that are at least partially covered with a solder resist mask and are provided with top layers on the copper structures, an aqueous cleaning solution is used, which contains at least one ethanolamine compound and/or the salt thereof, at least one alcoholic solvent and, at need, at least one guanidine compound and/or the salt thereof.

Abstract: For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 ?m, a depth t ranging from 30 to 150 ?m, a mean spacing s ranging from 30 to 300 ?m, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 ?m and said base plate (5) having a thickness g ranging from 100 to 1,000 ?m, said cooler further having at least one splitting chamber (10) traversing the metal foils (1) approximately in the region of the thermal contact surface