Abstract: The present invention is concerned with improved means for etching circuit structures on printed circuit board or wafer substrates of copper or copper alloys in a manner effectively removing unwanted copper from such circuit structures leaving behind a smooth copper surface applying an etching solution containing an Fe(II)/Fe(III) redox system and sulfur containing organic additives. It is an advantage of the present invention that the solution can also applied for plating of copper prior to etching.

Abstract: The invention relates to a method for producing a coating layer protecting against corrosion wherein a surface which is to be treated is brought into contact with an aqueous treatment solution containing chromium(III) ions and at least one phosphate compound, wherein the ratio of the molar concentration of the chromium(III) ions to the molar concentration of the at least one phosphate compound (calculated as orthophosphate) lies between 1:1.5 and 1:3. The method improves the corrosion protection of metallic, in particular, zinc-containing, surfaces provided with conversion layers. The decorative and functional properties of the surface are maintained or improved. Furthermore, the known problems resulting from the use of chromium(VI)-containing compounds or from post-treatments with polymer dispersions are avoided.

Abstract: Described is a method of forming a metal or metal alloy layer onto a substrate comprising the following steps i) provide a substrate including a permanent resin layer on top of at least one contact area and a temporary resin layer on top of the permanent resin layer, ii) contact the entire substrate area including the at least one contact area with a solution suitable to provide a conductive layer on the substrate surface and i) electroplate a metal or metal alloy layer onto the conductive layer.

Abstract: Method of forming a solder alloy deposit on a substrate comprising i) provide a substrate including a surface bearing electrical circuitry that includes at least one inner layer contact area, ii) form a solder mask layer on the substrate surface and patterned to expose at least one contact area, iii) contact the entire substrate area including the solder mask layer and the at least one contact area with a solution to provide a metal seed layer on the substrate surface, iv) form a structured resist layer on the metal seed layer, v) electroplate a first solder material layer containing tin onto the conductive layer, vi) electroplate a second solder material layer onto the first solder material layer, vii) remove the structured resist layer and etch away an amount of the metal seed layer sufficient to remove the metal seed layer from the solder mask layer area and reflow the substrate.

Abstract: The invention relates to a process for producing a corrosion-inhibiting coating for substrates having a surface consisting of zinc, magnesium, aluminium or one of their alloys, wherein the surface to be treated is brought into contact in direct succession with two aqueous treatment solutions containing chromium(III) ions, metal ions of the substrate surface to be treated and at least one complexing agent. The first treatment solution has a pH in the range from 1.0 to 4.0, while the second treatment solution has a pH of from 3.0 to 12.0. The process of the invention produces a smaller amount of wastewater polluted with heavy metals.

Abstract: Subject of the present application is a method to determine the satin-effect on metal plated substrates comprising the following steps: i) irradiate the sample with light, ii) detect the intensity distribution of the scattered light, iii) determine at least one of the following parameters:—the Aq value of the intensity distribution, wherein the Aq value represents the variance of the backscattered light angle (?i) multiplied with the device constant k and—the integrated intensity of the intensity distribution, iv) compare the at least one parameter to a target value.

Abstract: Disclosed is a composition for and applying said method for micro etching of copper or copper alloys during manufacture of printed circuit boards. Said composition comprises a copper salt, a source of halide ions, a buffer system and a benzothiazole compound as an etch refiner. The inventive composition and method is especially useful for manufacture of printed circuit boards having structural features of ?100 ?m.

Abstract: Described is a new a solution comprising a phosphorous compound and a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

Abstract: The following method is to improve selectivity during metallisation of surface areas to be metallised on objects 7 having different plastics while not allowing the areas not to be metallised to be metallised: A) etching of the objects 7 with an etching solution; B) treatment of the objects 7 with a solution of a colloid or with a metal compound, the metal being a metal of Group VIIIB or IB of the Periodic Table of the Elements; and C) electrolytic metallisation of the objects 7 with a metallisation solution. The objects 7 are subjected to ultrasonic treatment during the treatment in a further method step following method step B) and before method step C) in order to avoid metallisation of at least one first plastic exposed on the surface of the objects 7 while at least one second plastic exposed on the surface of the objects 7 is metallised.

