Abstract: An end effector alignment tool for properly aligning the end effector arm with a prealigner and separately with a top plate.

Abstract: A laser alignment tool for properly aligning the laser used to count, differentiate, measure, determine orientation or if cross slotted, and/or otherwise correlate or verify position, quantity or other parameters of wafers or like substrates in a cassette.

Abstract: An inspection system, and process for use thereof, allows for inspecting of semiconductors or like substrates. The inspection system keeps the focus of the sensor within the depth of field of the lens used. The system specifically uses the process of making a separate pass over the wafer surface using a 3D point sensor before the inspection of the wafer begins.

Abstract: An optical throughput condenser re-concentrates light thereby causing light which otherwise would be wasted outside of the useful A&OHgr; product, also known as optical throughput, of an illuminating system to be redirected back into the useful A&OHgr; product. The optical throughput condenser includes a thin film having an angle gate such that light striking the surface with a range of incident angles such that the angle of incident is less than or equal to the gate angle (&THgr;GATE) transmits through the thin film. Light striking the surface with a range of incident angles such that the angle of incident is grater than the gate angle. reflects back from the thin film. An integrating sphere is positioned such that light reflecting back from the thin film is directed towards the integrating sphere so that the light is redirected towards the angle gate.

Abstract: A frame grabber with switched fabric interface where in varying embodiments the fabric interface may be one of InfiniBand, Star Fabric, or PCI Express or the like.

Abstract: A sensor, camera or imager with on-chip switched fabric interface where in varying embodiments the fabric interface may be one of InfiniBand, StarFabric, or PCI Express.

Abstract: An inspection system is provided for performing high speed inspection. The system includes a data source, one or more computers for processing the data, and a switched fabric for data distribution to the one or more computers.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.

Abstract: An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and designed for second optical wafer inspection for such defects as metalization defects (such as scratches, voids, corrosion, and bridging), diffusion defects, passivation layer defects, scribing defects, glassivation defects, chips and cracks from sawing, solder bump defects, and bond pad area defects.