Abstract: A finger sensor apparatus may include an integrated circuit substrate for receiving a user's finger adjacent thereto, and a plurality of infrared sensing pixels on the integrated circuit substrate. The infrared sensing pixels are for sensing infrared radiation naturally emitted from subdermal features when the user's finger is positioned adjacent the integrated circuit substrate. The finger sensor apparatus may also include a processor connected to the infrared sensing pixels for generating infrared biometric data based upon infrared radiation naturally emitted from the subdermal features of the user's finger.

Abstract: A finger sensing device includes a finger sensing area, and a processor cooperating therewith for reducing a number of possible match combinations between a sensed finger data set and each of a plurality of enrolled finger data sets. The processor may reduce the number of possible match combinations by generating a plurality of overlap hypotheses for each possible match combination, generating a co-occurrence matrix score based upon the plurality of overlap hypotheses for each possible match combination, and comparing the co-occurrence matrix scores to thereby reduce the number of possible match combinations. The processor may also perform a match operation for the sensed finger data set based upon the reduced number of possible match combinations. The sensed finger data set may include a sensed finger ridge flow data set, and each enrolled finger data set may include an enrolled finger ridge flow data set.

Abstract: A finger sensing device may include a finger sensing area, at least one processing stage coupled to the finger sensing area and having at least one adaptively determined processing parameter, and a controller for spoof reduction. More particularly, the controller may determine a spoof attempt based upon a change in the at least one adaptively determined processing parameter. For example, the at least one adaptively determined processing parameter may include a feedback determined processing parameter. Accordingly, the finger sensing device has enhanced spoof reduction, since different materials, for example, will cause a change in an adaptive processing parameter and thereby indicate the attempted spoof.

Abstract: A finger sensing device may include a finger sensing area to receive a user's finger moved in a sliding motion, and a controller cooperating with the finger sensing area for generating successive image samples. Moreover, the controller may also generate the displacement estimate of the user's finger by at least performing a plurality of different image sample correlations between at least one pair of image samples, and cross-verifying results of the plurality of different image sample correlations.

Abstract: An electronic device includes a housing, a display carried by the housing, and a fingerprint sensor also carried by the housing. The electronic device may also include a processor for generating a plurality of menu items on the display, and for scrolling an indicator along the menu items based upon static placement of a finger adjacent a selected portion of the fingerprint sensor. The sensor may have a polygonal shape, and the scrolling may be in a direction of a corner portion of the polygonal shape. The menu items may be arranged in a single column, or in a plurality of columns.

Abstract: A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area, an IC carrier having a cavity receiving the finger sensing IC therein and having at least one beveled upper edge, and a frame surrounding at least a portion of an upper perimeter of the IC carrier and having at least one inclined surface corresponding to the at least one beveled upper edge of the IC carrier. The finger sensor may also include a biasing member for biasing the IC carrier into alignment within the frame. The biasing member may include at least one resilient body for biasing the IC carrier upward within the frame. In other embodiments, the finger sensor may include an IC carrier having a cavity receiving the finger sensing IC therein and having at least one laterally extending projection.

Abstract: A multi-biometric finger sensor may include at least one optical dispersion sensing pixel on an integrated circuit substrate for sensing dispersed light from the user's finger, and at least one other finger biometric characteristic sensor on the integrated circuit substrate for sensing a finger biometric characteristic different than the dispersed light from the user's finger. The sensor may also include a processor connected to the at least one optical dispersion sensing pixel and the at least one other finger biometric characteristic sensor.

Abstract: A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. The flexible circuit may include a flexible layer covering both the finger sensing area and the at least one bond pad, and at least one conductive trace carried by the flexible layer and coupled to the at least one bond pad. The flexible layer may permit finger sensing therethrough. The flexible circuit may include at least one connector portion extending beyond the finger sensing area and the at least one bond pad. For example, the connector portion may include a tab connector portion and/or a ball grid array connector portion. A fill material, such as an epoxy, may be provided between the IC finger sensor and the flexible circuit.

Abstract: A finger sensor may include a finger sensing integrated circuit (IC) having a finger sensing area and at least one bond pad adjacent thereto, and a flexible circuit coupled to the IC finger sensor. More particularly, the flexible circuit may include a flexible layer, and at least one conductive trace carried thereby and coupled to the at least one bond pad. The sensor may also include at least one Electrostatic Discharge (ESD) electrode carried by the flexible layer. The ESD electrode may be positioned adjacent a beveled edge, for example, of an IC carrier and thereby exposed through a small gap between an adjacent portion of a frame.

Abstract: A finger sensor may include a plurality of finger image sensing arrays for generating a respective plurality of finger image data sets based upon sliding finger movement over the finger image sensing arrays, and a processor cooperating with the finger image sensing arrays. The processor may determine finger movement based upon the finger image data sets, and generate a resampled finger image data set by resampling the finger image data sets based upon the determined finger movement. The processor may further deskew the finger image data sets when generating the resampled finger image data set.

Abstract: A fingerprint sensor may include a plurality of electrostatic discharge (ESD) electrodes carried by a dielectric layer of a fingerprint sensing portion. The fingerprint sensing portion is for sensing a fingerprint of a user. The fingerprint sensing portion may include the dielectric layer, and, in some embodiments, may also include an array of sensing electrodes also carried by the dielectric layer. Accordingly, each ESD electrode may be interposed between adjacent sensing electrodes. The ESD electrodes attract ESD events and dissipate the energy therein to avoid damaging adjacent sensing electrodes and/or portions of the dielectric layer. The fingerprint sensor may also include an electrically conductive layer connected to the ESD electrodes, which may provide a convenient ground plane, for example, for removing ESD energy from the fingerprint sensor. The electrically conductive layer may extend beneath the sensing electrodes.

