Abstract: An inspection tool includes a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical image scale correction of the images. In operation, separate inspection tools are calibrated separately to obtain a characteristic response with respect to imaging and/or illumination for each such inspection tool. A standard target is then imaged by each inspection tool and the response of each of the inspection tools is normalized to ensure uniformity of the output of each inspection tool with respect to the other inspection tools.

Abstract: A frame grabber with switched fabric interface where in varying embodiments the fabric interface may be one of InfiniBand, Star Fabric, or PCI Express or the like.

Abstract: A system for processing image data, such as an image of a die cut from a silicon wafer, is provided. The system includes an irregular edge detection system, which can locate edge data of a feature of the image data, such as the edge of a probe mark in a bond pad. A feature area calculation system is connected to the irregular edge detection system, such as by accessing data stored by the irregular edge detection system. The feature area calculation system can receive the edge data of the feature and determining the area of the feature, such as by summing normalized pixel area values. The irregular edge detection system uses interpolation to locate edges that occur between the centerpoints of adjacent pixels.

Abstract: A system for inspecting components is provided. The system includes an axial lighting system that illuminates the component with axial lighting to allow one or more features of the component to be located, such as by causing protruding features to be brighter than the background and recessed features to be darker than the background. An off-axis lighting system illuminates the component with off-axis lighting in the absence of the axial lighting to allow the component to be inspected to locate one or more features, such as a bump contact.

Abstract: A system for inspecting a component is provided. The system includes an interferometer having a coated mirror, such as a coating that allows only a fraction of light to pass, where the coating has a predetermined thickness. An interference inspection system receives reflected light from the component through the interferometer and determines whether interference is occurring at each of two or more predetermined areas, such as at point corresponding to a bump contact and at a second point corresponding to a substrate. The thickness of the coating is related to a height difference between two or more of the predetermined areas, such as by creating interference at both areas by changing the reflection path length by an amount required to cause simultaneous interference fringing for a designed height difference.

Abstract: An inspection device comprises a light source, a pellicle beamsplitter for receiving light from the light source and for redirecting the light, and an aperture array for receiving light from the pellicle beamsplitter. The aperture array is a two dimensional array of pinholes having an x axis and a y axis ninety degrees apart, wherein the distance between pinholes in the x direction is greater than the distance between pinholes in the y direction. The inspection device further comprises an imaging system comprising an object imager including a plurality of lenses, a camera reimager including a plurality of lenses, and a camera for acquiring an image.

Abstract: An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a plurality of horizontal bands. Adjacent edge clusters about the circumference of the wafer are combined into edge pixel bins. The edge pixel bins are analyzed via edge clusters analysis to identify defects. The edge pixel bins are also analyzed via blob analysis to determine defects.

Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response.

Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection, for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.

Abstract: An end effector alignment tool for properly aligning the end effector arm with a prealigner and separately with a top plate.

Abstract: A system for inspecting a component is provided. The system includes an interferometer having a coated mirror, such as a coating that allows only a fraction of light to pass, where the coating has a predetermined thickness. An interference inspection system receives reflected light from the component through the interferometer and determines whether interference is occurring at each of two or more predetermined areas, such as at point corresponding to a bump contact and at a second point corresponding to a substrate. The thickness of the coating is related to a height difference between two or more of the predetermined areas, such as by creating interference at both areas by changing the reflection path length by an amount required to cause simultaneous interference fringing for a designed height difference.

Abstract: A method for controlling a theta-theta coordinate stage moves an object relative to an imaging system. While moving the object, the object image is rotated to compensate for object rotation. Orientations of features in the image are preserved, and removal of apparent rotation in the image reduces operator confusion while directing movement of the object. Angular velocity of the object motion is controlled so that image shift speed is independent of the radial position of the point being viewed. An edge detector measures the edge position of the object while the theta-theta coordinate stage rotates the object. A prealignment process determines position and orientation of the object from measured edge positions. A further alignment process uses automated pattern recognition to identify features on the object when the image is rotated so that orientations of the feature are approximately known.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: An inspection system, and process for use thereof, allows for inspecting of semiconductors or like substrates with minimal or no wasted image space.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response. This process and system creates multiple parallel confocal optical paths along a line. The out of focus light is eliminated by placing an aperture at a plane which is a conjugate focal plane to the surface of the sample. The result is that the sensor produces a signal only when the sample surface is in a narrow focal range.

Abstract: A wafer handler for semiconductors or like substrates for significantly reduces alignment problems by reducing or eliminating sagging in large diameter wafers such as 300 mm wafers.

Abstract: A wafer staging platform for use with equipment such as an inspection system for inspecting of semiconductors or like substrates. The platform is designed to reduce the amount of time needed to exchange wafers on a processing tool.