Abstract: Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Abstract: A device (1) for the wet-chemical treatment of material to be treated (10), in particular of flat material to be treated (10), comprises a treatment vessel (2) for treating the material to be treated (10) with a treatment liquid (9), a transport device (24) for transporting the material to be treated (10) through the treatment vessel (2), and a feed device (11) for feeding an inert gas (16) into the treatment vessel (2).

Abstract: To prevent biological fouling in an electrodialysis device, an electrodialysis device including a membrane electrolysis stack are created. Every membrane electrolysis stack comprises membranes stacked on top of each other and respectively dilute and concentrate compartments arranged therebetween, at least one first and at least one second membrane alternating in succession in the membrane electrolysis stack. At least one first membrane is selected from a group comprising an anion exchange membrane and a bipolar membrane, and at least one second membrane is selected from a group comprising a monoselective anion exchange membrane, a monoselective cation exchange membrane and a proton-selective exchange membrane, with the proviso that the membranes are respectively selected independently of each other and that at least one first membrane in the membrane electrolysis stack is a bipolar membrane.

Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, and (iii) a Au layer having a thickness ?1.0 ?m.

Abstract: There is described an alkaline electroplating bath for depositing zinc alloys on substrates having an anode and a cathode, wherein the anode region and the cathode region are separated from each other by a filtration membrane.

Abstract: To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus 100. This apparatus comprises at least one flow member 150 that includes respectively at least one paddle-like flow element 155, wherein at least one flow member 155 is disposed situated opposite the surface of the product W and is moveable substantially parallel to the surface of the product W.

Abstract: For producing corrosion resistant yellow passivate layers on zinc and zinc alloy surfaces, an aqueous reaction solution is utilized that contains trivalent chromium ions, at least one acid as well as at least one heteroaromatic compound selected from the group comprising nicotinic acid, the salts and derivatives thereof.

Abstract: Improved compositions and processes for zincating magnesium and magnesium alloy substrates. An aqueous zincating composition having a pH of from about 8 to about 11 and including zinc ions, a complexing agent, fluoride ions and a reducing agent. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including immersing the substrate in the non-electrolytic aqueous zincating composition for a time sufficient to deposit a zincate on the substrate. A non-electrolytic process for zincating a magnesium or magnesium alloy substrate, including preparing a aqueous non-electrolytic composition comprising zinc ions, a complexing agent, fluoride ions and a pH in the range from about 8 to about 11; adding to the composition an amount of a reducing agent sufficient to improve deposition of zincate on the magnesium or magnesium alloy substrate; and immersing the substrate in a composition for a time sufficient to deposit the zincate on the substrate.

Abstract: The invention relates to chromium- and cobalt-free treatment solutions for producing black coatings which afford corrosion protection. The treatment solution of the invention contains oxo cations or complex halogen ions or mixtures of oxo cations and complex halogen ions, an oxidant and an organic sulphur compound.

Abstract: Additives for electrolyte baths for the electrodeposition of zinc or zinc alloy layer are described. The additives are polymers with terminal amino groups. These polymers are obtainable by reaction of at least one diamino compound (having two tertiary amino groups) with at least one di(pseudo)halogen compound, wherein the diamino compound is used in stoichiometric excess. The additives effect, in particular, a very little formation of bubbles and only few burnings as well as a uniform distribution of layer thickness in the electrodeposition of zinc or zinc alloy layers.

Abstract: Described is a new process for applying a metal coating to a non-conductive substrate comprising the steps of (a) contacting the substrate with an activator comprising a noble metal/group IVA metal sol to obtain a treated substrate, (b) contacting said treated substrate with a composition comprising a solution of: (i) a Cu(II), Ag, Au or Ni soluble metal salt or mixtures thereof, (ii) 0.05 to 5 mol/l of a group IA metal hydroxide and (iii) a complexing agent for an ion of the metal of said metal salt comprising an organic material having a cumulative formation constant log K of from about 0.73 to about 21.95 for an ion of the metal of said metal salt, characterised in that the composition according to step (b) is treated with an electrical current for a period of time prior to and/or during contacting said solution with the substrate.