Abstract: A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges. The method also preferably includes closing the first and second mold portions around the IC and injecting encapsulating material into the mold to encapsulate the IC and make the IC package having an exposed portion of the IC adjacent the mold protrusion. Morever, the bleed-through retention channel retains any encapsulating material bleeding beneath the peripheral edges of the IC contact surface, and prevents the encapsulating material from reaching further onto the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion from the mold.

Abstract: A finger sensing device may include a finger sensing area to receive a user's finger moved in a sliding motion, a sensor controller cooperating with the finger sensing area for collecting image data therefrom, an image processor, and a communications path for sending image data from the sensor controller to the image processor. The sensing device may use at least one of the sensor controller and the image processor for (i) selecting a reference image data subset based upon reference image data, (ii) selecting a new image data subset, and (iii) comparing the new image data subset to the reference image data subset to develop a matching score, and, if the matching score is above a matching threshold, then not having new image data corresponding to the new image data subset sent over the data communications path, and, if the matching score is below the matching threshold, then having the new image data corresponding to the new image data subset sent over the data communications path.

Abstract: A finger sensing device may include a finger sensing area to receive a user's finger moved in a sliding motion, and a controller cooperating with the finger sensing area for generating successive image samples at least some of which are separated by different time intervals. The controller may generate finger movement signals based upon the successive image samples and the different time intervals. The controller may generate a plurality of repeating groups of ratio-metrically related image samples based upon the different time intervals. The reduced number of image samples may provide greater processing efficiency and reduced power consumption.

Abstract: An integrated circuit sensor may include at least one infrared sensing element on a substrate. The sensing element may include at least one first thermocouple junction heated from infrared radiation, at least one second thermocouple junction connected to the first thermocouple junction, and a controller. The controller may detect a temperature difference between the first and second thermocouple junctions, and may pump heat therebetween to drive the detected temperature difference toward a desired value. The controller may also generate an infrared radiation output signal based upon the heat pumped. The controller may alternatingly switch between detecting the temperature difference and pumping heat, and the desired temperature difference may be zero. The sensor is readily made using integrated circuit processing technology, and may, for example, be used in many types of applications, such as biometric identification by including biometric processing circuitry connected to the controller.

Abstract: A finger sensor may include an integrated circuit substrate for receiving a user's finger adjacent thereto, and a plurality of infrared sensing pixels on the substrate. Each infrared sensing pixel may include at least one temperature sensor, at least one infrared antenna, and at least one conductive via interconnecting the at least one temperature sensor and the at least one infrared antenna. The infrared sensing pixels are for sensing infrared radiation emitted from subdermal features when the user's finger is positioned adjacent the integrated circuit substrate. The finger sensor apparatus may also include a processor connected to the infrared sensing pixels for generating infrared biometric data based upon infrared radiation emitted from the subdermal features of the user's finger.

Abstract: A fingerprint sensor package preferably includes a fingerprint sensing integrated circuit in a housing, and a circuit substrate comprising first and second portions connected together. The first portion is within the housing and mounts the fingerprint sensing integrated circuit, and the second portion is flexible and extends outwardly from the housing for facilitating electrical connection to the fingerprint sensing integrated circuit from external to the housing. Each portion of the circuit substrate preferably includes at least one insulating layer and at least one electrical conductor thereon. Accordingly, the package can be made relatively compact and electrical interconnections are facilitated by the second portion or extension of the circuit substrate. In one embodiment, the first and second portions are integrally formed together. In this embodiment, the first portion is also flexible. The sensor package is readily included on the upper surface of a laptop computer, for example.

Abstract: A method is for processing a plurality of finger biometric enrollment data sets that accounts for uncertainty in alignment between finger biometric enrollment data sets. The method may include generating a respective estimated physical transformation between each pair of finger biometric enrollment data sets, and generating a respective uncertainty for each estimated physical transformation. The method may also include associating the respective estimated physical transformation and the uncertainty for each estimated physical transformation with each pair of finger biometric enrollment data sets to define a logical finger biometric enrollment graph. The logical finger biometric enrollment graph is readily used for subsequent accurate matching in either touch sensor applications or slide sensor applications.

Abstract: A method for comparing a finger biometric verify ridge orientation characteristic map to a finger biometric enrollment ridge orientation characteristic map may include generating a first probability distribution function substantially for corresponding values of the verify and enrollment ridge orientation characteristic maps that differ from one another by less than or equal to a threshold difference. A second probability distribution function may be generated substantially for corresponding values of the verify and enrollment ridge orientation characteristic maps that differ from one another by more than the threshold difference. The verify ridge orientation characteristic map may be compared to the enrollment ridge orientation characteristic map to determine a match therewith based upon the first and second probability distribution functions.

Abstract: A finger biometric sensor may include a thin film substrate, a thin film transistor (TFT) layer on the thin film substrate, and an array of electric field sensing electrodes adjacent the TFT layer for receiving a finger adjacent thereto. The TFT layer may include a plurality of TFTs defining a respective TFT amplifier stage for each electric field sensing electrode. The sensor may further include a finger excitation electrode adjacent the array of electric field sensing electrodes, and at least one integrated circuit adjacent the thin film substrate. The integrated circuit may include a monocrystalline substrate and processing circuitry adjacent the monocrystalline substrate and connected to the TFT amplifier stages.